JPS62102526A - Exposing apparatus - Google Patents

Exposing apparatus

Info

Publication number
JPS62102526A
JPS62102526A JP60240458A JP24045885A JPS62102526A JP S62102526 A JPS62102526 A JP S62102526A JP 60240458 A JP60240458 A JP 60240458A JP 24045885 A JP24045885 A JP 24045885A JP S62102526 A JPS62102526 A JP S62102526A
Authority
JP
Japan
Prior art keywords
stage
light emitting
emitting diode
semiconductor wafer
exposure apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60240458A
Other languages
Japanese (ja)
Inventor
Yukio Tokuda
幸夫 徳田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP60240458A priority Critical patent/JPS62102526A/en
Publication of JPS62102526A publication Critical patent/JPS62102526A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To reduce the number of cables between an XY stage and an exposing unit body by detecting the presence or the state of a semiconductor wafer on the stage to emit a light emitting diode connected with a solar battery. CONSTITUTION:A semiconductor wafer 12 is placed on a wafer chuck 13 on an XY stage having an X stage 4X and a Y stage 4Y, attracted and held by the chuck 13. When a detecting element for detecting the presence or the stage of an element to be detected detects the wafer 12, a detecting element connects light emitting diodes 3X, 3Y with a battery 2 connected with a solar battery 1. A detector provided at an exposing apparatus body receives lights from the diodes 3X, 3Y to control the related elements of the body.

Description

【発明の詳細な説明】 [発明の分野] 本発明は半導体ウェハに回路パターンを焼込むのに使用
する露光装置に係るものであり、特に投影露光に関する
機械的、光学的諸元の適正設定の査照確認機構の改良に
係るものである。
[Detailed Description of the Invention] [Field of the Invention] The present invention relates to an exposure apparatus used to print a circuit pattern on a semiconductor wafer, and in particular to an exposure apparatus for properly setting mechanical and optical specifications related to projection exposure. This is related to improvements to the inspection and confirmation mechanism.

[発明の背景] 半導体ウェハに回路パターンを焼込む露光方式には種々
のものがあり、大別してマスクと半導体ウェハとを近接
して等倍投影露光する近接露光方式、ミラーを使用して
特殊形状の光ビームをつくり掃引露光するミラー投影方
式、そしてレンズを使用して回路パターンを縮小し投影
露光する縮小投影露光方式がある。これらの露光装置の
操作において、半導体ウェハの有無、半導体ウェハチャ
ックのサイズの適否(露光しようとする半導体ウェハの
大きさに対して適正な大きさの半導体ウェハチャックが
選択されているか否か)、半導体ウェハの受渡し位H(
θ、x、y、z>の適否、焦点合せの適否、遮蔽マスキ
ング位置の適否、対物レンズ位置の適否等を査照し、そ
れが適正に設定されていることを投影露光前に確認しな
ければならない。このための査照確認機構がXYステー
ジ上に設けられ、装置本体とケーブルにより接続されて
いる。しかし、査照確認事項が多いので、それに応じて
通信ケーブル数は増大し、そのためXYステージの位置
決め、位置精度、姿勢精度に悪影響を及ぼすこととなる
[Background of the Invention] There are various types of exposure methods for printing circuit patterns on semiconductor wafers.They can be roughly divided into close exposure methods, in which a mask and semiconductor wafer are placed close to each other for projection exposure at the same magnification, and methods that use mirrors to create special shapes. There are two types of exposure methods: the mirror projection method, which creates a light beam and sweeps it for exposure, and the reduction projection exposure method, which uses a lens to reduce the circuit pattern and expose it by projection. In the operation of these exposure devices, the presence or absence of a semiconductor wafer, the suitability of the size of the semiconductor wafer chuck (whether a semiconductor wafer chuck of an appropriate size is selected for the size of the semiconductor wafer to be exposed), Semiconductor wafer delivery position H (
θ, x, y, z>, focusing, shielding masking position, objective lens position, etc., and confirm that they are set properly before projection exposure. Must be. An inspection confirmation mechanism for this purpose is provided on the XY stage and is connected to the main body of the apparatus by a cable. However, since there are many items to be inspected and confirmed, the number of communication cables increases accordingly, which adversely affects the positioning, positional accuracy, and posture accuracy of the XY stage.

し発明の目的] 本発明の目的はXYステージと装置本体との間の通信ケ
ーブルを排除してXYステージの移動の円滑と位置決め
精度とを保証する露光装置を提供することにある。
OBJECTS OF THE INVENTION] An object of the present invention is to provide an exposure apparatus that eliminates communication cables between the XY stage and the main body of the apparatus to ensure smooth movement and positioning accuracy of the XY stage.

この目的は本発明に従って光通信を利用することにより
達成される。すなわち太陽電池と、この太陽電池に接続
したバッテリーと、発光ダイオードと、被検知物の存在
または状態の検出に応じて前記のバッテリーに前記の発
光ダイオードを接続する手段とをXYステージに設け、
そして前記の発光ダイオードからの光通信をうけるディ
テクターを装置本体に設けることにより前記の目的は達
成される。
This objective is achieved by utilizing optical communications according to the invention. That is, an XY stage is provided with a solar cell, a battery connected to the solar cell, a light emitting diode, and means for connecting the light emitting diode to the battery in response to detection of the presence or state of an object to be detected,
The above object is achieved by providing a detector in the main body of the device that receives optical communication from the light emitting diode.

[実施例] 第1図は本発明の露光装置の実施例のXYステージの斜
視図であり、第2図は本発明の露光装置のxYステージ
と装置本体との関係を示す略図である。
[Embodiment] FIG. 1 is a perspective view of an XY stage in an embodiment of an exposure apparatus of the present invention, and FIG. 2 is a schematic diagram showing the relationship between the xY stage and the main body of the exposure apparatus of the present invention.

図において、1は太陽電池、2はこの太陽電池に接続し
たバッテリー、3X、3Yは発光ダイオード、4XはX
ステージ、4YはYステージ、5はディテクター、6は
被検知物の存在または状態を検出する検出素子、7はベ
ース定盤、8はL型ミラー、9はX方向駆動用直流モー
タ、10はY方向駆動用直流モータ、11はY方向駆動
送りネジ、12は半導体ウェハ、そして13はウェハチ
ャックを示す。
In the figure, 1 is a solar cell, 2 is a battery connected to this solar cell, 3X and 3Y are light emitting diodes, and 4X is an X
stage, 4Y is a Y stage, 5 is a detector, 6 is a detection element that detects the presence or state of an object to be detected, 7 is a base surface plate, 8 is an L-shaped mirror, 9 is a DC motor for driving in the X direction, 10 is Y 11 is a Y-direction drive feed screw, 12 is a semiconductor wafer, and 13 is a wafer chuck.

動作を説明する。半導体ウェハの露光処理後その半導体
ウェハはXYステージから取除かれ、その次に処理され
る新しい半導体ウェハが受渡し位置にあるXYステージ
上に運ばれ、ウェハチャックにのせられる。ウェハチャ
ックは半導体ウェハを吸着保持する。
Explain the operation. After the semiconductor wafer has been subjected to exposure processing, the semiconductor wafer is removed from the XY stage, and a new semiconductor wafer to be processed next is carried onto the XY stage at the delivery position and placed on a wafer chuck. The wafer chuck holds a semiconductor wafer by suction.

処理済の半導体ウェハをXYステージから取除くとXY
ステージの太陽電池1が投影レンズ(図示せず)の直下
に位置するまでXYステージを移し、そしてシャッター
を開いて太陽電池1に受光させこれを充電する。新しい
半導体ウェハ12が運ばれてくる前にXYステージは受
は渡し位置に戻ってその新しい半導体ウェハ12をウェ
ハチャック13上に受取る。このように処理済半導体ウ
ェハの除去後、新しい半導体ウェハの載置前の時間を利
用して太陽電池1を充電するのであるから、充電のだめ
に余分の時間を費す必要は全くない。この太陽電池1は
バッテリー2に接続されている。バッテリー2は発光ダ
イオード3X、3Yとその付属関連回路の電源として用
いられる。
When the processed semiconductor wafer is removed from the XY stage,
The XY stage is moved until the solar cell 1 on the stage is positioned directly below a projection lens (not shown), and the shutter is opened to allow the solar cell 1 to receive light and charge it. Before a new semiconductor wafer 12 is transferred, the XY stage returns to the transfer position and receives the new semiconductor wafer 12 onto the wafer chuck 13. In this way, since the solar cell 1 is charged using the time after the processed semiconductor wafer is removed and before the new semiconductor wafer is placed, there is no need to spend any extra time on charging. This solar cell 1 is connected to a battery 2. The battery 2 is used as a power source for the light emitting diodes 3X, 3Y and their associated circuits.

半導体ウェハの検出の場合その検出素子6として機械式
スイッチ、光電スイッチ、近接スイッチ等を含む回路を
使用している。この検出素子が半導体ウェハ12を検出
するとその付属回路はバッテリー2に発光ダイオード4
X、4Yを接続して、発光ダイオードを付勢し、発光さ
せる。この発光ダイオードからの光通信を装置本体に設
けたディテクター5が受信し、それに従って装置本体の
関連素子を制御する。
In the case of semiconductor wafer detection, a circuit including a mechanical switch, a photoelectric switch, a proximity switch, etc. is used as the detection element 6. When this detection element detects the semiconductor wafer 12, its attached circuit connects the battery 2 with the light emitting diode 4.
Connect X and 4Y to energize the light emitting diode and cause it to emit light. A detector 5 provided in the main body of the device receives optical communication from this light emitting diode, and controls related elements of the main body of the device accordingly.

この実施例では、Xステージ4xの一隅にX方向とY方
向とに向けて光を送り出すような位置に発光ダイオード
3X、3Yをそれぞれ取付けており、そしてこれらの方
向でそれぞれのディテクター5、たとえば光電素子が装
置本体に設けられている。
In this embodiment, light emitting diodes 3X and 3Y are installed at one corner of the X stage 4x at positions that send out light in the X and Y directions, and each detector 5, for example, a photoelectric sensor, is installed in these directions. An element is provided in the main body of the device.

被検知物の存在または状態を検出する検出素子と同数の
発光ダイオードと、ディテクターとを設けてもよいが、
被検知物の存在または状態を検知する検出素子からの検
出信号をコード化する中央処理ユニットを設け、コード
化した光信号を送るようにすれば発光ダイオード、ディ
テクターともに1個で足りる。
Although the same number of light emitting diodes and detectors as the detection elements for detecting the presence or state of the object to be detected may be provided,
If a central processing unit is provided that encodes a detection signal from a detection element that detects the presence or state of an object to be detected, and the encoded optical signal is sent, one light emitting diode and one detector are sufficient.

[発明の効果] 本発明によりXYステージと装置本体との間の通信ケー
ブルを排除することができ、それによりXYステージの
移動は円滑となり位置決め精度は向上することとなった
[Effects of the Invention] According to the present invention, it is possible to eliminate the communication cable between the XY stage and the main body of the apparatus, and thereby the movement of the XY stage becomes smooth and the positioning accuracy is improved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の露光装置の実施例のXYステージの斜
視図である。 第2図は本発明の露光装置のXYステージと装置本体と
の関係を示す。 図中:に太陽電池、2:バッテリー、3x;3Y:発光
タイオート、4x=4Y:xステージ。 Yステージ、5:ディテクター、6:検出素子。 第1図 MN2図
FIG. 1 is a perspective view of an XY stage of an embodiment of the exposure apparatus of the present invention. FIG. 2 shows the relationship between the XY stage and the main body of the exposure apparatus of the present invention. In the figure: solar cell, 2: battery, 3x; 3Y: light-emitting tie, 4x = 4Y: x stage. Y stage, 5: detector, 6: detection element. Figure 1 MN2 diagram

Claims (1)

【特許請求の範囲】 1、太陽電池と、この太陽電池に接続したバッテリーと
、発光ダイオードと、被検知物の存在または状態の検出
に応じて前記のバッテリーに前記の発光ダイオードを接
続する手段とを設けたXYステージ;及び 前記の発光ダイオードからの光通信をうけるディテクタ
ーを設けた装置本体 を備えたことを特徴とする露光装置。 2、被検知物の存在または状態を検出する検出素子と同
数の発光ダイオードとディテクターとを設けた特許請求
の範囲第1項に記載の露光装置。 3、前記の手段が被検知物の存在または状態を検知する
検出素子からの検出信号をコード化する中央処理ユニッ
トを含み、前記の発光ダイオードとディテクターとをそ
れぞれ少なくとも1個ずつ設けた特許請求の範囲第1項
に記載の露光装置。 4、前記の発光ダイオードはX方向とY方向とにそれぞ
れ1個ずつ設けた特許請求の範囲第1、2または3項に
記載の露光装置。 5、前記の太陽電池は、前記のXYステージの移動によ
り前記の装置本体の投影レンズからの光をうける位置に
くるよう前記のXYステージの上に配置されている特許
請求の範囲第1、2、3または4項に記載の露光装置。
[Claims] 1. A solar cell, a battery connected to the solar cell, a light emitting diode, and means for connecting the light emitting diode to the battery in response to detection of the presence or state of an object to be detected. An exposure apparatus comprising: an XY stage provided with; and an apparatus main body provided with a detector receiving optical communication from the light emitting diode. 2. The exposure apparatus according to claim 1, which is provided with the same number of light emitting diodes and detectors as the number of detection elements that detect the presence or state of the object to be detected. 3. The above-mentioned means includes a central processing unit that encodes a detection signal from a detection element for detecting the presence or state of an object to be detected, and the above-mentioned light emitting diode and at least one detector are each provided. Exposure apparatus according to scope 1. 4. The exposure apparatus according to claim 1, 2 or 3, wherein the light emitting diode is provided one each in the X direction and the Y direction. 5. Claims 1 and 2, wherein the solar cell is placed on the XY stage so that it is placed in a position where it receives light from the projection lens of the apparatus main body as the XY stage moves. , 3 or 4. The exposure apparatus according to item 3 or 4.
JP60240458A 1985-10-29 1985-10-29 Exposing apparatus Pending JPS62102526A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60240458A JPS62102526A (en) 1985-10-29 1985-10-29 Exposing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60240458A JPS62102526A (en) 1985-10-29 1985-10-29 Exposing apparatus

Publications (1)

Publication Number Publication Date
JPS62102526A true JPS62102526A (en) 1987-05-13

Family

ID=17059797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60240458A Pending JPS62102526A (en) 1985-10-29 1985-10-29 Exposing apparatus

Country Status (1)

Country Link
JP (1) JPS62102526A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001338868A (en) * 2000-03-24 2001-12-07 Nikon Corp Illuminance-measuring device and aligner

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001338868A (en) * 2000-03-24 2001-12-07 Nikon Corp Illuminance-measuring device and aligner

Similar Documents

Publication Publication Date Title
TW513617B (en) Lithographic projection apparatus and method of manufacturing a device using a lithographic projection apparatus
US4861162A (en) Alignment of an object
US4955780A (en) Wafer positioning apparatus
CN114975213B (en) Wafer alignment device and alignment method
JP4537061B2 (en) Method and apparatus for mechanically masking a workpiece
EP0448316B1 (en) Substrate holding device
JP3978140B2 (en) Configuration and method for detecting defects on a substrate in a processing tool
TWI283800B (en) Transfer apparatus for transferring an object and method of use thereof and lithographic projection apparatus comprising such a transfer apparatus
CN113310535A (en) Detection apparatus for be used for COB automatic assembly
KR100686899B1 (en) Illumination meter and method of measuring a illuminance using the same, and exposure apparatus
CN115346904A (en) Wafer conveying and measuring system
US6005910A (en) Holding mechanism, and exposure apparatus using the mechanism
US20070109523A1 (en) Reticle cassette and exposure apparatus using reticle cassette
JPS6069714A (en) Object positioning apparatus and method
US5574556A (en) Stage mechanism in exposure apparatus
US20070121092A1 (en) Exposure apparatus
JPS62102526A (en) Exposing apparatus
JP2001159613A (en) Foreign matter inspecting apparatus and exposure apparatus equipped therewith
US4461567A (en) Method of and apparatus for the positioning of disk-shaped workpieces, particularly semiconductor wafers
US5226523A (en) Conveying apparatus and method of controlling the same
EP0135495A2 (en) Positioning system employing differential object positioning sensors
JP2005086093A (en) Aligner and method of controlling stage apparatus
JP2006294954A (en) Exposure system, exposure method, and method for manufacturing microdevice
US6252649B1 (en) Aligner
JPH05217885A (en) Wafer edge exposure apparatus