JPS6196564U - - Google Patents
Info
- Publication number
- JPS6196564U JPS6196564U JP18071984U JP18071984U JPS6196564U JP S6196564 U JPS6196564 U JP S6196564U JP 18071984 U JP18071984 U JP 18071984U JP 18071984 U JP18071984 U JP 18071984U JP S6196564 U JPS6196564 U JP S6196564U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- conductor
- substrate
- solder resist
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 4
- 239000010409 thin film Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
Landscapes
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18071984U JPS6196564U (ko) | 1984-11-30 | 1984-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18071984U JPS6196564U (ko) | 1984-11-30 | 1984-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6196564U true JPS6196564U (ko) | 1986-06-21 |
Family
ID=30738275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18071984U Pending JPS6196564U (ko) | 1984-11-30 | 1984-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6196564U (ko) |
-
1984
- 1984-11-30 JP JP18071984U patent/JPS6196564U/ja active Pending