JPS62115739A - Be-erecting device for semiconductor substrate - Google Patents

Abstract

PURPOSE:To make rolling dies pitch adjusting among housing grooves for a substrate housing precise, and to prevent the damage of wafers and the displacement of pitches on the pushing-up of the wafers by a wafer push-up rod by mounting a pair of wafer holding plates, to which grooves at the same pitches as the housing grooves are formed, in a displaceable manner in the direction orthogonal to the housing grooves for the housing. CONSTITUTION:When a pair of wafer holding plates 1, 1 are lowered and the holding plates 1, 1 are positioned with the upper edge of a carrier 3 by positioning plates 5, feed rods 6, 6 are handled respectively and the wafer holding plates 1 are displaced in the direction orthogonal to grooves for the carrier 1 and rolling dies pitch adjusting among the grooves is conducted when displacement is generated among the grooves of the wafer holding plates 1, 1 and the carrier 3. Wafers 2 are pushed up from the carrier 3 by a push-up rod 4, and the wafers are passed through a pair of the wafer holding plates 1 and re- erected to another carrier. Rolling dies pitch adjusting among the grooves is performed, and the wafers are re-erected, thus preventing the damage of the wafers on the pushing-up of the wafers.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor substrate (hereinafter referred to as a carrier) housed in a semiconductor substrate storage box (hereinafter referred to as a carrier) in a semiconductor substrate manufacturing process.
The present invention relates to a semiconductor substrate replacement device that replaces wafers (hereinafter referred to as wafers) to different carriers.

[Conventional technology]

Conventionally, this type of semiconductor substrate lifting device installed a pair of wafer holding plates facing each other at the opening edge of the carrier, each having grooves at the same pitch as the wafer storage grooves in the carrier, and pushing up the wafer in the carrier to separate the pair of wafers. It was passed through a holding plate and replaced with another carrier.

[Problem that the invention seeks to solve]

Conventionally, the positional relationship between the wafer holding plate and the carrier has been fixed and cannot be corrected. Therefore, if the carrier is incorrectly set or deformed when the wafer is set up, the wafer holding plate may be There is a problem that the pitch of the grooves between the plate and the carrier is misaligned, and when the wafer is pushed up by the wafer push-up rod, the wafer may be damaged or the pitch may be misaligned.

The present invention provides a semiconductor substrate uprighting device that can correct the positional relationship between a wafer holding plate and a carrier.

[Means for solving problems]

The present invention provides a semiconductor substrate handling device that passes a semiconductor substrate stored in a semiconductor substrate storage box between a pair of facing wafer holding plates to replace a different semiconductor substrate storage box. The semiconductor substrate reloading apparatus is characterized in that the pair of wafer holding plates provided with the grooves are each movable in a direction orthogonal to the storage groove of the storage box.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

In FIG. 1, the carrier 3 is provided with vertically oriented wafer storage grooves 3α on the inner walls facing each other, and the sea urchins 2 are stored vertically on the storage grooves. On the other hand, a pair of wafer holding plates 1.1 having grooves 1.alpha. at the same pitch as the wafer storage space of the carrier 3 are installed facing each other on both edges of the upper opening of the carrier 3.

A feed rod 6°6 for adjusting the position of the wafer holding plate 1 in the plate direction is horizontally attached to the back of each wafer holding plate 1, and the lower end of the wafer holding plate 1 slides onto the positioning plate 5. It can be held movably.

In the embodiment, when the pair of wafer holding plates 1 and 1 are lowered and aligned with the upper edge of the carrier 3 using the positioning plate 5, the grooves between the wafer holding plates 1 and the carrier 3 are aligned. If there is any misalignment, move the feed rod 6
, 6 to displace the wafer holding plate 1 in a direction perpendicular to the grooves of the carrier 3, thereby performing groove pitch alignment.

Thereafter, the wafer 2 is pushed up from the carrier 3 by the push-up rod 4, passed through a pair of urchin-holding plates 1, and transferred to another carrier. Since the groove pitch is adjusted and the wafer is turned over, the wafer will not be damaged when the wafer is pushed up.

〔Effect of the invention〕

As explained above, in the present invention, the pitch of the grooves between the wafer holding plate and the carrier is matched, so the pitch of the grooves is accurately matched, and wafer damage and pitch deviation when the wafer is pushed up by the wafer push-up rod can be prevented. It is effective.

[Brief explanation of drawings]

FIG. 1 is an external view showing an embodiment of the present invention.

Claims (1)

[Claims] (1) In a semiconductor substrate handling device that passes a semiconductor substrate stored in a semiconductor substrate storage box between a pair of facing wafer holding plates to transfer to a different semiconductor substrate storage box, the pitch is the same as the storage groove of the semiconductor substrate storage box. A semiconductor substrate stand-up apparatus characterized in that the pair of wafer holding plates provided with grooves are each displaceable in a direction orthogonal to the storage groove of the storage box.