JPS62107429U - - Google Patents
Info
- Publication number
- JPS62107429U JPS62107429U JP19821985U JP19821985U JPS62107429U JP S62107429 U JPS62107429 U JP S62107429U JP 19821985 U JP19821985 U JP 19821985U JP 19821985 U JP19821985 U JP 19821985U JP S62107429 U JPS62107429 U JP S62107429U
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- silk
- radius
- center
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 7
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図はこの考案の実施例による取付け装置に
適用する電解コンデンサの正面図、第2図はその
取付け装置に適用するプリント基板の一部の平面
図、第3図は電解コンデンサを極性を間違えてプ
リント基板に取付けた状態の平面図、第4図は従
来の取付け装置に適用する電解コンデンサの正面
図、第5図はその装置に適用するプリント基板の
一部の平面図である。
1は電解コンデンサ、2a,2bはリード、3
はプリント基板、4はシルク、5a,5bは挿通
穴。なお、図中、同一符号は同一又は相当部分を
示す。
Fig. 1 is a front view of an electrolytic capacitor applied to a mounting device according to an embodiment of this invention, Fig. 2 is a plan view of a part of a printed circuit board applied to the mounting device, and Fig. 3 is an electrolytic capacitor with incorrect polarity. 4 is a front view of an electrolytic capacitor applied to a conventional mounting device, and FIG. 5 is a plan view of a portion of a printed circuit board applied to the device. 1 is an electrolytic capacitor, 2a, 2b are leads, 3
is a printed circuit board, 4 is silk, and 5a and 5b are insertion holes. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
に位置させ他方を半径上に位置させた電解コンデ
ンサと、前記電解コンデンサの底面と略同形同寸
法のシルクを有し該シルクの中央および半径上に
前記リードの挿通穴を形成したプリント基板とを
備えた電解コンデンサの取付け装置。 An electrolytic capacitor in which one of the two leads provided on the bottom surface is located at the center of the bottom surface and the other located on a radius, and a silk having approximately the same shape and size as the bottom surface of the electrolytic capacitor, and a wire at the center of the silk and A mounting device for an electrolytic capacitor, comprising: a printed circuit board having a radius through which the lead is inserted.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19821985U JPS62107429U (en) | 1985-12-25 | 1985-12-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19821985U JPS62107429U (en) | 1985-12-25 | 1985-12-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62107429U true JPS62107429U (en) | 1987-07-09 |
Family
ID=31158701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19821985U Pending JPS62107429U (en) | 1985-12-25 | 1985-12-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62107429U (en) |
-
1985
- 1985-12-25 JP JP19821985U patent/JPS62107429U/ja active Pending