JPS6245519Y2 - - Google Patents

Description

[Detailed description of the invention] This invention relates to the improvement of high-voltage rectifiers such as Kotsukucroft-Walton circuits, and its main purpose is to provide a structure suitable for mass-producing compact and lightweight high-voltage rectifiers. There is.

As shown in Fig. 1, a conventional high voltage rectifier uses an insulating substrate 3, such as a baked plate, to support a diode 1 and a capacitor 2, which are used as circuit components of a high voltage rectifier circuit. This insulating substrate 3 is provided with eyelets 4 at approximately regular intervals on both sides along its longitudinal direction, and cutouts 5 are provided between the eyelets 4 in order to increase the creepage distance.
It is equipped with Note that 6 and 6' are input conductors, and 7 is an output conductor. The method for manufacturing such a device is to use an insulating substrate 3.
A predetermined diode 1 and lead wire of a capacitor 2 are inserted into the eyelet 4 to form a high voltage rectifier circuit, and the eyelet portion is then soldered.

Such conventional high voltage rectifiers have the following drawbacks.

(1) Requires a soldering process, and the heat generated during soldering can degrade and even damage the diodes and capacitors.

(2) Processes such as removing flux and small solder particles are required.

(3) Processing of the insulating substrate for mounting circuit components is complicated, and if the material is not selected, creeping discharge will occur on the surface of the substrate.

(4) If the end of the lead wire at the eyelet is not treated with extreme care, there is a risk of electric field concentration at the end of the lead wire and dielectric breakdown.

(5) Since the capacitor and diode lead wires are connected to an insulating board, high-density mounting is not possible.

In order to eliminate the drawbacks of the conventional device, the present invention constructs a high voltage rectifier circuit by stacking leadless capacitors and sandwiching diode lead wires between these capacitors. a frame body or a case that supports the high voltage rectifier circuit and the pressurizing body so as to maintain the series body of the capacitors in a pressurized state; It is characterized by having the following.

First, one embodiment of the present invention will be explained with reference to FIGS. 2 to 4.

A second example showing an embodiment of the high voltage rectifier of the present invention.
In the figure, 1 is a normal diode used when constructing such a high voltage rectifier, 2, 2'
is a leadless plate capacitor having flat electrodes 2a, 2a' on both sides; 7 is an output conductor; 8,
8' is a metal plate, 9, 9' is a tightening screw body used as a pressurizing body and an input conductor on one side, 10, 1
0' is a rubber-like elastic body used as the pressurizing body on the other side, and 11 is a highly electrically insulating frame as shown in Figure 4, which is attached to the frame plate in the stacking direction of the capacitors. A slit 11a that enables attachment and detachment of the diode receiving jig 13, a tightening screw body 9,
It has holes 11b, 11b' for screwing with the screw threads 9', and holes 11c, 11c' for leading out an input conductor or an output conductor as required. When manufacturing such a high voltage rectifier, first grooves 12a and 12 for receiving capacitors 2 and 2' are formed as shown in FIG.
As shown in FIG. 3, a jig 12 having a diode receiving portion 12b provided along the middle of these grooves is assembled with the frame 11 and placed substantially horizontally. Next, the elastic body 1 is inserted into one groove 12a of the jig 12.
0, the metal plate 8, the desired number of capacitors 2, and the metal plate 8 are placed side by side, and similarly the elastic body 10', the metal plate 8', the capacitor 2', and the metal plate 8' are placed side by side in the other groove 12a'. . After that, the diode 1 having the lead wires arranged in advance to a predetermined length is placed on the diode receiving part 12b with the cathode side facing the capacitor 2 side, and the lead wires of each of these diodes are connected by the length of one capacitor. It is shifted between the electrodes 2a and 2a' of the capacitor 2, or between the metal plate and the electrodes of the capacitor. Next, a diode receiving jig 13 as shown in FIG. 3 is inserted into the slits 11a of the opposing frame plates of the frame body 11. Thereafter, a predetermined number of diodes 1 are placed on the diode receiving jig 13 with the anode side facing the capacitor 2, and their lead wires are connected between the electrodes of the predetermined capacitor and between the capacitor's electrodes to form a multi-stage voltage doubler circuit. Insert between the electrode and the metal plate. Also, in this step, one of the output conductors 7 is interposed between the electrode of the outermost capacitor and the metal plate, and the other is led out through the hole in the frame 11. After the capacitors 2, 2' are stacked in this manner, the tightening screw bodies 9, 9' are advanced to apply pressure to the stacked capacitors in the stacking direction. Thereafter, the jig 12 and the diode receiving jig 13 are removed from the frame 11 and removed.

The high-voltage rectifier shown in Figure 2 was manufactured in this way, and such a device is generally molded in resin together with a high-voltage transformer, high-voltage resistor, etc., or placed in insulating oil or gas. used. In addition, if necessary, the input and output conductors of such devices may be left in place and covered with an insulating synthetic resin with good adhesiveness. Capacitors and capacitors and diodes can be bonded together without any bonding work.

Next, another embodiment of the present invention will be described with reference to FIG. frame member 1
1C, 11D and four screw bodies 11E for fixing these to each other, the frame members 11A,
11B has the same slits and holes as the frame plate shown in FIG. 4B, and also has a hole 1 through which the screw body 11E is inserted.
It has 1F. Further, each of the frame members 11C and 11D has screw holes 11G at both ends thereof to be screwed into the screw body 11.
It has a cylindrical shape. When such a frame is used, the size of the frame member 1 depends on the number of stages of the multi-stage voltage doubler circuit, that is, the number of stacked capacitors 2 and 2'.
It is economically superior because only 1C and 11D need be changed. By providing a screw thread on one end side of the frame members 11C and 11D, the frame members 11C and 11D can also be used as tightening screw bodies, and 6 and 6' are input conductors. Next, FIG. 6 shows another embodiment in which an insulating case 14 is used instead of the frame, and the case wall is used to connect the tightening screw bodies 9, 9' and the elastic bodies 10, 10' to the above-mentioned overlap. A pressurizing force is applied to the combined capacitors 2 and 2'. Note that 15 is a highly insulating synthetic resin filled in the case 14. In this case, the high voltage rectifier can be treated as a single product.

As described above, the present invention constructs a high voltage rectifier circuit by sandwiching the lead wire of a diode between leadless plate-shaped capacitors, applies pressure to the capacitor using a conductive screw body, and maintains this pressurized state. Since it is a high voltage rectifier that uses a conductive screw body as an input conductor or an output conductor, the applied force can be adjusted arbitrarily and easily, and it can also be made extremely small and lightweight. Moreover, there is no electric field concentration at the tip of the diode lead wire, and there is no deterioration or damage to the diode or capacitor due to the soldering process or the work and heat associated with this process, making the manufacturing process easy. It has many effects, such as:

[Brief explanation of the drawing]

Figure 1 shows a conventional high voltage rectifier, Figure 2 shows a conventional high voltage rectifier.
The figure shows an embodiment of the high voltage rectifier according to the present invention, FIG. 3 is a diagram for explaining the manufacturing method of the device of the present invention, and FIG. 4 is a diagram showing an example of a frame used in the device of the present invention. , 5 and 6 respectively show different embodiments of the present invention. 1...Diode, 2, 2'...Capacitor,
6, 6'...Input conductor, 7...Output conductor, 8,
8'...Metal plate, 9,9'...Tightening screw body (pressure body), 10,10'...Elastic body (pressure body), 11...
...frame body, 12... jig, 13... diode receiving jig.

Claims (1)

[Claims for Utility Model Registration] (1) A high-voltage rectifier circuit is constructed by stacking a plurality of leadless plate capacitors each having flat electrodes on both sides and sandwiching a diode between the electrodes of the capacitors, The high voltage rectifier circuit is provided with a conductive screw body on at least one end side of the stacked capacitors, which can arbitrarily adjust the pressure applied thereto, and maintains the plurality of stacked capacitors in a pressurized state. and a conductive screw body, the high voltage rectifier comprising a frame body or a case that supports the conductive screw body, and the conductive screw body is used as an input conductor or an output conductor. (2) In the description of claim (1) for utility model registration, at least the overlapped portions of the plurality of stacked capacitors are coated with an insulating synthetic resin, and the lead wires are sandwiched between adjacent capacitors and between these capacitors. A high voltage rectifier characterized by bonding a diode with a diode.