JPS62107478U - - Google Patents

Info

Publication number

JPS62107478U

JPS62107478U JP20169285U JP20169285U JPS62107478U JP S62107478 U JPS62107478 U JP S62107478U JP 20169285 U JP20169285 U JP 20169285U JP 20169285 U JP20169285 U JP 20169285U JP S62107478 U JPS62107478 U JP S62107478U

Authority

JP

Japan

Prior art keywords

printed circuit

circuit board

hole

adhesive

circuit boards

Prior art date

1985-12-25

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000853 adhesive Substances 0.000 claims description 3
• 230000001070 adhesive effect Effects 0.000 claims description 3
• 238000005476 soldering Methods 0.000 claims description 3
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• 239000011889 copper foil Substances 0.000 description 2
• 239000002390 adhesive tape Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1

Cited By (5)