JPS62122259A - Function trimming method of thin film hybrid integrated circuit - Google Patents

Function trimming method of thin film hybrid integrated circuit

Info

Publication number
JPS62122259A
JPS62122259A JP60261032A JP26103285A JPS62122259A JP S62122259 A JPS62122259 A JP S62122259A JP 60261032 A JP60261032 A JP 60261032A JP 26103285 A JP26103285 A JP 26103285A JP S62122259 A JPS62122259 A JP S62122259A
Authority
JP
Japan
Prior art keywords
thick film
resistor
resistors
hybrid integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60261032A
Other languages
Japanese (ja)
Inventor
Masaki Kamiakutsu
上圷　政記
Kiyoshi Matsuda
清 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60261032A priority Critical patent/JPS62122259A/en
Publication of JPS62122259A publication Critical patent/JPS62122259A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Abstract

PURPOSE:To make it possible to cut a thick film resistor with laser and the like as required, by providing a parallel connecting circuits of the thick film resistor and a resistor having a surface, as a function trimming resistor between the stages of electric circuits. CONSTITUTION:On an insulating substrate 6 made of ceramics and the like, a thick film conductor 5 and a thick film resistor 2 are formed. Thereafter, the value of the thick film resistor 2 is adjusted to the desired value with laser and the like at a resistance value adjusting part 9. A resistor having a surface 3 and a discrete part 4 are soldered, and a thick film hybrid integrated circuit is formed. Resistors R1 and R2 are connected in parallel. Resistors R3 and R4 are connected in parallel. The circuit is made to be an operating state. When the electric characteristics are deviated from intended values, the resistors R1 or R3 is cut at a resistor cutting place 8 or 9, and the intended values of the electric characteristics are obtained. The resistance values of the resistors R1-F4 are adjusted. The electric characteristics can be adjusted accurately to the intended values. The occupying areas of the resistors required for function trimming can be made small.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は、厚膜混成集積回路の機能トリミング方法に係
り、特に、実装密度の向上を計る厚膜混成集積回路に使
用して好適な機能トリミング方法に関するものである。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a function trimming method for thick film hybrid integrated circuits, and in particular, a function trimming method suitable for use in thick film hybrid integrated circuits to improve packaging density. It is about the method.

〔発明の背景〕[Background of the invention]

厚膜混成集積回路の機能トリミング方法の１つの手段と
して、抵抗を並列に接続して８き、電気的特性が、目標
値に入っていない場合、並列接続された一万の抵抗を切
断して調整する方法がある。前記した抵抗は、電気的特
性が所望の値変化する様に抵抗値を調整しておかなけれ
ばならない。特公昭３８−１２４３８号公報に記載され
た方法においては、厚膜混成集積回路とした場合、各素
子を所望の値に調整することに関しての問題な認識して
いないっ 第３図に、厚膜混成集積回路の股間に設ける機能トリミ
ング用抵抗体を示す。第３図において、厚膜抵抗体Ｒ１
，）Ｌｚは、抵抗値を所望の値に合わせる事が出来ない
。つ才り、電気的特性を目標値にするため抵抗体Ｒ１を
切断しても、電気的特性が目標値に合わない。そこで、
各抵抗の値を合わせる必要がある。そのためには、抵抗
体Ｒ２を２本に分割し、第１の抵抗体Ｈ，ｚＡＪ２の抵
抗体ＬＬ２Ｂとし各抵抗体の抵抗値を合わせる手法が考
えられる。この場合、抵抗体を形成する面積を広く必要
とする。加えて第４図に示すように、測定端子７も必要
となり、厚膜混成集積回路の実装密度を低下させるとい
う欠点が有る。One way to trim the functions of thick film hybrid integrated circuits is to connect 8 resistors in parallel, and if the electrical characteristics do not fall within the target value, disconnect the 10,000 resistors connected in parallel. There are ways to adjust it. The resistance value of the above-mentioned resistor must be adjusted so that the electrical characteristics change to a desired value. The method described in Japanese Patent Publication No. 38-12438 does not recognize the problem of adjusting each element to a desired value when forming a thick film hybrid integrated circuit. A functional trimming resistor provided between the crotches of a hybrid integrated circuit is shown. In FIG. 3, thick film resistor R1
, )Lz cannot adjust the resistance value to the desired value. Even if the resistor R1 is cut to bring the electrical characteristics to the target value, the electrical characteristics will not match the target value. Therefore,
It is necessary to match the values of each resistor. For this purpose, a method can be considered in which the resistor R2 is divided into two, the first resistor H and the resistor LL2B of zAJ2 are set, and the resistance values of each resistor are matched. In this case, a large area is required to form the resistor. In addition, as shown in FIG. 4, a measurement terminal 7 is also required, which has the disadvantage of reducing the packaging density of the thick film hybrid integrated circuit.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、実装’ｉ！Ｆ度の高い厚膜混成集積回
路の機能上ＩＪ　ミング方法を提供することにある。The purpose of the invention is to implement 'i! It is an object of the present invention to provide a functional IJ mining method for a thick film hybrid integrated circuit with a high degree of F.

〔発明ａ）概要〕[Invention a) Overview]

本発明は、電気回路の段間に機能トリミング用抵抗体と
して、厚膜抵抗体と面付抵抗体の並列接続回路を設け、
必要に応じて前記、厚膜抵抗体をレーザー等により切断
するものである。The present invention provides a parallel connection circuit of a thick film resistor and a surface-mounted resistor as a functional trimming resistor between stages of an electric circuit,
If necessary, the thick film resistor is cut by a laser or the like.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明を実施例により説明する。 The present invention will be explained below with reference to Examples.

第１図に、本発明による一実施例の平面図、第２図に、
第１図の回路図を示す。以下、第１図、第２図により説
明する。セラミック等の絶縁基板６上に、厚膜導体５、
厚膜抵抗体２を形成した後、厚膜抵抗体２を所望の値に
レーザー等により、抵抗値調整箇所９で合わせ１面付抵
抗体３１個別部品４を半田付して、厚膜混成集積回路を
形成する。抵抗体Ｒ１，凡２は並列に接続され、抵抗体
凡３．凡４は、並列接続となっている。FIG. 1 is a plan view of an embodiment of the present invention, and FIG.
The circuit diagram of FIG. 1 is shown. This will be explained below with reference to FIGS. 1 and 2. A thick film conductor 5 is placed on an insulating substrate 6 made of ceramic or the like.
After forming the thick film resistor 2, the one-sided resistor 31 and individual parts 4 are soldered together at the resistance adjustment point 9 using a laser or the like to set the thick film resistor 2 to a desired value, thereby forming a thick film hybrid integration. form a circuit. The resistors R1 and R2 are connected in parallel, and the resistors R1 and R2 are connected in parallel. Ordinary 4 is connected in parallel.

回路を動作状態にしたのち、電気的特性が目標値よりず
れていた場合には抵抗体比１又はｋＬ３を抵抗体切断箇
所８，９より切断し、電気的特性を目標値とする。抵抗
体Ｒ１〜１モ４は抵抗値が調整されて３つ、電気的特性
が正確に目標に合わせる事が出来かつ、機能トリミング
に必要な抵抗体の占有面積を少さくする事が出来る。After the circuit is brought into operation, if the electrical characteristics deviate from the target value, the resistor ratio 1 or kL3 is disconnected from the resistor cutting points 8 and 9, and the electrical characteristics are set to the target value. The resistance values of the three resistors R1 to R1Mo4 are adjusted so that the electrical characteristics can be precisely matched to the target, and the area occupied by the resistors required for functional trimming can be reduced.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、電気回路の股間に入わた機能トリミン
グ用抵抗の抵抗値を予め正確に合わせる事が出来、機能
トリミングにより、電気的特性を正確に目標値に合わせ
る事が出来るため、歩留向上する。又、厚膜抵抗体と面
付抵抗体により機能トリミング用抵抗体を形成するため
占有面積も少なくなり、実装密度が向上する効果が有る
。According to the present invention, the resistance value of the functional trimming resistor inserted between the crotches of the electrical circuit can be accurately adjusted in advance, and the electrical characteristics can be accurately adjusted to the target value through functional trimming, resulting in improved yield. improves. Furthermore, since the functional trimming resistor is formed by a thick film resistor and a surface-mounted resistor, the occupied area is reduced, which has the effect of improving the packaging density.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の実施例の平面図、第２図は第１図の回
路図、第３図、第４図は従来の機能トリミング用抵抗の
平面図である。 １・・・端子　　　　　　３・・・面付抵抗体４・・・
個別部品　　　　５・・・厚膜導体６・・・絶縁基板　
　　　９・・・抵抗値調整箇所第　１　口 躬　２囚FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a circuit diagram of FIG. 1, and FIGS. 3 and 4 are plan views of a conventional functional trimming resistor. 1... Terminal 3... Surface-mounted resistor 4...
Individual parts 5...Thick film conductor 6...Insulating substrate
9...Resistance value adjustment point 1. Mistake 2.

Claims (1)

【特許請求の範囲】[Claims] 　セラミック等の絶縁基板上へ厚膜導体、厚膜抵抗体を
形成後に個別部品を半田付けしたのちに、回路を動作状
態にし、電気的特性を目標値に調整する機能トリミング
を有する厚膜混成集積回路において、電気回路の段間に
厚膜抵抗体と面付抵抗体の並列回路を設けておき、電気
的特性が、目標値に合っていない場合、前記厚膜抵抗体
をレーザー等で切断し、電気的特性を目標値に合わせる
事を特徴とする厚膜混成集積回路の機能トリミング方法
。Thick film hybrid integration with functional trimming that allows the circuit to be activated and adjust the electrical characteristics to target values after forming thick film conductors and thick film resistors on an insulating substrate such as ceramic and soldering the individual components. In the circuit, a parallel circuit of a thick film resistor and a surface-mounted resistor is provided between the stages of the electric circuit, and if the electrical characteristics do not match the target value, the thick film resistor is cut with a laser or the like. , a functional trimming method for thick film hybrid integrated circuits characterized by adjusting electrical characteristics to target values.
JP60261032A 1985-11-22 1985-11-22 Function trimming method of thin film hybrid integrated circuit Pending JPS62122259A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60261032A JPS62122259A (en) 1985-11-22 1985-11-22 Function trimming method of thin film hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60261032A JPS62122259A (en) 1985-11-22 1985-11-22 Function trimming method of thin film hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS62122259A true JPS62122259A (en) 1987-06-03

Family

ID=17356103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60261032A Pending JPS62122259A (en) 1985-11-22 1985-11-22 Function trimming method of thin film hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS62122259A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0543430A2 (en) * 1991-11-20 1993-05-26 Delco Electronics Corporation Pressure sensor and method of assembly thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0543430A2 (en) * 1991-11-20 1993-05-26 Delco Electronics Corporation Pressure sensor and method of assembly thereof

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