JPS62122339U - - Google Patents
Info
- Publication number
- JPS62122339U JPS62122339U JP1986010501U JP1050186U JPS62122339U JP S62122339 U JPS62122339 U JP S62122339U JP 1986010501 U JP1986010501 U JP 1986010501U JP 1050186 U JP1050186 U JP 1050186U JP S62122339 U JPS62122339 U JP S62122339U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- solder
- mounting apparatus
- lead frame
- element mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986010501U JPS62122339U (enExample) | 1986-01-27 | 1986-01-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986010501U JPS62122339U (enExample) | 1986-01-27 | 1986-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62122339U true JPS62122339U (enExample) | 1987-08-03 |
Family
ID=30796851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986010501U Pending JPS62122339U (enExample) | 1986-01-27 | 1986-01-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62122339U (enExample) |
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1986
- 1986-01-27 JP JP1986010501U patent/JPS62122339U/ja active Pending