JPS6196736A - 半導体薄膜の分解装置 - Google Patents
半導体薄膜の分解装置Info
- Publication number
- JPS6196736A JPS6196736A JP21810184A JP21810184A JPS6196736A JP S6196736 A JPS6196736 A JP S6196736A JP 21810184 A JP21810184 A JP 21810184A JP 21810184 A JP21810184 A JP 21810184A JP S6196736 A JPS6196736 A JP S6196736A
- Authority
- JP
- Japan
- Prior art keywords
- hydrofluoric acid
- semiconductor thin
- thin film
- decomposition
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
- Sampling And Sample Adjustment (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21810184A JPS6196736A (ja) | 1984-10-17 | 1984-10-17 | 半導体薄膜の分解装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21810184A JPS6196736A (ja) | 1984-10-17 | 1984-10-17 | 半導体薄膜の分解装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6196736A true JPS6196736A (ja) | 1986-05-15 |
JPH0330981B2 JPH0330981B2 (enrdf_load_html_response) | 1991-05-01 |
Family
ID=16714646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21810184A Granted JPS6196736A (ja) | 1984-10-17 | 1984-10-17 | 半導体薄膜の分解装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6196736A (enrdf_load_html_response) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02192750A (ja) * | 1989-01-20 | 1990-07-30 | Toshiba Corp | 半導体基板表面の不純物回収方法及び装置 |
JP2006058081A (ja) * | 2004-08-18 | 2006-03-02 | Komatsu Electronic Metals Co Ltd | 処理装置 |
JP2006059925A (ja) * | 2004-08-18 | 2006-03-02 | Komatsu Electronic Metals Co Ltd | 処理装置 |
JP2006059926A (ja) * | 2004-08-18 | 2006-03-02 | Komatsu Electronic Metals Co Ltd | 処理装置 |
-
1984
- 1984-10-17 JP JP21810184A patent/JPS6196736A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02192750A (ja) * | 1989-01-20 | 1990-07-30 | Toshiba Corp | 半導体基板表面の不純物回収方法及び装置 |
JP2006058081A (ja) * | 2004-08-18 | 2006-03-02 | Komatsu Electronic Metals Co Ltd | 処理装置 |
JP2006059925A (ja) * | 2004-08-18 | 2006-03-02 | Komatsu Electronic Metals Co Ltd | 処理装置 |
JP2006059926A (ja) * | 2004-08-18 | 2006-03-02 | Komatsu Electronic Metals Co Ltd | 処理装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0330981B2 (enrdf_load_html_response) | 1991-05-01 |
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