JPS62116580U - - Google Patents
Info
- Publication number
- JPS62116580U JPS62116580U JP407886U JP407886U JPS62116580U JP S62116580 U JPS62116580 U JP S62116580U JP 407886 U JP407886 U JP 407886U JP 407886 U JP407886 U JP 407886U JP S62116580 U JPS62116580 U JP S62116580U
- Authority
- JP
- Japan
- Prior art keywords
- molten solder
- solder suction
- printed circuit
- circuit board
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP407886U JPS62116580U (US08063081-20111122-C00044.png) | 1986-01-17 | 1986-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP407886U JPS62116580U (US08063081-20111122-C00044.png) | 1986-01-17 | 1986-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62116580U true JPS62116580U (US08063081-20111122-C00044.png) | 1987-07-24 |
Family
ID=30784421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP407886U Pending JPS62116580U (US08063081-20111122-C00044.png) | 1986-01-17 | 1986-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62116580U (US08063081-20111122-C00044.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013026564A (ja) * | 2011-07-25 | 2013-02-04 | Japan Radio Co Ltd | 段付き配線板 |
| WO2017203559A1 (ja) * | 2016-05-23 | 2017-11-30 | 新電元工業株式会社 | プリント基板の接合方法、電子装置およびその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS603190A (ja) * | 1983-06-20 | 1985-01-09 | 松下電器産業株式会社 | プリント基板の接続方法 |
-
1986
- 1986-01-17 JP JP407886U patent/JPS62116580U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS603190A (ja) * | 1983-06-20 | 1985-01-09 | 松下電器産業株式会社 | プリント基板の接続方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013026564A (ja) * | 2011-07-25 | 2013-02-04 | Japan Radio Co Ltd | 段付き配線板 |
| WO2017203559A1 (ja) * | 2016-05-23 | 2017-11-30 | 新電元工業株式会社 | プリント基板の接合方法、電子装置およびその製造方法 |
| JPWO2017203559A1 (ja) * | 2016-05-23 | 2018-06-07 | 新電元工業株式会社 | プリント基板の接合方法、電子装置およびその製造方法 |
| US11032907B2 (en) | 2016-05-23 | 2021-06-08 | Shindengen Electric Manufacturing Co., Ltd. | Manufacturing method for electronic apparatus with case in which printed boards joined to each other are stored |
