JPS62100848U - - Google Patents
Info
- Publication number
- JPS62100848U JPS62100848U JP1985191696U JP19169685U JPS62100848U JP S62100848 U JPS62100848 U JP S62100848U JP 1985191696 U JP1985191696 U JP 1985191696U JP 19169685 U JP19169685 U JP 19169685U JP S62100848 U JPS62100848 U JP S62100848U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- eccentric shaft
- lap
- surface plate
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985191696U JPH0422922Y2 (https=) | 1985-12-13 | 1985-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985191696U JPH0422922Y2 (https=) | 1985-12-13 | 1985-12-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62100848U true JPS62100848U (https=) | 1987-06-26 |
| JPH0422922Y2 JPH0422922Y2 (https=) | 1992-05-27 |
Family
ID=31146077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985191696U Expired JPH0422922Y2 (https=) | 1985-12-13 | 1985-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0422922Y2 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52151995A (en) * | 1976-06-14 | 1977-12-16 | Hitachi Ltd | Wafer grinder |
| JPS6090668A (ja) * | 1983-10-19 | 1985-05-21 | Seiko Epson Corp | 鏡面研磨方法 |
-
1985
- 1985-12-13 JP JP1985191696U patent/JPH0422922Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52151995A (en) * | 1976-06-14 | 1977-12-16 | Hitachi Ltd | Wafer grinder |
| JPS6090668A (ja) * | 1983-10-19 | 1985-05-21 | Seiko Epson Corp | 鏡面研磨方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0422922Y2 (https=) | 1992-05-27 |