JPS62110995U - - Google Patents
Info
- Publication number
- JPS62110995U JPS62110995U JP1985202936U JP20293685U JPS62110995U JP S62110995 U JPS62110995 U JP S62110995U JP 1985202936 U JP1985202936 U JP 1985202936U JP 20293685 U JP20293685 U JP 20293685U JP S62110995 U JPS62110995 U JP S62110995U
- Authority
- JP
- Japan
- Prior art keywords
- light
- hole
- emitting display
- outer frame
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005192 partition Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985202936U JPH0328467Y2 (US20030199744A1-20031023-C00003.png) | 1985-12-28 | 1985-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985202936U JPH0328467Y2 (US20030199744A1-20031023-C00003.png) | 1985-12-28 | 1985-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62110995U true JPS62110995U (US20030199744A1-20031023-C00003.png) | 1987-07-15 |
| JPH0328467Y2 JPH0328467Y2 (US20030199744A1-20031023-C00003.png) | 1991-06-19 |
Family
ID=31167786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985202936U Expired JPH0328467Y2 (US20030199744A1-20031023-C00003.png) | 1985-12-28 | 1985-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328467Y2 (US20030199744A1-20031023-C00003.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006278490A (ja) * | 2005-03-28 | 2006-10-12 | Toshiba Corp | 照明装置、撮像装置及び携帯端末 |
| JP2007081074A (ja) * | 2005-09-14 | 2007-03-29 | Rohm Co Ltd | 光通信モジュール |
| JP2007208041A (ja) * | 2006-02-02 | 2007-08-16 | Shinko Electric Ind Co Ltd | 半導体装置及び半導体装置の製造方法 |
| WO2013186977A1 (ja) * | 2012-06-11 | 2013-12-19 | シャープ株式会社 | 光源装置および照明装置 |
-
1985
- 1985-12-28 JP JP1985202936U patent/JPH0328467Y2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006278490A (ja) * | 2005-03-28 | 2006-10-12 | Toshiba Corp | 照明装置、撮像装置及び携帯端末 |
| JP2007081074A (ja) * | 2005-09-14 | 2007-03-29 | Rohm Co Ltd | 光通信モジュール |
| JP2007208041A (ja) * | 2006-02-02 | 2007-08-16 | Shinko Electric Ind Co Ltd | 半導体装置及び半導体装置の製造方法 |
| WO2013186977A1 (ja) * | 2012-06-11 | 2013-12-19 | シャープ株式会社 | 光源装置および照明装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0328467Y2 (US20030199744A1-20031023-C00003.png) | 1991-06-19 |
