JPH06101514B2 - Semiconductor substrate replacement device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention replaces a semiconductor substrate (hereinafter, referred to as a wafer) stored in a semiconductor substrate storage box (hereinafter, referred to as a carrier) with a different carrier in a semiconductor substrate manufacturing process. The present invention relates to a semiconductor substrate rearing device.

[Conventional technology]

Conventionally, this type of semiconductor substrate repositioning device has a pair of wafer holding plates provided with a groove having the same pitch as the wafer storage groove of the carrier, placed facing each other at the opening edge of the carrier and pushing up the wafer in the carrier to lift the pair of wafers. I was passing through the holding plate and replacing it with another carrier.

[Problems to be solved by the invention]

Conventionally, the positional relationship between the wafer holding plate and the carrier is fixed, and this cannot be corrected.Therefore, if the carrier set is bad or the carrier is deformed when the wafer is replaced, the wafer will be deformed. The groove pitch between the holding plate and the carrier is misaligned, and the wafer may be damaged or may be misaligned when the wafer is pushed down by the push-up bar of the wafer.

The present invention provides a semiconductor substrate replacement device that can correct the positional relationship between a wafer holding plate and a carrier.

[Means for solving problems]

In order to achieve the above object, in the semiconductor substrate rearing apparatus according to the present invention, a semiconductor substrate having a pair of wafer holding plates, the semiconductor substrate stored in the semiconductor substrate storage box is once received between the pair of wafer holding plates, and another A semiconductor substrate rearing device for switching to a semiconductor substrate storage box, wherein a pair of wafer holding plates are arranged facing each other, and have a groove having the same pitch as the storage groove of the semiconductor substrate storage box in the vertical direction on the opposite surfaces, It can move up and down, and each has a feed rod on the back side.The feed rod moves and adjusts the wafer holding plate along the direction of the row of the storage grooves of the semiconductor substrate storage box, and the pitch of the groove pitch relative to the semiconductor substrate storage box. It is a match.

[Action]

Positioning of the pair of wafer holding plates is regulated by a positioning plate and lowered onto the carrier, and the wafer holding plates are individually moved and adjusted to match the pitch of the groove with the storage groove of the carrier.

〔Example〕

 An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, the carrier 3 is provided with vertically facing wafer storage grooves 3a ... On the inner walls facing each other, and the wafer 2 is vertically leaned against the storage groove 3a and stored. On the other hand, a pair of wafer holding plates 1 and 1 provided with grooves 1a at the same pitch as the wafer storage groove 3a of the carrier 3 are installed facing each other on both opening edges of the upper part of the carrier 3.

Feeding rods 6, 6 for adjusting the position of the wafer holding plate 1 in the plate direction are horizontally attached to the back surface of each wafer holding plate 1, and the lower end of the wafer holding plate 1 can slide on the positioning plate 5. I am holding it.

In the embodiment, when the pair of wafer holding plates 1 and 1 are lowered and aligned with the upper edge of the carrier 3 by the positioning plate 5, the grooves between the wafer holding plates 1 and 1 and the carrier 3 are misaligned. If they are generated, the feed rods 6 and 6 are respectively handled to shift the wafer holding plate 1 in the direction orthogonal to the groove of the carrier 3 to perform groove pitch alignment. afterwards,
The wafer 2 is pushed up from the carrier 3 by the push-up bar 4, and this is passed through the pair of wafer holding plates 1 to be replaced with another carrier. Since the wafer is turned upside down by performing the groove pitch alignment, the wafer is not damaged when being pushed up.

〔The invention's effect〕

As described above, according to the present invention, the groove holding between the wafer holding plate and the carrier is performed, so that the pitch between the grooves is accurately adjusted and the wafer is prevented from being damaged or being displaced when the wafer is pushed up by the wafer pushing rod. It has an effect.

[Brief description of drawings]

FIG. 1 is an external view showing an embodiment of the present invention. 1 ... Wafer holding plate, 2 ... Wafer, 3 ... Carrier, 4 ... Wafer push-up rod, 5 ... Positioning plate

Claims (1)

[Claims] 1. A semiconductor substrate rearing device having a pair of wafer holding plates, which receives a semiconductor substrate housed in a semiconductor substrate housing box once between the pair of wafer holding plates and replaces it with another semiconductor substrate housing box. Then, the pair of wafer holding plates are arranged facing each other, have vertical grooves having the same pitch as the storage grooves of the semiconductor substrate storage box on the opposite surfaces, and can be moved up and down. And a lower end of the wafer holding plate is slidably held by a positioning plate that is aligned with the upper edge of the semiconductor substrate storage box, and the feed rod is in a row of the storage grooves of the semiconductor substrate storage box. A semiconductor substrate rearranging apparatus, wherein the wafer holding plate is moved and adjusted along a direction to adjust a groove pitch with respect to the semiconductor substrate storage box.