JPS62109459U - - Google Patents
Info
- Publication number
- JPS62109459U JPS62109459U JP20238085U JP20238085U JPS62109459U JP S62109459 U JPS62109459 U JP S62109459U JP 20238085 U JP20238085 U JP 20238085U JP 20238085 U JP20238085 U JP 20238085U JP S62109459 U JPS62109459 U JP S62109459U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- circuit board
- leads
- heated
- conductive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20238085U JPS62109459U (de) | 1985-12-27 | 1985-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20238085U JPS62109459U (de) | 1985-12-27 | 1985-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62109459U true JPS62109459U (de) | 1987-07-13 |
Family
ID=31166705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20238085U Pending JPS62109459U (de) | 1985-12-27 | 1985-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62109459U (de) |
-
1985
- 1985-12-27 JP JP20238085U patent/JPS62109459U/ja active Pending