JPS62112790A - Thin film processing device with dust collector - Google Patents

Thin film processing device with dust collector

Info

Publication number
JPS62112790A
JPS62112790A JP60251710A JP25171085A JPS62112790A JP S62112790 A JPS62112790 A JP S62112790A JP 60251710 A JP60251710 A JP 60251710A JP 25171085 A JP25171085 A JP 25171085A JP S62112790 A JPS62112790 A JP S62112790A
Authority
JP
Japan
Prior art keywords
dust
movable mechanism
base plate
thin film
film processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60251710A
Other languages
Japanese (ja)
Other versions
JPH0751756B2 (en
Inventor
Yoshihiro Hirota
広田 喜弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corp filed Critical Anelva Corp
Priority to JP60251710A priority Critical patent/JPH0751756B2/en
Publication of JPS62112790A publication Critical patent/JPS62112790A/en
Publication of JPH0751756B2 publication Critical patent/JPH0751756B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrostatic Separation (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:To decrease dust stuck on a base plate remarkably by providing a dust collector utilizing electrostatic force or magnetic force or both the two in the vicinity of a member which constitutes a movable mechanism and is accompanied with deformation, sliding, attaching and detaching. CONSTITUTION:Each shaft, a bearing, each belt and a pulley are provided to convey a silicon base plate 5. Deformation, sliding, attaching and detaching motion are generated between these movable mechanism 2 and the belts 222, 233 and the silicon base plate 5. DC high voltage is impressed between a vacuum chamber 1 and a dust collection cover 31 by means of a DC electric power source 30 for dust collection and fine dust generated in the movable mechanism 2 is attracted to the dust collection cover 31 by electrostatic force and stuck thereon. Furthermore when the generated fine dust is a magnetic material, it is adsorbed by the square bar-shaped permanent magnets 41a, 41b. By this constitution, thin film processing wherein dust stuck on the base plate is decreased remarkably can be performed.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、大規模集積回路(LSi超LSI)の作製に
利用されるスパッタリング装置、プラズマCVD装置、
蒸着装置、ドライエツチング装置などのように特に塵の
付着を嫌う装置において威力を発揮する集塵装置を付加
した1膜処理装置に関する。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to sputtering equipment, plasma CVD equipment,
The present invention relates to a single-film processing device equipped with a dust collector, which is particularly effective in devices where dust adhesion is averse, such as evaporation devices and dry etching devices.

(従来技術) 従来、LS r、超LSIを製造する上記の薄膜処理装
置においては、有害な塵の発生を防止するため、塵の発
生の主な原因となる変形、摺動、着脱を伴う動作をつと
めて避け、且それらの可動機構部分が少なくなるように
設計に配慮が加えられていた。
(Prior art) Conventionally, in the above-mentioned thin film processing equipment for manufacturing LS r and VLSI, in order to prevent the generation of harmful dust, operations that involve deformation, sliding, and attachment/detachment, which are the main causes of dust generation, have been conducted. Consideration was given to the design to avoid these problems and to reduce the number of movable mechanical parts.

(本発明が解決しようとする問題点) しかし、無人操作や量産化、高速処理の要請は高まる一
方であり、被処理基板のハンドリングの頻度は増大の一
途をたどり、従来の考え方では次第に対応が難しくなっ
て来ている。
(Problems to be solved by the present invention) However, as the demands for unmanned operation, mass production, and high-speed processing continue to increase, the frequency of handling of substrates to be processed continues to increase, and the conventional way of thinking is gradually becoming incapable of dealing with this. It's getting difficult.

しかも最近の超LSIにおいては、配線巾の微細化、高
密度化かす\み、微小の塵埃に起因して製造の歩留は著
るしく悪化する傾向にあり、高度の無塵化が絶対の急務
となっている。
Moreover, in recent VLSIs, manufacturing yields tend to deteriorate significantly due to miniaturization of wiring width, high density, and minute dust, making it absolutely urgent to achieve a high degree of dust-free production. It becomes.

本発明は、被処理基板に付着する塵埃の極めて少ない薄
膜処理装置を提供することを目的とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide a thin film processing apparatus with extremely little dust adhering to a substrate to be processed.

(問題点を解決する手段) 上記の目的を達成するために本発明は、薄膜処理装置内
の可動機構を構成する部材のうち、変形、摺動、着脱を
伴う部材の、該変形、摺動、着脱場所の近傍に、静電気
力若しくは磁気力またはその両者を利用する集塵手段を
具える構成にしている。
(Means for Solving the Problems) In order to achieve the above object, the present invention provides a means for deforming, sliding, and attaching/detaching members among the members constituting the movable mechanism in the thin film processing apparatus. The structure is such that a dust collecting means that utilizes electrostatic force, magnetic force, or both is provided near the attachment/detachment location.

(実 施 例) 以下図を用いて本発明の詳細な説明する。(Example) The present invention will be explained in detail below using the figures.

第1図は本発明の実施例の断面図を示し、真空室1の室
内1a(大気側はlb)には被処理基板であるシリコン
基板5を搬送する可動機構2が示されている。図示しな
い回転駆動装置で駆動される回転軸201 (軸受21
1,212で支持)の回転は、プーリー221,222
とベルト231によって回転軸202 (軸受213で
支持)に伝えられ、この軸のプーリー222,223に
掛る二つのベルト232.233の上に載置されたシリ
コン基板5を紙面に垂直な方向に搬送するが、各軸・軸
受、各ベルト・プーリー、およびベルト・基板間には摺
動、着脱動作があり、摩耗によって極微細な塵を発生す
る。更に各部の変形、殊にベルトの湾曲はこれもまた微
細塵の発生源となる。
FIG. 1 shows a cross-sectional view of an embodiment of the present invention, in which a movable mechanism 2 for transporting a silicon substrate 5, which is a substrate to be processed, is shown in an interior 1a of a vacuum chamber 1 (1b on the atmospheric side). A rotating shaft 201 (bearing 21
1,212) is rotated by pulleys 221,222
is transmitted to the rotating shaft 202 (supported by a bearing 213) by the belt 231, and the silicon substrate 5 placed on the two belts 232 and 233 hanging on the pulleys 222 and 223 of this shaft is conveyed in a direction perpendicular to the plane of the paper. However, each shaft/bearing, each belt/pulley, and the belt/substrate undergo sliding and attachment/detachment movements, which generate extremely fine dust due to wear. Furthermore, deformation of various parts, especially curvature of the belt, also becomes a source of fine dust.

既述のように従来はこれら細塵の発生に対し直接の対策
はとられず、専ら、可動機構部分を少なくすることのみ
に腐心していたものである。
As mentioned above, in the past, no direct measures were taken against the generation of fine dust, and efforts were made solely to reduce the number of movable mechanical parts.

実施例では、これらの細塵にそなえて静電気力、磁気力
を利用する集塵手段を付加している。。
In the embodiment, a dust collection means using electrostatic force and magnetic force is added to prepare for these fine dusts. .

集塵用直流電源30は、上述の可動機構2を覆う形に絶
縁物32で真空室1に取付けられた導電性の集塵カバー
31と、真空室1との間に直流高電圧を印加し、可動機
構2で発生した細塵を静電気力で集塵カバー31に吸引
し付着させる。集塵カバー31の窓33はシリコン基板
5を紙面に垂直に後方へと送り出す目的であけられたも
のである。なお、可動機構2の各導電性部材には、すべ
て真空室1と同電位になるような処置が施されている。
The dust collection DC power supply 30 applies a high DC voltage between the vacuum chamber 1 and a conductive dust collection cover 31 attached to the vacuum chamber 1 with an insulator 32 to cover the above-mentioned movable mechanism 2. The fine dust generated by the movable mechanism 2 is attracted to the dust collecting cover 31 by electrostatic force and is made to adhere thereto. The window 33 of the dust collection cover 31 is opened for the purpose of sending out the silicon substrate 5 rearward perpendicularly to the plane of the paper. Note that each conductive member of the movable mechanism 2 is treated to have the same potential as the vacuum chamber 1.

更に、角棒形状の永久磁石41a、41bはブーU−2
22,223(及び、ベルト232,233の掛けられ
ている、これらプーリーの後方のかくれた位置にあるプ
ーリー)の軸受ケ所に近接して、ベルト232,233
に沿う形で固定されていて、発生した細塵が磁性体であ
るときには、これら永久磁石の磁気力が働いて、細塵が
これら磁石41a、41bの表面に吸引され付着するよ
うにされている。
Furthermore, the square rod-shaped permanent magnets 41a and 41b are
22, 223 (and the pulley hidden behind these pulleys on which the belts 232, 233 are hung).
When the generated fine dust is magnetic, the magnetic force of these permanent magnets acts to attract and adhere the fine dust to the surfaces of these magnets 41a and 41b. .

次に、第2a図には別の実施例の断面図、第2b図には
その6−6矢断面図を示す。
Next, FIG. 2a shows a sectional view of another embodiment, and FIG. 2b shows its 6-6 arrow sectional view.

第1図と同一の部材には同一の符号を付している。この
第2図の可動機構2は、大気側1bの回転ツマミ26で
軸204(軸受214で支持)を回すことによって傘歯
車241,242の噛合を経て、軸205(軸受215
,216で支持)を回転させ、軸205に刻まれた雄ね
じ251と、可動体25に刻まれた雌ねじ252の螺合
を利用して、可動体25をガイド253上にて矢印25
0方向に駆動するものである。可動体25の上部は図示
しない搬送装置の所定部に連結されている。
The same members as in FIG. 1 are given the same reference numerals. The movable mechanism 2 shown in FIG.
.
It drives in the 0 direction. The upper part of the movable body 25 is connected to a predetermined part of a transport device (not shown).

この図の場合も、各軸・軸受、雨傘歯車間、ねじ送り、
可動体25とガイド253、の相互間に摺動、着脱運動
があり、細塵を発生する。この細塵を吸引付着させる目
的で、集塵力、バー31が、可動機構2を覆う形に、絶
縁物32で真空室1に取付けられ、直流電源30から直
流高電圧が印加されている。集塵カバー31の窓33は
可動体25の動きに支障を生じないよう僅かにあけられ
たものである。更に、長い帯状の永久磁石41C,41
dがねじ部に沿って窓33の開口端の両側に接着され、
また直方体の永久磁石41eが磁極を傘歯車241,2
42の噛合部に近接させて固定させている。
In the case of this diagram, each shaft/bearing, between the bevel gears, screw feed,
There is sliding and attachment/detachment movement between the movable body 25 and the guide 253, which generates fine dust. In order to attract and adhere this fine dust, a dust collection bar 31 is attached to the vacuum chamber 1 with an insulator 32 so as to cover the movable mechanism 2, and a DC high voltage is applied from a DC power source 30. The window 33 of the dust collection cover 31 is slightly opened so as not to hinder the movement of the movable body 25. Furthermore, long strip-shaped permanent magnets 41C, 41
d is glued to both sides of the open end of the window 33 along the threaded portion,
In addition, the rectangular parallelepiped permanent magnet 41e connects the magnetic poles to the bevel gears 241, 2.
42 and is fixed close to the engaging portion.

上述した各実施例の静電気力、磁気力を利用する集塵手
段の付加によれば、細塵が殊にその発生源で効果的に除
去され、すぐれた防塵効果かえられる。また、これらの
集塵手段が真空室内1aの浮遊塵に対しても有効であり
、清浄作用を発揮することは明らかである。
By adding the dust collecting means that utilizes electrostatic force and magnetic force in each of the embodiments described above, fine dust can be effectively removed, especially at its source, and an excellent dustproof effect can be achieved. It is also clear that these dust collection means are effective against floating dust in the vacuum chamber 1a and exhibit a cleaning effect.

なお、集塵カバー31の表面に絶縁膜(ガス放出のない
膜)を付加しておくときは、静電気力による吸引付着が
金属粉に対しても万全となる効果がある。
Note that when an insulating film (a film that does not emit gas) is added to the surface of the dust collecting cover 31, there is an effect that the suction and adhesion due to electrostatic force is perfect for metal powder.

(発明の効果) 本発明は、被処理基板に付着する塵埃の極めて少ない薄
膜処理装置を提供する効果がある。
(Effects of the Invention) The present invention has the effect of providing a thin film processing apparatus with very little dust adhering to a substrate to be processed.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の実施例の断面図。 第2a図は別の実施例の断面図で、第2b図はその6−
6矢断面図である。 1−一一一真空室、   2−−−一可動機構、3−一
−−静電気力を利用する集塵手段、41a、〜41 e
−−−−磁気力を利用する集塵手段。
FIG. 1 is a sectional view of an embodiment of the present invention. Fig. 2a is a sectional view of another embodiment, and Fig. 2b is a 6-
It is a 6 arrow sectional view. 1-111 vacuum chamber, 2--1 movable mechanism, 3-1--dust collecting means using electrostatic force, 41a, ~41e
----- Dust collection means that uses magnetic force.

Claims (1)

【特許請求の範囲】[Claims] 装置の内部に可動機構を有する薄膜処理装置において、
該可動機構を構成する部材のうち、変形、摺動、着脱を
伴う部材の、該変形、摺動、着脱場所の近傍に、静電気
力若しくは磁気力またはその両者を利用する集塵手段を
具えたことを特徴とする集塵装置付薄膜処理装置。
In a thin film processing device having a movable mechanism inside the device,
Among the members constituting the movable mechanism, a dust collecting means that utilizes electrostatic force or magnetic force or both is provided near the location of the deformation, sliding, or attachment/detachment of a member that is subject to deformation, sliding, or attachment/detachment. A thin film processing device with a dust collector, characterized by:
JP60251710A 1985-11-09 1985-11-09 Thin film processing equipment with dust collector Expired - Lifetime JPH0751756B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60251710A JPH0751756B2 (en) 1985-11-09 1985-11-09 Thin film processing equipment with dust collector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60251710A JPH0751756B2 (en) 1985-11-09 1985-11-09 Thin film processing equipment with dust collector

Publications (2)

Publication Number Publication Date
JPS62112790A true JPS62112790A (en) 1987-05-23
JPH0751756B2 JPH0751756B2 (en) 1995-06-05

Family

ID=17226839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60251710A Expired - Lifetime JPH0751756B2 (en) 1985-11-09 1985-11-09 Thin film processing equipment with dust collector

Country Status (1)

Country Link
JP (1) JPH0751756B2 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6422042A (en) * 1987-07-17 1989-01-25 Kyushu Nippon Electric Vacuum transfer chamber of semiconductor manufacturing equipment
JPH02218456A (en) * 1987-10-09 1990-08-31 Nitto Denko Corp Removal of foreign matter
US4987857A (en) * 1988-06-21 1991-01-29 Anelva Corporation Vacuum deposition apparatus with dust collector electrode
JPH0474547A (en) * 1990-07-16 1992-03-09 Aeria:Kk Air cleaner
JPH06232235A (en) * 1993-02-05 1994-08-19 Japan Steel Works Ltd:The Load lock chamber
KR100662499B1 (en) * 2002-11-18 2007-01-02 엘지.필립스 엘시디 주식회사 substrates bonding device for manufacturing of liquid crystal display
JP2009023020A (en) * 2007-07-18 2009-02-05 Yaskawa Electric Corp Substrate carrying robot having dust-tight mechanism, and semiconductor manufacturing apparatus having the robot
WO2012086535A1 (en) * 2010-12-23 2012-06-28 シャープ株式会社 Method of recovering film-forming material
JP2013008835A (en) * 2011-06-24 2013-01-10 Tokyo Electron Ltd Electric actuator
JP2013234375A (en) * 2012-05-11 2013-11-21 Panasonic Corp Sputtering apparatus
JP2015043420A (en) * 2013-08-13 2015-03-05 ラム リサーチ コーポレーションLam Research Corporation Plasma processing devices having multi-port valve assemblies
CN104959224A (en) * 2015-07-10 2015-10-07 佛山市高明区银浩机械设备有限公司 Permanent-magnet iron removal machine
CN105938957A (en) * 2016-06-23 2016-09-14 无锡市国松环保机械有限公司 Dustproof flashboard for aerospace use
CN113652664A (en) * 2021-07-21 2021-11-16 苏州沃伦工业成套设备有限公司 Full-automatic vacuum coating line

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839783A (en) * 1981-09-03 1983-03-08 Toshiba Corp Reactive ion etching device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839783A (en) * 1981-09-03 1983-03-08 Toshiba Corp Reactive ion etching device

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6422042A (en) * 1987-07-17 1989-01-25 Kyushu Nippon Electric Vacuum transfer chamber of semiconductor manufacturing equipment
JPH02218456A (en) * 1987-10-09 1990-08-31 Nitto Denko Corp Removal of foreign matter
US4987857A (en) * 1988-06-21 1991-01-29 Anelva Corporation Vacuum deposition apparatus with dust collector electrode
JPH0474547A (en) * 1990-07-16 1992-03-09 Aeria:Kk Air cleaner
JPH06232235A (en) * 1993-02-05 1994-08-19 Japan Steel Works Ltd:The Load lock chamber
KR100662499B1 (en) * 2002-11-18 2007-01-02 엘지.필립스 엘시디 주식회사 substrates bonding device for manufacturing of liquid crystal display
JP2009023020A (en) * 2007-07-18 2009-02-05 Yaskawa Electric Corp Substrate carrying robot having dust-tight mechanism, and semiconductor manufacturing apparatus having the robot
WO2012086535A1 (en) * 2010-12-23 2012-06-28 シャープ株式会社 Method of recovering film-forming material
JP2013008835A (en) * 2011-06-24 2013-01-10 Tokyo Electron Ltd Electric actuator
JP2013234375A (en) * 2012-05-11 2013-11-21 Panasonic Corp Sputtering apparatus
JP2015043420A (en) * 2013-08-13 2015-03-05 ラム リサーチ コーポレーションLam Research Corporation Plasma processing devices having multi-port valve assemblies
CN104959224A (en) * 2015-07-10 2015-10-07 佛山市高明区银浩机械设备有限公司 Permanent-magnet iron removal machine
CN105938957A (en) * 2016-06-23 2016-09-14 无锡市国松环保机械有限公司 Dustproof flashboard for aerospace use
CN113652664A (en) * 2021-07-21 2021-11-16 苏州沃伦工业成套设备有限公司 Full-automatic vacuum coating line
CN113652664B (en) * 2021-07-21 2023-05-02 苏州沃伦工业成套设备有限公司 Full-automatic vacuum coating line

Also Published As

Publication number Publication date
JPH0751756B2 (en) 1995-06-05

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