JPS6210980Y2 - - Google Patents
Info
- Publication number
- JPS6210980Y2 JPS6210980Y2 JP1980061170U JP6117080U JPS6210980Y2 JP S6210980 Y2 JPS6210980 Y2 JP S6210980Y2 JP 1980061170 U JP1980061170 U JP 1980061170U JP 6117080 U JP6117080 U JP 6117080U JP S6210980 Y2 JPS6210980 Y2 JP S6210980Y2
- Authority
- JP
- Japan
- Prior art keywords
- common electrode
- electrodes
- lead wire
- solder
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 24
- 239000002131 composite material Substances 0.000 claims description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 11
- 229910052709 silver Inorganic materials 0.000 description 10
- 239000004332 silver Substances 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000005012 migration Effects 0.000 description 4
- 238000013508 migration Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000010946 fine silver Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】
本考案は放電間隙を有するRC複合部品に関す
る。[Detailed Description of the Invention] The present invention relates to an RC composite component with a discharge gap.
一般にテレビ受像機においては、そのアンテナ
入力回路にカツプリング用（結合用）としてコン
デンサを直列に挿入接続するので、このコンデン
サと並列に放電ギヤツプを設けて避雷する必要が
ある。本考案は、このような避雷、サージ吸収の
機能を持たせたRC複合部品に関する。 Generally, in a television receiver, a capacitor is inserted and connected in series to the antenna input circuit for coupling, so it is necessary to provide a discharge gap in parallel with this capacitor for lightning protection. The present invention relates to an RC composite component that has such lightning protection and surge absorption functions.
第１図Ａ，Ｂはこの種のRC複合部品の従来例
を示し、一面に共通電極１を同心円状に設けた円
板状の誘電体磁器２の他面に、放電間隙d1を有す
る一対の電極３，４と、この一対の電極３，４を
橋絡する抵抗５とを形成し、この一対の電極３，
４の各々にリード線６，７を半田付けなどの手段
によつて固着した構造となつている。 FIGS. 1A and 1B show conventional examples of this type of RC composite component, in which a common electrode 1 is provided concentrically on one surface of a disc-shaped dielectric ceramic 2, and a pair of RC components having a discharge gap d 1 are formed on the other surface. electrodes 3, 4 and a resistor 5 bridging the pair of electrodes 3, 4.
The structure is such that lead wires 6 and 7 are fixed to each of the wires 4 by means of soldering or the like.
前記共通電極１および一対の電極３，４は、銀
微粉末と低融点フリツトガラスとの混合物である
銀ペーストを印刷し、かつ焼付ける方法によつて
形成され、また前記抵抗５はカーボンレジン系抵
抗塗料を印刷塗布することによつて形成される。 The common electrode 1 and the pair of electrodes 3 and 4 are formed by printing and baking a silver paste, which is a mixture of fine silver powder and low-melting frit glass, and the resistor 5 is a carbon resin resistor. It is formed by printing and applying paint.
第２図は上述のRC複合部品の等価回路図であ
り、リード線６，７間に、電極３と共通電極１、
共通電極１と電極４との間の誘電体磁器２による
コンデンサC1、抵抗５による抵抗R1および放電
間隙d1の並列回路を接続した回路構成となつてい
る。 FIG. 2 is an equivalent circuit diagram of the above-mentioned RC composite component. Between the lead wires 6 and 7, the electrode 3, the common electrode 1,
It has a circuit configuration in which a parallel circuit of a capacitor C 1 made of a dielectric ceramic 2, a resistor R 1 made of a resistor 5, and a discharge gap d 1 between the common electrode 1 and the electrode 4 are connected.
この従来のRC複合部品は、電極３，４間に異
常高電圧が印加された場合、その電圧値に応じて
抵抗５または放電間隙d1による放電作用が行なわ
れ、コンデンサC1を異常高電圧から有効に保護
し得ること、電極の形状、構造が比較的単純で、
印刷焼付け形成作業が容易であること、また電極
３，４が左右対称であるため異常電圧の発生に際
して安定な放電作用を繰返すこと等の効果が得ら
れる。 In this conventional RC composite component, when an abnormally high voltage is applied between the electrodes 3 and 4, a discharge action is performed by the resistor 5 or the discharge gap d 1 depending on the voltage value, and the capacitor C 1 is connected to the abnormally high voltage. The shape and structure of the electrode are relatively simple, and the shape and structure of the electrode are relatively simple.
The printing and baking process is easy, and since the electrodes 3 and 4 are symmetrical, stable discharge action can be repeated even when an abnormal voltage is generated.
しかしながら、リード線６，７を、片面に設け
た電極３，４にのみ接続し、共通電極１に対して
はリード線を接続しない構造であるため、リード
線６，７の半田付け作業が面倒で、量産化を図る
上大きな障害となつていた。 However, since the structure is such that the lead wires 6 and 7 are connected only to the electrodes 3 and 4 provided on one side, and the lead wires are not connected to the common electrode 1, the soldering work of the lead wires 6 and 7 is troublesome. This was a major obstacle to mass production.
すなわち、一般にこの種のRC複合部品は、製
造工程における量産性を確保すると同時に、プリ
ント回路基板等への実装作業性を向上させるた
め、第３図Ａ，Ｂに示すように、台板８ａと粘着
テープ８ｂとより成る保持帯８上に、予めリード
線６，７を一定間隔D1を隔てて連続的に保持す
ると共に、該リード線６，７の中間部にアルミニ
ウム線もしくはエナメル線などの半田の付着し難
いダミーリード線９を保持し、リード線６，７と
ダミーリード線９の弾性を利用して、両者間に
RC複合部品１０を連続的に挾み込んで行き、RC
複合部品１０を溶融半田槽中に浸漬させることに
より、リード線６，７をRC複合部品１０の電極
３，４に半田付けする。 That is, in general, this type of RC composite component has a base plate 8a and a base plate 8a, as shown in FIGS. Lead wires 6 and 7 are held continuously in advance at a constant distance D 1 on a holding band 8 made of adhesive tape 8b, and an aluminum wire, enameled wire, etc. Hold the dummy lead wire 9 to which solder does not easily adhere, and use the elasticity of the lead wires 6, 7 and the dummy lead wire 9 to connect the wires between them.
Continuously insert the RC composite parts 10 into the RC
The lead wires 6 and 7 are soldered to the electrodes 3 and 4 of the RC composite component 10 by dipping the composite component 10 into a molten solder bath.
この場合、ダミーリード線９には半田が付着し
ないから、ダミーリード線９が共通電極１に半田
付けされることはなく、回路基板への実装作業時
にこれを除去することができる。 In this case, since no solder adheres to the dummy lead wire 9, the dummy lead wire 9 is not soldered to the common electrode 1, and can be removed during mounting work on the circuit board.
しかし、一つの保持帯８上に、リード線６，７
と、これとは材質を異にするダミーリード線９と
を保持させて行く必要があり、そのテーピング工
程が複雑で、量産性に欠ける欠点があつた。 However, on one retaining band 8, the lead wires 6, 7
In addition, it is necessary to hold the dummy lead wire 9 made of a different material from the dummy lead wire 9, which complicates the taping process and has the drawback of lacking mass productivity.
仮にダミーリード線９をリード線６，７と同質
の材料によつて構成した場合には、半田デイツプ
後にダミーリード線９を切断する工程が必要とな
り、前記と同様に量産性が低下する。 If the dummy lead wire 9 were to be made of the same material as the lead wires 6 and 7, a step of cutting the dummy lead wire 9 would be required after solder dipping, which would reduce mass productivity as described above.
また、ダミーリード線９の当る部分は電極非形
成分とする方法も提案されているが、その分だけ
電極面積が減少し、静電容量の低下または形状の
大形化を招き、さらに電極形成が面倒になる不都
合がある。 In addition, a method has been proposed in which the portion where the dummy lead wire 9 contacts is made into a non-electrode portion, but this reduces the electrode area by that amount, resulting in a decrease in capacitance or an increase in the size of the electrode. This has the disadvantage that it becomes troublesome.
更に、共通電極１が資源的に有限で、コストの
高い銀を主成分として構成されているため、コス
ト高になること、銀が半田中に拡散移行する半田
喰われ現象が発生し、密着性の低下や静電容量不
足等を招き易いこと、シルバーマイグレーシヨン
による絶縁劣化を招き易いこと等の欠点もあつ
た。 Furthermore, since the common electrode 1 is mainly composed of silver, which is limited in terms of resources and is expensive, the cost is high, and the solder eating phenomenon in which silver diffuses into the solder occurs, resulting in poor adhesion. It also had drawbacks such as being susceptible to a decrease in capacitance and insufficient capacitance, as well as being susceptible to insulation deterioration due to silver migration.
本考案は上述する欠点を除去し、ダミーリード
線をリード線と同質の金属材料によつて構成して
も、ダミーリード線が半田付けされることがな
く、保持帯へのリード線のテーピング作業、およ
び半田付け作業が容易で、量産性に優れ、しかも
半田喰われ現象やシルバーマイグレーシヨン等を
発生することがなく、電極材料コストの安価な共
通電極を有するRC複合部品を提供することを目
的とする。 The present invention eliminates the above-mentioned drawbacks, and even if the dummy lead wire is made of the same metal material as the lead wire, the dummy lead wire does not need to be soldered, and the work of taping the lead wire to the retaining band is eliminated. The purpose of the present invention is to provide an RC composite component having a common electrode that is easy to solder, is easy to mass-produce, does not cause solder-eating phenomena, silver migration, etc., and has a low electrode material cost. shall be.
上記目的を達成するため、本考案は、一面に共
通電極を形成した誘電体の他面に、放電間隙を有
する一対の電極と、該一対の電極相互間を橋絡す
る抵抗とを形成し、前記一対の電極の各々にリー
ド線を接続したRC複合部品において、前記共通
電極は、カーボンを導電媒体とする導電性皮膜で
なることを特徴とする。 In order to achieve the above object, the present invention forms a pair of electrodes having a discharge gap on the other side of a dielectric body with a common electrode formed on one side, and a resistor bridging the pair of electrodes, In the RC composite component in which a lead wire is connected to each of the pair of electrodes, the common electrode is made of a conductive film using carbon as a conductive medium.
以下実施例たる添付図面を参照し、本考案の内
容を具体的に説明する。第４図Ａは本考案に係る
RC複合部品の正面図、第４図Ｂは同じくその背
面図である。図において、第１図Ａ，Ｂと同一の
参照符号は機能的に同一性ある構成部分を示して
いる。この実施例では、略円板状に形成された誘
電体磁器１の背面側に、略半円状の共通電極１を
設けてある。該共通電極１は、半田の付着しない
導電性皮膜として構成する。このような導電性皮
膜は、カーボンを導電媒体とする導電性レジス
ト、たとえばカーボンをキシレン、エポキシまた
はフエノール等の熱硬化性合成樹脂に分散混合し
てペースト化したもの、或はカーボンをリン酸カ
ルシウム等の無機物に分散混合してペースト化し
たものを、スクリーン印刷法の手段によつて所定
のパターンとなるように印刷塗布し、かつ焼付け
ることによつて形成する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS The content of the present invention will be specifically described below with reference to the accompanying drawings, which are examples. Figure 4A relates to the present invention.
FIG. 4B is a front view of the RC composite part, and FIG. 4B is a rear view thereof as well. In the figure, the same reference numerals as in FIGS. 1A and 1B indicate functionally identical components. In this embodiment, a substantially semicircular common electrode 1 is provided on the back side of a dielectric ceramic 1 formed in a substantially disk shape. The common electrode 1 is constructed as a conductive film to which solder does not adhere. Such a conductive film is made of a conductive resist using carbon as a conductive medium, such as a paste prepared by dispersing and mixing carbon into a thermosetting synthetic resin such as xylene, epoxy or phenol, or a paste made by dispersing and mixing carbon with a thermosetting synthetic resin such as xylene, epoxy or phenol, or a conductive resist using carbon as a conductive medium. It is formed by dispersing and mixing in an inorganic substance to form a paste, which is printed and coated in a predetermined pattern using a screen printing method, and then baked.
このような構造であると、第３図Ａ，Ｂに示す
ように、当該RC複合部品１０を、保持帯８上に
保持させたリード線６，７およびダミーリード線
９の間に挾み込み、この状態で溶融半田槽中に浸
漬したとき、リード線６，７は電極３，４に半田
付けされるが、ダミーリード線９は、共通電極１
に半田が付着しないため、半田付けされることが
ない。したがつてダミーリード線９は、リード線
６，７と同じ材質のものによつて構成することが
できるし、また回路基板等への実装作業時には容
易に除去することができるから、テーピング工程
や回路実装作業が著るしく単純化され、量産性が
向上する。 With such a structure, as shown in FIGS. 3A and 3B, the RC composite component 10 is inserted between the lead wires 6 and 7 held on the holding band 8 and the dummy lead wire 9. When immersed in a molten solder bath in this state, the lead wires 6 and 7 are soldered to the electrodes 3 and 4, but the dummy lead wire 9 is soldered to the common electrode 1.
Since the solder does not adhere to the surface, it will not be soldered. Therefore, the dummy lead wire 9 can be made of the same material as the lead wires 6 and 7, and can be easily removed during mounting work on a circuit board, etc., so it can be easily removed during the taping process or Circuit mounting work is significantly simplified and mass productivity is improved.
また、共通電極１は従来の銀に代えて、これよ
り遥かに安価な、カーボンを導電媒体とする導電
性レジストによつて形成できるから、材料コスト
が大幅に低減されると共に、銀電極とした場合の
ような半田喰われ現象、シルバーマイグレーショ
ンを生じる余地がなく、信頼性が向上する。 In addition, the common electrode 1 can be formed using a conductive resist using carbon as a conductive medium, which is much cheaper than conventional silver, so the material cost is significantly reduced, and the silver electrode can be used instead of silver. There is no chance of the solder eating phenomenon or silver migration occurring as in the case of the solder, improving reliability.
更に、電極非形成領域を設けて半田付着を阻止
する構成ではなく、共通電極１自体の性質を利用
して半田付着を阻止する構成であるから、共通電
極１の電極面積が縮小することもなく、静電容量
が低下することもない。 Furthermore, since the structure is not a structure in which an electrode non-forming area is provided to prevent solder adhesion, but a structure in which the properties of the common electrode 1 itself are used to prevent solder adhesion, the electrode area of the common electrode 1 is not reduced. , the capacitance does not decrease.
完成品としては、鎖線Ｐで囲まれる範囲に絶縁
コーテイングを施す。 As a finished product, an insulating coating is applied to the area surrounded by the chain line P.
なお、第４図Ａ，Ｂに示す実施例では、誘電体
磁器２の上部に欠落部１１を設けてある。このよ
うな欠落部１１があると、電極３，４および共通
電極１の方向を、該欠落部１１を基準にして定め
ることができるので、電極３，４および共通電極
１の方向性、印刷位置を精度良く定め、当該RC
複合部品を能率良く製造することができる。また
RC複合部品を真空ポンプで吸引して保持帯８上
のリード線６，７およびダミーリード線９の間に
挾み込む際にも、欠落部１１を基準にして挾み込
み方向を定め得るので、テーピング部材への自動
挿入が可能となり、生産性が著るしく向上する。 In the embodiment shown in FIGS. 4A and 4B, a cutout 11 is provided in the upper part of the dielectric ceramic 2. If there is such a missing part 11, the direction of the electrodes 3, 4 and the common electrode 1 can be determined based on the missing part 11, so the directionality of the electrodes 3, 4 and the common electrode 1, the printing position Determine the RC with precision and
Composite parts can be manufactured efficiently. Also
When suctioning the RC composite part with a vacuum pump and inserting it between the lead wires 6 and 7 on the holding band 8 and the dummy lead wire 9, the insertion direction can be determined based on the missing part 11. , automatic insertion into the taping member becomes possible, and productivity is significantly improved.
以上詳説した如く、本考案は、一面に共通電極
を形成した誘電体の他面に、放電間隙を有する一
対の電極と、該一対の電極相互間を橋絡する抵抗
とを形成し、前記一対の電極の各々にリード線を
接続したRC複合部品において、前記共通電極
は、カーボンを導電媒体とする導電性皮膜でなる
ことを特徴とするから、ダミーリード線をリード
線と同質の金属材料によつて構成しても、ダミー
リード線が共通電極に半田付けされることがな
く、保持帯へのリード線のテーピング作業、半田
付け作業および回路基板への実装作業時のダミー
リード線の除去作業が容易で、量産性に富み、し
かも半田喰われ現象やシルバーマイグレーシヨン
を発生することがなく、電極材料コストの安価な
共通電極を有するRC複合部品を提供することが
できる。 As explained in detail above, the present invention includes forming a pair of electrodes having a discharge gap on the other surface of a dielectric body having a common electrode formed on one surface, and a resistor bridging the pair of electrodes. In the RC composite component in which lead wires are connected to each of the electrodes, the common electrode is characterized by being made of a conductive film using carbon as a conductive medium, so the dummy lead wires are made of the same metal material as the lead wires. Even with this configuration, the dummy lead wire is not soldered to the common electrode, making it easier to tape the lead wire to the holding band, solder it, and remove the dummy lead wire during mounting on the circuit board. It is possible to provide an RC composite component having a common electrode that is easy to manufacture, highly suitable for mass production, does not cause solder eating phenomenon or silver migration, and has a low electrode material cost.
第１図Ａ，Ｂは従来のRC複合部品の正面図お
よび背面図、第２図は同じくその等価回路図、第
３図Ａは同じくその製造工程における正面図、第
３図Ｂは第３図ＡのB1−B1線上における断面
図、第４図Ａ，Ｂは本考案に係るRC複合部品の
正面図および背面図である。
１……共通電極、２……誘電体磁器、３，４…
…一対の電極、５……抵抗、６，７……リード
線、９……ダミーリード線。
Figures 1A and B are front and rear views of conventional RC composite parts, Figure 2 is its equivalent circuit diagram, Figure 3A is a front view of the manufacturing process, and Figure 3B is A is a sectional view taken along line B1 - B1 , and FIGS. 4A and 4B are front and rear views of the RC composite component according to the present invention. 1... Common electrode, 2... Dielectric ceramic, 3, 4...
...Pair of electrodes, 5...Resistor, 6, 7...Lead wire, 9...Dummy lead wire.
Claims (1)
電間隙を有する一対の電極と、該一対の電極相互
間を橋絡する抵抗とを形成し、前記一対の電極の
各々にリード線を接続したRC複合部品におい
て、前記共通電極は、カーボンを導電媒体とする
導電性皮膜でなることを特徴とするRC複合部
品。 A pair of electrodes having a discharge gap and a resistor bridging between the pair of electrodes are formed on the other side of the dielectric body with a common electrode formed on one side, and a lead wire is connected to each of the pair of electrodes. An RC composite component according to the present invention, wherein the common electrode is made of a conductive film using carbon as a conductive medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980061170U JPS6210980Y2 (en) | 1980-05-01 | 1980-05-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980061170U JPS6210980Y2 (en) | 1980-05-01 | 1980-05-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56162638U JPS56162638U (en) | 1981-12-03 |
| JPS6210980Y2 true JPS6210980Y2 (en) | 1987-03-16 |
Family
ID=29655571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980061170U Expired JPS6210980Y2 (en) | 1980-05-01 | 1980-05-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6210980Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4933153A (en) * | 1972-08-01 | 1974-03-27 | ||
| JPS4961656A (en) * | 1972-10-18 | 1974-06-14 |
-
1980
- 1980-05-01 JP JP1980061170U patent/JPS6210980Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4933153A (en) * | 1972-08-01 | 1974-03-27 | ||
| JPS4961656A (en) * | 1972-10-18 | 1974-06-14 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56162638U (en) | 1981-12-03 |
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