JPS62106666A - Insulated gate transistor - Google Patents
Insulated gate transistorInfo
- Publication number
- JPS62106666A JPS62106666A JP60246284A JP24628485A JPS62106666A JP S62106666 A JPS62106666 A JP S62106666A JP 60246284 A JP60246284 A JP 60246284A JP 24628485 A JP24628485 A JP 24628485A JP S62106666 A JPS62106666 A JP S62106666A
- Authority
- JP
- Japan
- Prior art keywords
- line
- gate line
- gate
- semiconductor layer
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 241000218645 Cedrus Species 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は絶縁ゲート形トランジスタに係り、特にゲーI
−線を横切ってソース線が形成される絶縁ゲート形トラ
ンジスタに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to insulated gate transistors, and particularly to gate I transistors.
- relates to an insulated gate transistor in which a source line is formed across the line.
[従来技術]
以下、従来の絶縁ゲート形トランジスタの一例として、
液晶表示装置等に用いられる薄IV2トランジスタ(以
下、TPTと称する)アレイについて、第3図を用いて
説明する。[Prior Art] Below, as an example of a conventional insulated gate transistor,
A thin IV2 transistor (hereinafter referred to as TPT) array used in liquid crystal display devices and the like will be described with reference to FIG.
第3図は従来のTFTアレイの一構成″J3素を示す図
で、第3図(2L)は部分上面図、第3図(b)はAA
′部の縦断面図である。Fig. 3 is a diagram showing one configuration of a conventional TFT array "J3 element," Fig. 3 (2L) is a partial top view, and Fig. 3 (b) is an AA
FIG.
第3図において、1はガラスまたはプラスチック等から
成る基板でその[―に画素電極7とゲート線2が形成さ
れている。このゲート線2には膨出部2′が形成されて
おり、その端部はゲート電極となる。膨出部2′l−に
は絶縁層6と半導体層5が形成され、その上にソース線
3の膨出部3′の端部であるソース電極とドレイン電極
とが対向して形成されている。このドレイン電極は画素
′−ヒ極7と接続されるドレイン線4の端部である。In FIG. 3, reference numeral 1 denotes a substrate made of glass or plastic, on which a pixel electrode 7 and a gate line 2 are formed. A bulge 2' is formed on this gate line 2, and the end thereof becomes a gate electrode. An insulating layer 6 and a semiconductor layer 5 are formed on the bulge 2'l-, and a source electrode and a drain electrode, which are the ends of the bulge 3' of the source line 3, are formed facing each other thereon. There is. This drain electrode is the end of the drain line 4 connected to the pixel'-hypode 7.
ゲート線2はマトリクス状に形成された各画素電極の間
隙部分の一方向に設けられ、ソース線3は該ゲート線2
を横切る他方向に設けられる。ソース線3は図示したよ
うに絶縁層6と半導体層5とを介して形成される。The gate line 2 is provided in one direction in the gap between each pixel electrode formed in a matrix, and the source line 3 is connected to the gate line 2.
provided in the other direction across the The source line 3 is formed via an insulating layer 6 and a semiconductor layer 5 as shown.
[95明が解決しようとする問題点]
■−記構成のTFTアレイはフォトリソグラフィーを用
いて製造されるが、形状が複雑なため、厳しいアライメ
ント粘度が要求されマスク合わせに非常に手間がかかる
という問題点があった。またTPTのチャネル形状はソ
ース電極、ドレイン電極の配置によって決められるがレ
ジストを塗布し、通常のフォトリソプロセスでソース電
極、ドレイン′屯極を形成する際、電極の角の部分が丸
くなりやすくそのため設計値通りの正確な寸法及び形状
のチャネルを形成することは非常に困難であった。[Problems that 95 Ming attempts to solve] - The TFT array with the above structure is manufactured using photolithography, but because of its complicated shape, strict alignment viscosity is required, making mask alignment very time-consuming. There was a problem. In addition, the shape of the TPT channel is determined by the arrangement of the source and drain electrodes, but when applying resist and forming the source and drain electrodes using a normal photolithography process, the corners of the electrodes tend to become rounded. It has been very difficult to form channels of the correct size and shape to market.
本発明は従来例の問題点を鑑み、アライメント粘度の許
容範囲を大きくし、マスク合わせに要するP間を減少さ
せ、11つ設計値通りのチャネル形状を有した絶縁ゲー
ト形トランジスタを確実にしかも安定して提供すること
を目的としたものである。In view of the problems of the conventional method, the present invention increases the allowable range of alignment viscosity, reduces the distance P required for mask alignment, and ensures stable insulated gate transistors with a channel shape as designed. It is intended to provide the following information.
[問題点を解決するための手段] すなわち、L記の問題点は、ゲート線に対し。[Means for solving problems] In other words, the problem in item L is related to the gate line.
このゲート線の幅と同一又はそれを超える幅とした絶縁
層及び半導体層を介して、前記ゲート線を横切るソース
線とドレイン線とを設けたことを特徴とする未発IJI
の絶縁ゲート杉トランジスタによって解決される。A non-occurring IJI characterized in that a source line and a drain line are provided that cross the gate line via an insulating layer and a semiconductor layer whose width is the same as or exceeds the width of the gate line.
solved by an insulated gate cedar transistor.
[作用]
本発明の絶縁ゲート形トラ〉・ジスタはゲート線に対し
、ゲート線の幅と同−yはそれを超える幅とした絶縁層
及び半導体層を形成したことにより、絶縁ゲート形トラ
ンジスタのチャネル幅がゲート線の幅によって決められ
、im記ゲート線を横切ってソース線とドレイン線とを
設け、ソース線とドレイン線との間の圧路を1没定する
ことにより、絶縁ゲート形トランジスタのチーネル幅が
決めらねるゆ
[実施例]
以下、本発明の実施例を図面を用いて1洋1細〔、′説
り1する。本発明の絶縁ゲート形トランジスタとして液
晶表示装置等に用いられるTFTアレイについて説明す
る。[Function] The insulated gate transistor/transistor of the present invention has an insulating gate transistor with a width equal to or greater than the width of the gate line. The channel width is determined by the width of the gate line, a source line and a drain line are provided across the gate line, and a pressure path is established between the source line and the drain line to form an insulated gate transistor. [Embodiment] Hereinafter, embodiments of the present invention will be explained with reference to the drawings. A TFT array used in liquid crystal display devices and the like as an insulated gate transistor of the present invention will be described.
第1図は本発明のTFTアレイの一実施例の一構成要素
を示す図で、第1図(a)は部分刊面図、第1図(b)
はBB′部の縦断面図である。FIG. 1 is a diagram showing one component of an embodiment of a TFT array of the present invention, FIG. 1(a) is a partial page view, and FIG. 1(b)
is a vertical cross-sectional view of the BB' portion.
第1図に示すように、絶縁層6及び半導体層5がゲート
線2Lに設けられ、前記絶縁層6及び半導体層5の幅は
ゲート線2の幅と同一か又はそれより犬きくなっている
。半導体層5上には前記ゲート線2を横切る方向にソー
ス線3及びドレイン線4がモ行に設けられている。すな
わちゲート線2の一部がゲート′屯極となり、ソース線
3.ドレイン線4の一部がソース電極、ドレイン電極と
なっている。以りの構成のTPTのチャネル部の長さは
、ソース&13とドレイン線4との距離によって決まり
、チャネル幅はゲートaの幅によって決まる。つまり、
チャネル幅はソース電極とドレイン電極との配置には関
係なく一定で安定している第2図は本発明のTFTアレ
イの他の実施例の一構成要素を示す図で、第2図(a)
は部分モ面図、第2図(b)はCC′部の縦断面図であ
る。As shown in FIG. 1, an insulating layer 6 and a semiconductor layer 5 are provided on the gate line 2L, and the widths of the insulating layer 6 and semiconductor layer 5 are equal to or wider than the width of the gate line 2. . On the semiconductor layer 5, source lines 3 and drain lines 4 are provided in rows in a direction crossing the gate line 2. That is, a part of the gate line 2 becomes the gate electrode, and a part of the source line 3. A part of the drain line 4 serves as a source electrode and a drain electrode. The length of the channel portion of the TPT having the above configuration is determined by the distance between the source &13 and the drain line 4, and the channel width is determined by the width of the gate a. In other words,
The channel width is constant and stable regardless of the arrangement of the source electrode and the drain electrode. Fig. 2 is a diagram showing one component of another embodiment of the TFT array of the present invention, and Fig. 2 (a)
is a partial cross-sectional view, and FIG. 2(b) is a longitudinal cross-sectional view of the CC' section.
なお(a)の部分平面図において絶縁層6及び半導体に
/:5は図示していない。Note that /:5 is not shown on the insulating layer 6 and the semiconductor in the partial plan view of (a).
第2図において、ドレイン線4と画素電極7が同一の透
明電極で形成されており、さらにソース線3も透明電極
で形成されている。これらの透Ill’++2極のトに
老導体層5.絶縁層6が形成され、さらにゲート線2が
形成されている。この構成のTFTアレイにおいても、
チャネル部はゲート線の幅によって決まり、チャネル部
はンー・スミ極とトレイン′心極との配置には関係なく
一定で安定している。In FIG. 2, the drain line 4 and the pixel electrode 7 are formed of the same transparent electrode, and the source line 3 is also formed of a transparent electrode. An old conductor layer 5 is placed on top of these transparent Ill'++2 poles. An insulating layer 6 is formed, and further a gate line 2 is formed. Even in the TFT array with this configuration,
The channel part is determined by the width of the gate line, and the channel part is constant and stable regardless of the arrangement of the ``--'' and the train'--center poles.
本発明の絶縁ゲート形トランジスタはゲート線を横切っ
てソース線が形成される、例えば液晶表示装置等に用い
られるTFTアレイのようにマトリクス状に絶縁ゲート
形トランジスタが形成されるものに好適に用いられる。The insulated gate transistor of the present invention is suitably used in a device in which a source line is formed across a gate line, and insulated gate transistors are formed in a matrix, such as a TFT array used in a liquid crystal display device, etc. .
[発明の効果]
以」−1詳細に説II したように、本発明による絶縁
ゲート形トラ/ジスタによれば、アライメント精1■の
許容範囲が大きく、マスク合せの1間を減縮させ、また
エンチングによる角の丸よりがチャネル形状に影響しな
いためJこ設計(fi通りの升ヤネル形状を有した絶縁
ゲーi形トランジスタが確1′:番こ1−かも安定して
イ)・)れ、[゛程+7):ALい削減とコストタウ゛
/が可能ごあS5さら番、′配線部に絶縁ゲート形トラ
ンジスタと1没けΔ′ので、実装に度を向上させること
がで、1ろ。[Effects of the Invention] -1 Detailed Description II As described above, according to the insulated gate type transistor/distor according to the present invention, the tolerance range of alignment precision 1 is large, the mask alignment 1 is reduced, and Since the rounding of the corners due to etching does not affect the channel shape, an insulated game I-type transistor with a box shape according to fi is stable. [Approximately +7): A large reduction in AL and cost is possible.Insulated gate type transistor and 1.DELTA.' are included in the wiring section, so it is possible to improve the mounting efficiency.
第1図は本発明のTFTアレイの一実施例の一構成要素
を示す図で、第1図(a)は部分平面図、第1図(b)
はBB′部の縦断面図である。
第2図は本発明のTFTアレイの他の実施例の一構成要
素を示ず[4で、第2図(a)は部分1i而図、第2図
(b)(よCC’部の縦断面図である。
第3図は従来のrFT:?レイの一構I&要素を示す図
で、第3図(a)は部分平面図、第3図(b)はAA′
部の縦断面図である。
1・・・・・基板
2・・・・・ゲート線
3Il争ll11−ソース線
4番・Φ奔争ドレイン線
5・・・・・半導体層
6・拳・・・1絶縁層
7・・・・・画2に電極
代理人 弁理ト 111 丁 穣 モ@1図
第2 図
(G)FIG. 1 is a diagram showing one component of an embodiment of the TFT array of the present invention, FIG. 1(a) is a partial plan view, and FIG. 1(b) is a partial plan view.
is a vertical cross-sectional view of the BB' portion. FIG. 2 does not show one component of another embodiment of the TFT array of the present invention [4, FIG. 2(a) is a cross-sectional view of the portion 1i, and FIG. Fig. 3 is a diagram showing a conventional rFT:?ray structure I & element, Fig. 3(a) is a partial plan view, and Fig. 3(b) is an AA'
FIG. 1...Substrate 2...Gate line 3I11-Source line 4-ΦDrain line 5...Semiconductor layer 6-Fist...1 Insulating layer 7... ...Electrode agent in picture 2 Patent attorney 111 Ding Mo @1 Figure 2 (G)
Claims (1)
える幅とした絶縁層及び半導体層を介して、前記ゲート
線を横切るソース線とドレイン線とを設けたことを特徴
とする絶縁ゲート形トランジスタ。An insulated gate type characterized in that a source line and a drain line are provided across the gate line through an insulating layer and a semiconductor layer whose width is the same as or exceeds the width of the gate line. transistor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60246284A JPS62106666A (en) | 1985-11-05 | 1985-11-05 | Insulated gate transistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60246284A JPS62106666A (en) | 1985-11-05 | 1985-11-05 | Insulated gate transistor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62106666A true JPS62106666A (en) | 1987-05-18 |
Family
ID=17146254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60246284A Pending JPS62106666A (en) | 1985-11-05 | 1985-11-05 | Insulated gate transistor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62106666A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0690001A (en) * | 1991-05-24 | 1994-03-29 | Samsung Electron Co Ltd | Thin-film transistor for liquid-crystal display device |
US6275278B1 (en) | 1996-07-19 | 2001-08-14 | Hitachi, Ltd. | Liquid crystal display device and method of making same |
US6377323B1 (en) | 1995-07-25 | 2002-04-23 | Hitachi, Ltd. | Liquid crystal display device and method of making same |
JP2008158533A (en) * | 2000-08-28 | 2008-07-10 | Sharp Corp | Active matrix substrate, its manufacturing method, and display unit |
WO2008106335A1 (en) * | 2007-02-26 | 2008-09-04 | 3M Innovative Properties Company | Fabrication of backplanes allowing relaxed alignment tolerance |
WO2008106305A1 (en) * | 2007-02-26 | 2008-09-04 | 3M Innovative Properties Company | Active matrix backplanes allowing relaxed alignment tolerance |
US7629206B2 (en) | 2007-02-26 | 2009-12-08 | 3M Innovative Properties Company | Patterning self-aligned transistors using back surface illumination |
US7649584B2 (en) | 2002-10-21 | 2010-01-19 | Lg Display Co., Ltd. | LCD array substrate and fabrication method thereof |
-
1985
- 1985-11-05 JP JP60246284A patent/JPS62106666A/en active Pending
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0690001A (en) * | 1991-05-24 | 1994-03-29 | Samsung Electron Co Ltd | Thin-film transistor for liquid-crystal display device |
US6839106B2 (en) | 1995-07-25 | 2005-01-04 | Hitachi, Ltd. | Liquid crystal display device and method of making same |
US6377323B1 (en) | 1995-07-25 | 2002-04-23 | Hitachi, Ltd. | Liquid crystal display device and method of making same |
US6424389B1 (en) | 1995-07-25 | 2002-07-23 | Hitachi, Ltd. | Fabrication method of liquid crystal display device |
US6590623B2 (en) | 1995-07-25 | 2003-07-08 | Hitachi, Ltd. | Fabrication method of liquid crystal display device having a reduced number of process steps |
US6667778B1 (en) | 1995-07-25 | 2003-12-23 | Hitachi, Ltd. | Liquid crystal display device having a transparent conductive film formed on an insulating film |
US7271870B2 (en) | 1995-07-25 | 2007-09-18 | Hitachi, Ltd. | Liquid crystal display device and method of making same |
US6275278B1 (en) | 1996-07-19 | 2001-08-14 | Hitachi, Ltd. | Liquid crystal display device and method of making same |
JP2008158533A (en) * | 2000-08-28 | 2008-07-10 | Sharp Corp | Active matrix substrate, its manufacturing method, and display unit |
US7649584B2 (en) | 2002-10-21 | 2010-01-19 | Lg Display Co., Ltd. | LCD array substrate and fabrication method thereof |
WO2008106335A1 (en) * | 2007-02-26 | 2008-09-04 | 3M Innovative Properties Company | Fabrication of backplanes allowing relaxed alignment tolerance |
WO2008106305A1 (en) * | 2007-02-26 | 2008-09-04 | 3M Innovative Properties Company | Active matrix backplanes allowing relaxed alignment tolerance |
US7629206B2 (en) | 2007-02-26 | 2009-12-08 | 3M Innovative Properties Company | Patterning self-aligned transistors using back surface illumination |
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