JPS61202362U - - Google Patents
Info
- Publication number
- JPS61202362U JPS61202362U JP8678585U JP8678585U JPS61202362U JP S61202362 U JPS61202362 U JP S61202362U JP 8678585 U JP8678585 U JP 8678585U JP 8678585 U JP8678585 U JP 8678585U JP S61202362 U JPS61202362 U JP S61202362U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- embossed
- carrier
- carrier tape
- plastic film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000002985 plastic film Substances 0.000 claims 2
- 229920006255 plastic film Polymers 0.000 claims 2
- DOSMHBDKKKMIEF-UHFFFAOYSA-N 2-[3-(diethylamino)-6-diethylazaniumylidenexanthen-9-yl]-5-[3-[3-[4-(1-methylindol-3-yl)-2,5-dioxopyrrol-3-yl]indol-1-yl]propylsulfamoyl]benzenesulfonate Chemical compound C1=CC(=[N+](CC)CC)C=C2OC3=CC(N(CC)CC)=CC=C3C(C=3C(=CC(=CC=3)S(=O)(=O)NCCCN3C4=CC=CC=C4C(C=4C(NC(=O)C=4C=4C5=CC=CC=C5N(C)C=4)=O)=C3)S([O-])(=O)=O)=C21 DOSMHBDKKKMIEF-UHFFFAOYSA-N 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図は本案キヤリアテープの一部を切欠して
示す部分平面図、又第２図はＡ―Ａ線の拡大断面
図である。
尚、図中１……エンボステープ、２……収納室
、３……送り孔、４……カバーテープ、５……接
着剤、６……内テープ。
FIG. 1 is a partially cutaway plan view of the carrier tape of the present invention, and FIG. 2 is an enlarged sectional view taken along line A--A. In the figure, 1...embossed tape, 2...storage chamber, 3...spread hole, 4...cover tape, 5...adhesive, 6...inner tape.
Claims (1)
プとこれに見合う巾を有するカバーテープとから
なるキヤリアテープにおいて、透明なカバーテー
プ４の一面に塗布された接着剤５を介して導電性
及び透視性に優れた内テープ６を貼着し、該カバ
ーテープ４の両側縁４′を上記エンボステープ１
の鍔縁１′に接着して収納物を密封可能としたこ
とを特徴とするキヤリアテープ。 ２ 内テープ６が金属フイラーを混入したプラス
チツクフイルムからなる実用新案登録請求の範囲
第１項記載のキヤリアテープ。[Claims for Utility Model Registration] 1. In a carrier tape consisting of an embossed tape made of plastic film and a cover tape having a width commensurate with the embossed tape, electrical conductivity is achieved through an adhesive 5 applied to one surface of a transparent cover tape 4. Then, an inner tape 6 with excellent transparency is attached, and both side edges 4' of the cover tape 4 are attached to the embossed tape 1.
A carrier tape characterized by being able to seal stored items by adhering to the rim 1' of the carrier tape. 2. The carrier tape according to claim 1, wherein the inner tape 6 is made of a plastic film mixed with a metal filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8678585U JPS61202362U (en) | 1985-06-07 | 1985-06-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8678585U JPS61202362U (en) | 1985-06-07 | 1985-06-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61202362U true JPS61202362U (en) | 1986-12-19 |
Family
ID=30638412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8678585U Pending JPS61202362U (en) | 1985-06-07 | 1985-06-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61202362U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991012187A1 (en) * | 1990-02-06 | 1991-08-22 | Sumitomo Bakelite Company Limited | Covering tape for electronic component chip |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5867100A (en) * | 1981-10-16 | 1983-04-21 | ニチコン株式会社 | Chipped electronic part series |
-
1985
- 1985-06-07 JP JP8678585U patent/JPS61202362U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5867100A (en) * | 1981-10-16 | 1983-04-21 | ニチコン株式会社 | Chipped electronic part series |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991012187A1 (en) * | 1990-02-06 | 1991-08-22 | Sumitomo Bakelite Company Limited | Covering tape for electronic component chip |