JPS6196560U - - Google Patents
Info
- Publication number
- JPS6196560U JPS6196560U JP1984181662U JP18166284U JPS6196560U JP S6196560 U JPS6196560 U JP S6196560U JP 1984181662 U JP1984181662 U JP 1984181662U JP 18166284 U JP18166284 U JP 18166284U JP S6196560 U JPS6196560 U JP S6196560U
- Authority
- JP
- Japan
- Prior art keywords
- metal electrode
- barrier
- barrier metal
- semiconductor substrate
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004888 barrier function Effects 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011229 interlayer Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
Landscapes
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984181662U JPS6196560U (US20030204162A1-20031030-M00001.png) | 1984-11-29 | 1984-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984181662U JPS6196560U (US20030204162A1-20031030-M00001.png) | 1984-11-29 | 1984-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6196560U true JPS6196560U (US20030204162A1-20031030-M00001.png) | 1986-06-21 |
Family
ID=30739204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984181662U Pending JPS6196560U (US20030204162A1-20031030-M00001.png) | 1984-11-29 | 1984-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6196560U (US20030204162A1-20031030-M00001.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008078420A (ja) * | 2006-09-21 | 2008-04-03 | Advantest Corp | 検波素子、受信装置、及び製造方法 |
| JP2009152617A (ja) * | 1996-06-28 | 2009-07-09 | Whitaker Corp:The | 寄生容量が減らされた半導体デバイス |
-
1984
- 1984-11-29 JP JP1984181662U patent/JPS6196560U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009152617A (ja) * | 1996-06-28 | 2009-07-09 | Whitaker Corp:The | 寄生容量が減らされた半導体デバイス |
| JP2008078420A (ja) * | 2006-09-21 | 2008-04-03 | Advantest Corp | 検波素子、受信装置、及び製造方法 |
