JPS62110989U - - Google Patents

Info

Publication number
JPS62110989U
JPS62110989U JP1985202937U JP20293785U JPS62110989U JP S62110989 U JPS62110989 U JP S62110989U JP 1985202937 U JP1985202937 U JP 1985202937U JP 20293785 U JP20293785 U JP 20293785U JP S62110989 U JPS62110989 U JP S62110989U
Authority
JP
Japan
Prior art keywords
light emitting
emitting display
light
transmitting resin
concave surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985202937U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0241662Y2 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985202937U priority Critical patent/JPH0241662Y2/ja
Publication of JPS62110989U publication Critical patent/JPS62110989U/ja
Application granted granted Critical
Publication of JPH0241662Y2 publication Critical patent/JPH0241662Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
JP1985202937U 1985-12-28 1985-12-28 Expired JPH0241662Y2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985202937U JPH0241662Y2 (ko) 1985-12-28 1985-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985202937U JPH0241662Y2 (ko) 1985-12-28 1985-12-28

Publications (2)

Publication Number Publication Date
JPS62110989U true JPS62110989U (ko) 1987-07-15
JPH0241662Y2 JPH0241662Y2 (ko) 1990-11-06

Family

ID=31167788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985202937U Expired JPH0241662Y2 (ko) 1985-12-28 1985-12-28

Country Status (1)

Country Link
JP (1) JPH0241662Y2 (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003529792A (ja) * 2000-03-31 2003-10-07 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ コリメーション及び収束用ワンピースレンズアレイ及び該ワンピースレンズアレイを用いるｌｅｄ発光器
JP2004512670A (ja) * 2000-05-12 2004-04-22 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング オプトエレクトニック素子及びその製造方法
JP2007065080A (ja) * 2005-08-29 2007-03-15 Sony Corp 空間光変調光学装置とこれを用いた虚像光学装置及び投射型画像表示装置
JP2014165333A (ja) * 2013-02-25 2014-09-08 Kyocera Corp 光照射デバイス、光照射モジュールおよび印刷装置
JP2016045306A (ja) * 2014-08-21 2016-04-04 株式会社エンプラス 光束制御部材、面光源装置および表示装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003529792A (ja) * 2000-03-31 2003-10-07 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ コリメーション及び収束用ワンピースレンズアレイ及び該ワンピースレンズアレイを用いるｌｅｄ発光器
JP2004512670A (ja) * 2000-05-12 2004-04-22 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング オプトエレクトニック素子及びその製造方法
JP2007065080A (ja) * 2005-08-29 2007-03-15 Sony Corp 空間光変調光学装置とこれを用いた虚像光学装置及び投射型画像表示装置
JP2014165333A (ja) * 2013-02-25 2014-09-08 Kyocera Corp 光照射デバイス、光照射モジュールおよび印刷装置
JP2016045306A (ja) * 2014-08-21 2016-04-04 株式会社エンプラス 光束制御部材、面光源装置および表示装置

Also Published As

Publication number Publication date
JPH0241662Y2 (ko) 1990-11-06

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