JP3761687B2 - Method for removing material adhering melt during piercing - Google Patents
Method for removing material adhering melt during piercing Download PDFInfo
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- JP3761687B2 JP3761687B2 JP26004297A JP26004297A JP3761687B2 JP 3761687 B2 JP3761687 B2 JP 3761687B2 JP 26004297 A JP26004297 A JP 26004297A JP 26004297 A JP26004297 A JP 26004297A JP 3761687 B2 JP3761687 B2 JP 3761687B2
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Description
【0001】
【発明の属する技術分野】
この発明は、板材等のレーザー加工における、ピアス加工時の材料表面付着溶融物除去方法に関する。
【0002】
【従来の技術】
板材等のレーザー加工では、切断加工のスタート時に微小な穴を貫通加工するピアス加工を行うのが通例である。
【0003】
【発明が解決しようとする課題】
然しながら、上述の従来例では、材料や加工法が多様化する中で、材料の種類に関わらず大なり小なり発生する課題ではあるが、特にアルミ材の切断加工におけるピアス加工時や、ステンレス材のクリーンカット加工におけるピアス加工時において、金属溶融物がピアス穴の周辺に髭状(以下ひげ状と記す)または山状に盛り上がったように付着し、▲1▼センサーノズルと金属溶融物とが接触し電気的導通状態となり、倣いセンサーのセンシング異常、▲2▼板厚の変化、▲3▼切断経路上の材料の変質、等が切断不良などの加工ミスの原因となっており、またピアス加工時のアシストガスを高圧にして金属溶融物付着部分に吹きつける方法もあるが、上方から押しつけるような形となりピアス穴からアシストガスが抜けてしまい効果が得られず、なおまた、加工用の倣いセンサーノズルと別に横方向からエアブローノズルにより吹き飛ばそうとしてもピアス穴の手前側には効果があっても、反対の向こう側には効果がなく、更にピアス加工前に被加工材のピアス加工点へオイルを塗布し、金属溶融物の付着を軽減するという事例もあるがトラブルを解消するまでには至っていないという課題がある。
【0004】
この発明は、上述の点に着目して成されたもので、加工ヘッドのノズルに旋回円運動を与え、レーザービームとアシストガスの出力をコントロールしピアス加工時に発生する金属溶融物を除去することができ、加工不良率を減少または防止できるピアス加工時の材料表面付着溶融物除去方法を提供することを目的とする。
【0005】
【課題を解決するための手段】
この発明は、下記構成を備えることにより上記課題を解決できるものである。
(1) 板材等のレーザー加工において、レーザー光の出力とアシストガスの圧力を制御し加工ヘッドのノズルを旋回させて切断加工のスタートの際に行うピアス加工時に発生する材料表面に付着する金属溶融物を除去可能とする加工ヘッドのノズル操作方法を加工工程中に組み込んだことを特徴とするピアス加工時の材料表面付着溶融物除去方法。
【0006】
(2) 加工ヘッドのノズル操作方法は、ピアス位置を中心に前記加工ヘッドのノズルに溶融付着物の外周縁よりも大きな旋回円運動を与え、アシストガスを高圧噴射させて材料表面に付着する金属溶融物を吹き飛ばして除去することを特徴とする前項(1)記載のピアス加工時の材料表面付着溶融物除去方法。
【0007】
(3) 加工ヘッドのノズル操作方法は、ピアス位置を中心に前記加工ヘッドのノズルに微小旋回円運動を与え、レーザービームの出力を抑制、制御してピアス近傍の金属溶融物のみを切断しながらアシストガスの噴射圧力を制御して前記金属溶融物を吹き飛ばし除去することを特徴とする前項(1)記載のピアス加工時の材料表面付着溶融物除去方法。
【0008】
【発明の実施の形態】
以下にこの発明の実施の形態を説明する。
【0009】
図1は、この発明に係るピアス加工及び金属溶融付着物除去フローチャート、図2は加工ヘッドの要部構成及びピアス加工時の状況を示す側断面図、図3はピアス穴を始点とした通常加工経路の例を示す平面図、図4(a)はひげ状溶融物の付着状況とアシストガスの流れの状況を示す側断面拡大図、同(b)はノズルの旋回円運動の軌跡を溶融物の外周縁よりも大きな円とし、アシストガスによるひげ状溶融物を吹き飛ばし除去している状況を示す側断面拡大図、同(c)はノズルの旋回円運動の軌跡を溶融物の外周縁よりも大きな円とした場合を示す平面拡大図、図5(a)はノズルの微小旋回円運動の軌跡と溶融付着物を切断しながら吹き飛ばし除去している状況を示す側断面拡大図、同(b)は図5(a)の大きさを示す平面拡大図、図6(a)、(b)はレーザー加工ヘッドの例として外観側面及び作用軸を示す説明図である。
【0010】
図面について説明すれば、1は加工ヘッド、2はセンサーノズル部、Lは集光レンズであって、発振器(図示せず)から伝搬されたレーザー光LBを集光レンズLにより収束して加工点に向けて集光し、アシストガスGは加工ヘッドの接続部より導入され、加工点へ照射されるレーザー光LBを包むようにして噴射される。gはギャップであって、ワークWとセンサーノズル部2の先端との設定距離を示す。
【0011】
なお、センサーノズル部2はアシストガスの絞り込み等の調節及びワークWとのノズルギャップを感知して調節する機能を備えている。
【0012】
(実施例1)
切断加工の始点となるピアス加工の際に発生する金属溶融物がピアス穴の内側周縁部に溶着部を形成して、ひげ状(図4(a))または山状に付着する。
【0013】
この金属溶融付着物を除去するために、倣いセンサーをOFFの状態に、またはセンサーアラームを無視して、図4(b)のノズルの旋回円運動軌跡に示すようにセンサーノズル部2をピアス穴の周縁近傍に付着する溶融付着物の外周縁よりも大きめな円に沿って前記ピアス穴を中心にして旋回円運動をしながらアシストガスを高圧にして吹き付け、円軌道を一周することによって、溶融付着物に対し外周からピアス穴の中心に向かって逆流(図4(a))の高圧ガスが生じ前記溶融付着物は剥離し易くなって除去することができる(図4(b)参照)。そして倣いセンサーをONの状態にして通常の切断加工を行うことができる。
【0014】
(実施例2)
倣いセンサーをOFFの状態に、またはセンサーアラームを無視して、図5(b)のレーザーヘッド経路に示すように、センサーノズル部2をピアス穴を中心にピアス穴の外周近傍を旋回するように微小円運動させ、微小円軌道を一周して、ピアス穴周縁に付着する溶融物の根元となる溶着部近傍で、レーザー光LBを、けがき加工程度の低出力で照射して溶着物のみを切断しながらアシストガスGを噴射し、切断済の溶着片及び残った微小片を吹き飛ばし除去することができる(図5(a)、(b)参照)。
【0015】
そして前述と同様に、倣いセンサーをONにして通常の切断加工を行うことができる。
【0016】
次に、図1に示したピアス加工及び金属溶融付着物除去フローチャートに従って動作を説明する。
【0017】
S1はピアス加工実施のステップであって、設定されたギャップgでピアス加工が行われ、ステップS2でピアス加工点に溶融付着物が有るか、の判断をし、溶融付着物が有ると判断された場合は、ステップS3へ進みZ軸(加工ヘッドの上下方向)倣いセンサーをOFFに設定し、ステップS4でノズルと溶融付着物との接触を防ぐためZ軸に沿って加工ヘッド1のノズルを数ミリ上げ、ステップS5へ進みレーザー光を出力するか、の判断で、レーザー光を出力しないと判断した場合は、ステップS6でアシストガスGの種類と圧力を設定するが、アシストガスGの圧力は通常は高圧に設定する。次いでステップS7でノズルの旋回円運動を設定するが、この場合は溶融付着物の外周縁よりも大きめの円でピアス穴を中心に旋回するように、旋回半径を設定する。ステップS8でノズルを旋回させながら高圧ガスを噴射し一周して溶融付着物の外周側からピアス穴の中心に向って逆流するガス流によって付着物を吹き飛ばし溶融付着物の除去操作は終了する。次のステップS9で停止してあったレーザー光LBの出力を復帰させ、次のステップS15へ進み、ここでノズルをピアス加工点まで戻し、ステップS16でZ軸倣いセンサーをONに戻し、加工ヘッド1の上下方向の倣いセンサー機能を生かし、次のステップS17で通常のアプローチ加工から経路切断操作へと移り、次工程へ進む。
【0018】
一方ステップS5で、レーザー光LBを出力する、とした場合は、ステップS10へ進み、溶融付着物のみを切断するため、レーザー光LBの出力を、けがき加工程度の低出力に設定し、次いでステップS11でアシストガスGの種類と圧力を設定するが、この場合も前述のステップS6の場合と同様に圧力はやや高圧側に設定する、そしてステップS12でノズルの旋回円運動の設定をするが、溶融付着物が、ひげ状の場合は溶着部がピアス穴の上部周縁に位置するためピアス穴の大きさよりも僅かに大き目の円で旋回するようにピアス穴を中心に微小旋回半径を設定し、次のステップS13で、低出力のレーザー光LBを照射し、且つアシストガスGを噴射しながら加工ヘッド1のノズルが微小旋回し一周して付着物の切断及び吹き飛ばし除去を行う、付着物の除去操作が終わると、ステップS14でレーザーLBの出力を元に戻し、前述と同様に、次のステップS15へ進み、ここでノズルをピアス加工点まで戻し、ステップS16でZ軸倣いセンサーをONに戻し、加工ヘッド1の上下方向の倣いセンサー機能を生かし、次のステップS17で通常のアプローチ加工から経路切断操作へと移り、次工程へ進む。
【0019】
なお、SS材等の連続発振(CW:Continuous Wave ) ピアス加工時は、アシストガスを吹き付けることで付着物を除去可能の場合もあり、なおまた、ひげ状付着物、山状付着物等、溶融付着物の程度によりレーザー光LBの経路を形成するノズルの旋回半径、レーザー光LBの出力、アシストガスの種類(通常はエアで十分である)及び圧力をケースバイケースで選択自在であることは勿論である。
【0020】
【発明の効果】
この発明によれば、加工ヘッドのノズルに旋回円運動を与え、レーザービームとアシストガスの出力をコントロールし、ピアス加工時に発生する金属溶融物を除去することができ、加工不良率を減少または防止できるという効果を呈する。
【図面の簡単な説明】
【図1】 この発明に係るピアス加工及び金属溶融付着物除去フローチャート
【図2】 加工ヘッドの要部構成及びピアス加工時の状況を示す側断面図
【図3】 ピアス穴を始点とした通常加工経路の例を示す平面図
【図4】 (a)ひげ状溶融物の付着状況とアシストガスの流れの状況を示す側断面拡大図、同(b)ノズルの旋回円運動の軌跡を溶融物の外周縁よりも大きな円とし、アシストガスによるひげ状溶融物を吹き飛ばし除去している状況を示す側断面拡大図、同(c)ノズルの旋回円運動の軌跡を溶融物の外周縁よりも大きな円とした場合を示す平面拡大図
【図5】 (a)ノズルの微小旋回円運動の軌跡と溶融付着物を切断しながら吹き飛ばし除去している状況を示す側断面拡大図、同(b)図5(a)の大きさを示す平面拡大図
【図6】 (a)、(b)レーザー加工ヘッドの例として外観側面及び作用軸を示す説明図
【符号の説明】
1 加工ヘッド
2 センサーノズル部
G アシストガス
g ギャップ
LB レーザー光
L 集光レンズ
W ワーク[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a material surface adhering melt removal method during piercing in laser processing of a plate material or the like.
[0002]
[Prior art]
In laser processing of a plate material or the like, it is usual to perform piercing processing that penetrates a minute hole at the start of cutting processing.
[0003]
[Problems to be solved by the invention]
However, in the above-mentioned conventional example, while the materials and processing methods are diversified, it is a problem that occurs more or less regardless of the type of material, but especially during piercing processing of aluminum material, stainless steel material At the time of piercing in the clean cut processing of the metal melt, the metal melt adheres to the periphery of the piercing hole as if it swelled in a bowl shape (hereinafter referred to as a whisker shape) or a mountain shape, and (1) the sensor nozzle and metal melt Contact and electrical continuity, abnormal sensing of the scanning sensor, (2) change in plate thickness, (3) material change on the cutting path, etc. cause processing errors such as defective cutting, and piercing. There is also a method of increasing the pressure of the assist gas during processing and spraying it on the metal melt adhesion part, but it becomes a form of pressing from above and the assist gas escapes from the pierced hole, which is effective. In addition, even if it tries to blow away from the scanning sensor nozzle from the lateral direction by the air blow nozzle from the side, it is effective on the front side of the pierced hole, but it is not effective on the opposite side, and further before piercing processing However, there is a case where oil is applied to the piercing point of the workpiece to reduce the adhesion of the metal melt, but there is a problem that the problem has not yet been solved.
[0004]
The present invention has been made by paying attention to the above-mentioned points, and applies a circular motion to the nozzle of the machining head, controls the output of the laser beam and the assist gas, and removes the metal melt generated during the piercing process. An object of the present invention is to provide a material surface adhesion melt removal method during piercing which can reduce or prevent the processing defect rate.
[0005]
[Means for Solving the Problems]
The present invention can solve the above problems by providing the following configuration.
(1) In laser processing of plate materials, etc., metal fusion that adheres to the material surface that occurs during piercing when the cutting head is started by turning the nozzle of the processing head by controlling the laser light output and assist gas pressure A material surface adhering melt removal method during piercing processing, wherein a nozzle operating method of a processing head that enables removal of an object is incorporated in a processing step.
[0006]
(2) The nozzle of the machining head is a metal that adheres to the surface of the material by giving a swirl circular motion larger than the outer peripheral edge of the melted deposit to the nozzle of the machining head around the piercing position and injecting an assist gas at a high pressure. The material surface adhesion melt removal method at the time of the piercing process according to item (1), wherein the melt is blown off and removed.
[0007]
(3) The nozzle operation method of the machining head is such that a minute swirl circular motion is given to the nozzle of the machining head around the piercing position, and the laser beam output is suppressed and controlled to cut only the metal melt near the piercing. The material surface adhering melt removing method during piercing as described in (1) above, wherein the metal melt is blown off by controlling the injection pressure of the assist gas.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below.
[0009]
FIG. 1 is a piercing process and a metal melt deposit removal flowchart according to the present invention, FIG. 2 is a side sectional view showing a main part configuration of the machining head and the situation during piercing, and FIG. 3 is a normal machining starting from a piercing hole. 4A is a plan view showing an example of the path, FIG. 4A is an enlarged side cross-sectional view showing the adhesion state of the whisker-like melt and the flow state of the assist gas, and FIG. 4B is a diagram showing the trajectory of the swirling circular motion of the nozzle. The enlarged cross-sectional side view showing the situation where the whisker-like melt by the assist gas is blown off and removed, and (c) shows the trajectory of the swirling circular movement of the nozzle from the outer circumference of the melt. FIG. 5A is an enlarged plan view showing a case where a large circle is formed. FIG. 5A is an enlarged side cross-sectional view showing a trace of the fine swirl circle movement of the nozzle and a situation in which the molten deposit is blown off and removed. Is an enlarged plan view showing the size of FIG. FIG 6 (a), (b) is an explanatory diagram showing the external side and the operating shaft Examples of the laser processing head.
[0010]
Referring to the drawings, 1 is a machining head, 2 is a sensor nozzle, L is a condenser lens, and a laser beam LB propagated from an oscillator (not shown) is converged by the condenser lens L to be machined. The assist gas G is introduced from the connecting portion of the processing head, and injected so as to wrap the laser beam LB irradiated to the processing point. g is a gap and indicates a set distance between the workpiece W and the tip of the
[0011]
The
[0012]
Example 1
The metal melt generated at the time of piercing that is the starting point of the cutting process forms a welded portion at the inner peripheral edge of the pierced hole, and adheres in a whisker shape (FIG. 4A) or a mountain shape.
[0013]
In order to remove the metal melt deposit, the scanning sensor is turned off or the sensor alarm is ignored, and the
[0014]
(Example 2)
The scanning sensor is turned off or the sensor alarm is ignored, and the
[0015]
In the same manner as described above, the copying sensor can be turned on to perform normal cutting.
[0016]
Next, the operation will be described according to the piercing process and the metal melt deposit removal flowchart shown in FIG.
[0017]
S1 is a step of performing piercing, and piercing is performed at the set gap g. In step S2, it is determined whether there is a molten deposit at the piercing point, and it is determined that there is a molten deposit. If this is the case, the process proceeds to step S3, the Z-axis (up-down direction of the machining head) scanning sensor is set to OFF, and the nozzle of the machining head 1 is moved along the Z-axis to prevent contact between the nozzle and the molten deposit in step S4. If it is determined that the laser beam is not output when it is determined whether the laser beam is output by proceeding to step S5, the type and pressure of the assist gas G are set in step S6. Is usually set to high pressure. Next, in step S7, the turning circle motion of the nozzle is set. In this case, the turning radius is set so as to turn around the pierced hole with a circle larger than the outer peripheral edge of the molten deposit. In step S8, the high-pressure gas is injected while turning the nozzle, and the deposit is blown off by the gas flow that makes a round and flows backward from the outer peripheral side of the melt deposit toward the center of the pierce hole, and the operation for removing the melt deposit is completed. The output of the laser beam LB stopped in the next step S9 is restored, and the process proceeds to the next step S15, where the nozzle is returned to the piercing processing point, the Z-axis scanning sensor is turned ON in step S16, and the processing head Taking advantage of the scanning sensor function of 1 in the vertical direction, in the next step S17, the routine shifts from the normal approach processing to the path cutting operation and proceeds to the next step.
[0018]
On the other hand, if the laser beam LB is output in step S5, the process proceeds to step S10, and the laser beam LB output is set to a low level of scribing to cut only the melted deposit. In step S11, the type and pressure of the assist gas G are set. In this case as well, in the same manner as in step S6 described above, the pressure is set slightly higher, and in step S12, the swirling circular movement of the nozzle is set. When the melted deposit is whisker-shaped, the welding part is located at the upper peripheral edge of the pierced hole, so that a small turning radius is set around the pierced hole so that the welded part is turned slightly larger than the size of the pierced hole. Then, in the next step S13, the nozzle of the machining head 1 makes a small turn while making the assist gas G and irradiating the low-power laser beam LB, and cutting and blowing off the deposits. When the removal operation for removing the adhered matter is completed, the output of the laser LB is returned to the original in step S14, and the process proceeds to the next step S15 as described above, where the nozzle is returned to the piercing point, and in step S16. The Z-axis scanning sensor is turned ON, and the vertical scanning sensor function of the machining head 1 is utilized to move from the normal approach machining to the path cutting operation in the next step S17, and proceed to the next process.
[0019]
During continuous wave (CW) piercing processing of SS materials, etc., there are cases in which deposits can be removed by blowing assist gas, and beard-like deposits, mountain-like deposits, etc. can be melted. The turning radius of the nozzle that forms the path of the laser beam LB, the output of the laser beam LB, the type of assist gas (usually air is sufficient), and the pressure can be selected on a case-by-case basis depending on the degree of deposits. Of course.
[0020]
【The invention's effect】
According to the present invention, a turning circular motion is given to the nozzle of the processing head, the output of the laser beam and the assist gas is controlled, and the metal melt generated during the piercing processing can be removed, thereby reducing or preventing the processing defect rate. It has the effect of being able to.
[Brief description of the drawings]
FIG. 1 is a piercing process and a metal melt deposit removal flowchart according to the present invention. FIG. 2 is a side sectional view showing the main part configuration of the machining head and the situation at the time of piercing. FIG. 4 is a plan view showing an example of the path. FIG. 4A is an enlarged side cross-sectional view showing the state of adhesion of the whisker-like melt and the flow of the assist gas, and FIG. 4B is the trajectory of the swirling circular motion of the nozzle. An enlarged side cross-sectional view showing a situation in which the whisker-like melt by the assist gas is blown away and removed, and (c) a circle having a trajectory of the swirling circular motion of the nozzle larger than the outer circumference of the melt. [FIG. 5] (a) An enlarged side sectional view showing a trace of a fine swirl circular movement of a nozzle and a situation in which a molten deposit is blown off and removed, (b) FIG. Plane enlargement showing the size of (a) 【 6] (a), (b) diagram illustrating the external side and the operating shaft Examples of the laser processing head EXPLANATION OF REFERENCE NUMERALS
1
Claims (3)
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JP26004297A JP3761687B2 (en) | 1997-09-25 | 1997-09-25 | Method for removing material adhering melt during piercing |
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JP26004297A JP3761687B2 (en) | 1997-09-25 | 1997-09-25 | Method for removing material adhering melt during piercing |
Publications (2)
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JPH1190670A JPH1190670A (en) | 1999-04-06 |
JP3761687B2 true JP3761687B2 (en) | 2006-03-29 |
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JP26004297A Expired - Fee Related JP3761687B2 (en) | 1997-09-25 | 1997-09-25 | Method for removing material adhering melt during piercing |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019176379A1 (en) | 2018-03-12 | 2019-09-19 | 株式会社アマダホールディングス | Laser processing machine and laser processing method |
WO2020246354A1 (en) | 2019-06-05 | 2020-12-10 | 株式会社アマダ | Processing program creation device, method for determining scattering direction of molten metal, laser processing machine, and laser processing method |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1623790B1 (en) * | 2004-08-06 | 2008-12-10 | Trumpf Werkzeugmaschinen GmbH + Co. KG | Laser machining head |
WO2006132229A1 (en) | 2005-06-07 | 2006-12-14 | Nissan Tanaka Corporation | Laser piercing method and machining equipment |
JP5063960B2 (en) * | 2006-04-07 | 2012-10-31 | 日酸Tanaka株式会社 | Laser piercing method and processing apparatus |
JP5986775B2 (en) * | 2012-03-30 | 2016-09-06 | 日酸Tanaka株式会社 | Laser processing method and laser processing apparatus |
DE102013210844B3 (en) | 2013-06-11 | 2014-09-25 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | A method of forming a through hole in a metallic workpiece, laser processing machine, and computer program product |
-
1997
- 1997-09-25 JP JP26004297A patent/JP3761687B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019176379A1 (en) | 2018-03-12 | 2019-09-19 | 株式会社アマダホールディングス | Laser processing machine and laser processing method |
WO2020246354A1 (en) | 2019-06-05 | 2020-12-10 | 株式会社アマダ | Processing program creation device, method for determining scattering direction of molten metal, laser processing machine, and laser processing method |
Also Published As
Publication number | Publication date |
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JPH1190670A (en) | 1999-04-06 |
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