JPH0195790U - - Google Patents

Info

Publication number

JPH0195790U

JPH0195790U JP19226987U JP19226987U JPH0195790U JP H0195790 U JPH0195790 U JP H0195790U JP 19226987 U JP19226987 U JP 19226987U JP 19226987 U JP19226987 U JP 19226987U JP H0195790 U JPH0195790 U JP H0195790U

Authority

JP

Japan

Prior art keywords

integrated circuit

hybrid integrated

base fin

circuit device

circuit board

Prior art date

1987-12-17

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229910000679 solder Inorganic materials 0.000 claims description 4
• 229910052751 metal Inorganic materials 0.000 claims description 2
• 239000002184 metal Substances 0.000 claims description 2
• 238000010438 heat treatment Methods 0.000 claims 1
• 235000011837 pasties Nutrition 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 3
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 229910052782 aluminium Inorganic materials 0.000 description 1
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
• 239000000919 ceramic Substances 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 229920001296 polysiloxane Polymers 0.000 description 1
• 239000000758 substrate Substances 0.000 description 1