JPH03101527U - - Google Patents

Info

Publication number
JPH03101527U
JPH03101527U JP1990009267U JP926790U JPH03101527U JP H03101527 U JPH03101527 U JP H03101527U JP 1990009267 U JP1990009267 U JP 1990009267U JP 926790 U JP926790 U JP 926790U JP H03101527 U JPH03101527 U JP H03101527U
Authority
JP
Japan
Prior art keywords
hole
conductive pattern
semiconductor device
type semiconductor
tab type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990009267U
Other languages
English (en)
Japanese (ja)
Other versions
JPH087634Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990009267U priority Critical patent/JPH087634Y2/ja
Publication of JPH03101527U publication Critical patent/JPH03101527U/ja
Application granted granted Critical
Publication of JPH087634Y2 publication Critical patent/JPH087634Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP1990009267U 1990-01-31 1990-01-31 Tab式半導体装置 Expired - Lifetime JPH087634Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990009267U JPH087634Y2 (ja) 1990-01-31 1990-01-31 Tab式半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990009267U JPH087634Y2 (ja) 1990-01-31 1990-01-31 Tab式半導体装置

Publications (2)

Publication Number Publication Date
JPH03101527U true JPH03101527U (de) 1991-10-23
JPH087634Y2 JPH087634Y2 (ja) 1996-03-04

Family

ID=31512872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990009267U Expired - Lifetime JPH087634Y2 (ja) 1990-01-31 1990-01-31 Tab式半導体装置

Country Status (1)

Country Link
JP (1) JPH087634Y2 (de)

Also Published As

Publication number Publication date
JPH087634Y2 (ja) 1996-03-04

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term