JPS6210481U - - Google Patents
Info
- Publication number
- JPS6210481U JPS6210481U JP10050385U JP10050385U JPS6210481U JP S6210481 U JPS6210481 U JP S6210481U JP 10050385 U JP10050385 U JP 10050385U JP 10050385 U JP10050385 U JP 10050385U JP S6210481 U JPS6210481 U JP S6210481U
- Authority
- JP
- Japan
- Prior art keywords
- components
- board
- sub
- circuit board
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Structure Of Receivers (AREA)
Description
第１図は本考案の一実施例を示す回路基板実装
構造図、第２図は第１図の分解斜視図、第３図は
本考案の他の実施例を示す断面図である。 １…セラミツク基板、２…プリント基板、３…
シヤーシ。
構造図、第２図は第１図の分解斜視図、第３図は
本考案の他の実施例を示す断面図である。 １…セラミツク基板、２…プリント基板、３…
シヤーシ。
Claims (1)
- リードレスのチツプ部品等の面付部品をセラミ
ツク基板による主基板およびプリント基板による
副基板に面付し、リード付部品等の基板に挿入す
る部品を副基板上のみに配置することを特徴とす
る回路基板実装構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10050385U JPS6210481U (ja) | 1985-07-03 | 1985-07-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10050385U JPS6210481U (ja) | 1985-07-03 | 1985-07-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6210481U true JPS6210481U (ja) | 1987-01-22 |
Family
ID=30970389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10050385U Pending JPS6210481U (ja) | 1985-07-03 | 1985-07-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6210481U (ja) |
-
1985
- 1985-07-03 JP JP10050385U patent/JPS6210481U/ja active Pending