JPS6211489B2 - - Google Patents

Info

Publication number
JPS6211489B2
JPS6211489B2 JP56166056A JP16605681A JPS6211489B2 JP S6211489 B2 JPS6211489 B2 JP S6211489B2 JP 56166056 A JP56166056 A JP 56166056A JP 16605681 A JP16605681 A JP 16605681A JP S6211489 B2 JPS6211489 B2 JP S6211489B2
Authority
JP
Japan
Prior art keywords
chip
shaped electronic
tape
electronic components
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56166056A
Other languages
Japanese (ja)
Other versions
JPS5867100A (en
Inventor
Kozaburo Ookubo
Norio Takeda
Michiko Tachibana
Emiko Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichicon Corp
Original Assignee
Nichicon Capacitor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichicon Capacitor Ltd filed Critical Nichicon Capacitor Ltd
Priority to JP56166056A priority Critical patent/JPS5867100A/en
Publication of JPS5867100A publication Critical patent/JPS5867100A/en
Publication of JPS6211489B2 publication Critical patent/JPS6211489B2/ja
Granted legal-status Critical Current

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  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【発明の詳細な説明】 本発明はテーピングされたチツプ状電子部品連
の改良に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a series of taped chip-shaped electronic components.

従来のチツプ状電子部品連は第1図イ,ロに示
すように、複数のチツプ状電子部品1を、連続状
の装着テープ2に設けた凹部3に収納し、粘着性
のカバーテープ4を貼合せたものが使用されてい
た。
As shown in FIG. 1A and 1B, the conventional chip-shaped electronic component series stores a plurality of chip-shaped electronic components 1 in recesses 3 provided in a continuous mounting tape 2, and covers them with an adhesive cover tape 4. A glued version was used.

しかし一般に電解コンデンサは長時間保管して
おくと漏れ電流が増加する傾向にあり、再度電圧
を印加してエージングされることがあるが、上述
のようにテーピングされた電子部品がチツプ状電
解コンデンサのような場合は容易に通電できない
欠点があつた。
However, in general, when electrolytic capacitors are stored for a long time, their leakage current tends to increase, and they may be aged by applying voltage again. In such cases, there was a drawback that it was not easy to apply electricity.

本発明は上述の欠点を除去し、テーピングされ
たチツプ状電子部品に容易に通電できるチツプ状
電子部品連を提供するものである。
The present invention eliminates the above-mentioned drawbacks and provides a series of chip-shaped electronic components that can be easily energized with taped chip-shaped electronic components.

以下、本発明を第2図〜第4図に示す実施例に
より説明する。
The present invention will be explained below with reference to embodiments shown in FIGS. 2 to 4.

第2図イはプラスチツクなどからなる装着テー
プ5で、該テープ5にはチツプ状電子部品1を挿
入できる凹部6が形成されている。7はテープ送
り用穴である。第2図ロは粘着性テープなどのカ
バーテープ8で、装着テープ5に貼付けた際、チ
ツプ状電子部品1のはんだ付け可能な電極部9と
接触するように導電性テープからなる2本の通電
用導電材10が設けられている。
FIG. 2A shows a mounting tape 5 made of plastic or the like, and a recess 6 into which a chip-shaped electronic component 1 can be inserted is formed in the tape 5. 7 is a tape feeding hole. FIG. 2B shows a cover tape 8 such as an adhesive tape, and when it is attached to the mounting tape 5, two energized conductive tapes made of conductive tape are arranged so that they come into contact with the solderable electrode portions 9 of the chip-shaped electronic component 1. A conductive material 10 for use is provided.

上述の装着テープ5およびカバーテープからな
るテーピング材を用いてチツプ状電子部品1、例
えば有極性チツプ状電解コンデンサを、電極部9
の極性が同じ方向になるように凹部6内に挿入し
てカバーテープ8を貼合せて第2図ハのように完
成する。
A chip-shaped electronic component 1, for example, a polar chip-shaped electrolytic capacitor, is attached to the electrode portion 9 using a taping material consisting of the above-mentioned mounting tape 5 and cover tape.
The cover tape 8 is inserted into the recess 6 so that the polarities are in the same direction, and the cover tape 8 is pasted to complete the process as shown in FIG. 2C.

本発明のチツプ状電子部品連は以上のようにし
て構成されたものである。
The chip-shaped electronic component series of the present invention is constructed as described above.

したがつてチツプ状電子部品1がテーピングさ
れ、リール巻き、つづら折りなどの方法で梱包さ
れたチツプ状電子部品連は、テーピング材の端部
から通電用導電材10を通じて、チツプ状電子部
品1が全数並列接続されて通電することができる
ので、電解コンデンサのようにエージングを必要
とする場合は、テーピング材の一端部から容易に
電圧を印加することができる。そして凹部6の深
さをチツプ状電子部品1の厚みより浅くし、接触
をより強固にすることができる。
Therefore, in a series of chip-shaped electronic components in which the chip-shaped electronic components 1 are taped and packaged by a method such as winding on a reel or zigzag, all the chip-shaped electronic components 1 are passed from the end of the taping material through the conductive material 10 for electricity supply. Since they can be connected in parallel and energized, voltage can be easily applied from one end of the taping material when aging is required, such as in an electrolytic capacitor. The depth of the recess 6 can be made shallower than the thickness of the chip-shaped electronic component 1, and the contact can be made stronger.

第3図〜第5図は他のそれぞれ異なる実施例
で、第3図においては装着テープ11にチツプ状
電子部品1を挿入する打抜穴12を設け、カバー
テープ13,14にはそれぞれ電子部品1の2つ
の電極部9が別別に接触するように1本の連続状
の通電用導電材10が設けられ、装着テープ11
の両面からカバーテープ13,14を貼合せたも
ので同様な効果を有するものである。
3 to 5 show other different embodiments. In FIG. 3, a mounting tape 11 is provided with a punched hole 12 into which a chip-shaped electronic component 1 is inserted, and a cover tape 13, 14 is provided with a punched hole 12 for inserting an electronic component 1. One continuous electrically conductive material 10 is provided so that the two electrode parts 9 of 1 are in contact with each other separately, and a mounting tape 11 is provided.
Cover tapes 13 and 14 are bonded to both sides of the cover tape, and the same effect is obtained.

第4図においては第3図における打抜穴12を
除去した場合の例で同様な効果がある。
FIG. 4 shows an example in which the punched hole 12 in FIG. 3 is removed, and the same effect is obtained.

第5図は装着テープ5に設けた凹部6の側面ま
で通電用導電材10が延長されたもので、チツプ
状電子部品1の電極部9と接触し同様な効果があ
る。
In FIG. 5, the electrically conductive material 10 is extended to the side surface of the recess 6 provided in the mounting tape 5, and comes into contact with the electrode portion 9 of the chip-shaped electronic component 1, producing the same effect.

なお、上述の通電用導電材10の連続状の導電
性テープの代りに、テーピング材の一部を連続状
に金属蒸着して通電路を設けたり、細い柔軟性の
導線を配置してもよい。また、装着テープまたは
カバーテープは導電性の材料を用いて絶縁すべき
ところを絶縁材で被覆してもよい。上述の通電用
導電材は、粘着テープ、装着テープのいずれの側
に設けてもよく、いずれにおいてもテーピング材
の少なくとも一部分が連続状の通電用導電材から
なり、該導電材にチツプ状電子部品1の電極部9
を接触させて保持されているもので、種々の組合
せができる。
Note that instead of the continuous conductive tape of the conductive material 10 described above, a part of the taping material may be continuously metal-deposited to provide a conductive path, or a thin flexible conducting wire may be arranged. . Further, the mounting tape or cover tape may be made of an electrically conductive material, and the portions to be insulated may be covered with an insulating material. The above-mentioned conductive material for current-carrying may be provided on either side of the adhesive tape or mounting tape, and in either case, at least a portion of the taping material is made of a continuous conductive material for current-carrying, and chip-shaped electronic components are attached to the conductive material. 1 electrode part 9
are held in contact with each other, and various combinations are possible.

また上述の通電用導電材の一方の極側に着色す
ることにより、通電する際の極性区分をより明確
にし安全性を高めることができる。
Further, by coloring one pole side of the above-mentioned conductive material for energization, the polarity classification when energizing can be made clearer and safety can be improved.

第6図は定格50WV、1μFの電解コンデンサ
において、本発明によりテーピングした試料をエ
ージング処理したものと、エージング処理した後
テーピングしてなる従来品との漏れ電流特性を比
較したもので、図から明らかのように本発明のも
のは、漏れ電流が著しく低減し安定していること
が確認された。また、漏れ電流のバラツキも少な
く効果のあることが実証された。
Figure 6 compares the leakage current characteristics of an electrolytic capacitor with a rating of 50WV and 1μF, which is obtained by aging a sample taped according to the present invention and by a conventional product which is taped after aging. It was confirmed that the device of the present invention has significantly reduced leakage current and is stable. Furthermore, it was demonstrated that the variation in leakage current was small and it was effective.

叙上のように本発明のチツプ状電子部品連は、
品質並びに通電処理の面において極めて有利とな
り、工業的ならびに実用的価値の大なるものであ
る。
As mentioned above, the chip-shaped electronic component series of the present invention is
It is extremely advantageous in terms of quality and energization treatment, and has great industrial and practical value.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図イは従来のチツプ状電子部品連の装着テ
ープの平面図、ロは従来のチツプ状電子部品連の
断面図、第2図は本発明の一実施例で、イはチツ
プ状電子部品連の装着テープの平面図、ロはカバ
ーテープの底面図、ハはチツプ状電子部品連の断
面図、第3図〜第5図はチツプ状電子部品連の他
の異なる実施例の要部切断斜視図、第6図は本発
明品と従来品とを比較したチツプ状電解コンデン
サの漏れ電流特性図である。 1:チツプ状電子部品、5,11,15:装着
テープ、8,13,14:カバーテープ、9:電
極部、10:通電用導電材。
Figure 1A is a plan view of a mounting tape for a conventional chip-shaped electronic component series, B is a sectional view of a conventional chip-shaped electronic component series, and Figure 2 is an embodiment of the present invention; B is a bottom view of the cover tape, C is a sectional view of the chip-shaped electronic component series, and FIGS. 3 to 5 are main part cutaways of other different embodiments of the chip-shaped electronic component series. The perspective view and FIG. 6 are leakage current characteristics of chip-shaped electrolytic capacitors comparing the product of the present invention and a conventional product. 1: Chip-shaped electronic component, 5, 11, 15: Mounting tape, 8, 13, 14: Cover tape, 9: Electrode part, 10: Conductive material for current supply.

Claims (1)

【特許請求の範囲】[Claims] 1 両端部にはんだ付け可能な電極部を有する複
数のチツプ状電子部品を所定の間隔でテーピング
材に保持してなるチツプ状電子部品連において、
該テーピング材の少なくとも一部分に設けた連続
状の通電用導電材に上記電子部品の電極を接触さ
せて保持されていることを特徴とするチツプ状電
子部品連。
1. In a series of chip-shaped electronic components formed by holding a plurality of chip-shaped electronic components having solderable electrode parts at both ends on a taping material at predetermined intervals,
A series of chip-shaped electronic components, characterized in that electrodes of the electronic components are held in contact with a continuous electrically conductive material provided on at least a portion of the taping material.
JP56166056A 1981-10-16 1981-10-16 Chipped electronic part series Granted JPS5867100A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56166056A JPS5867100A (en) 1981-10-16 1981-10-16 Chipped electronic part series

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56166056A JPS5867100A (en) 1981-10-16 1981-10-16 Chipped electronic part series

Publications (2)

Publication Number Publication Date
JPS5867100A JPS5867100A (en) 1983-04-21
JPS6211489B2 true JPS6211489B2 (en) 1987-03-12

Family

ID=15824142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56166056A Granted JPS5867100A (en) 1981-10-16 1981-10-16 Chipped electronic part series

Country Status (1)

Country Link
JP (1) JPS5867100A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61202362U (en) * 1985-06-07 1986-12-19
JP2647350B2 (en) * 1994-09-26 1997-08-27 ヒロユー株式会社 Counter

Also Published As

Publication number Publication date
JPS5867100A (en) 1983-04-21

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