JPS6196344A - Clean room - Google Patents

Clean room

Info

Publication number
JPS6196344A
JPS6196344A JP59219206A JP21920684A JPS6196344A JP S6196344 A JPS6196344 A JP S6196344A JP 59219206 A JP59219206 A JP 59219206A JP 21920684 A JP21920684 A JP 21920684A JP S6196344 A JPS6196344 A JP S6196344A
Authority
JP
Japan
Prior art keywords
clean room
clean
filter
floor
rooms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59219206A
Other languages
Japanese (ja)
Inventor
Fumie Miyashita
宮下 文江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59219206A priority Critical patent/JPS6196344A/en
Publication of JPS6196344A publication Critical patent/JPS6196344A/en
Pending legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F7/00Ventilation
    • F24F7/04Ventilation with ducting systems, e.g. by double walls; with natural circulation
    • F24F7/06Ventilation with ducting systems, e.g. by double walls; with natural circulation with forced air circulation, e.g. by fan positioning of a ventilator in or against a conduit
    • F24F7/10Ventilation with ducting systems, e.g. by double walls; with natural circulation with forced air circulation, e.g. by fan positioning of a ventilator in or against a conduit with air supply, or exhaust, through perforated wall, floor or ceiling
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/12Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
    • F24F3/16Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
    • F24F3/167Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed

Abstract

PURPOSE:To reduce the area necessary for installation of an air-conditioning mechanism and further facilitate its management and operation by a structure wherein a plurality of clean rooms are built up in stories, while filters provided between clean rooms, at the ceiling of a clean room and at the floor of a clean room, being put into operation by the single system air conditioning mechanism. CONSTITUTION:A high efficiency filter 42 is mounted at the ceiling part of a down-flow type upper story clean room 41. The high efficiency filter 42 is connected through a plenum chamber 43 to an air conditioner 44. A lower story clean room 47 is provided just below filter 46, which is provided under the floor 45 of the upper story clean room 41. A high efficiency filter 48 is arranged between the filter 46 and the ceiling part of the lower story clean room 47. A filter 50, which is connected through an exhaust chamber 51 to the air conditioner 44, is provided under the floor 49 of the lower story clean room 47.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、クリーンルームに関する。[Detailed description of the invention] [Technical field of invention] The present invention relates to clean rooms.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

現在、半導体装置の製造の際に空気中の塵埃やバクテリ
ア等の付着をきらう製造工程は、クリーンルームで行わ
れている。クリーンルームには、第3図に示すコンベン
ジ冒ナル型のもの10、第4図に示すクロス70−型の
もの20゜第5図に示すダウンフロー型のもの30があ
る。
Currently, the manufacturing process of semiconductor devices is carried out in a clean room to avoid the adhesion of dust, bacteria, etc. in the air. The clean room includes a convection type 10 shown in FIG. 3, a cross 70-type 20° shown in FIG. 4, and a downflow type 30 shown in FIG.

夫々のクリーンルーム10,20.:inは、クリーン
室11.21.31内の清浄度が異なる。
Respective clean rooms 10, 20. :in differs in the cleanliness inside the clean room 11, 21, and 31.

クリーンルーム10,20.30内の清浄度は、1立方
フイート当シに存在する0、5μm以上の粒径の数で表
わされてクラスとして表示される。
The cleanliness inside the clean room 10, 20, 30 is expressed as a class by the number of particles with a diameter of 0.5 μm or more present per cubic foot.

因ミニ、コンベンジ1ナル製の/ リ−7A/ −A1
0では、清浄民はクラス1000以上であり、クロス7
0−聾のクリーンルーム20の1浄度は、クラス100
〜1000Gの範囲にある。
Ina Mini, Convenge 1Nal/Lee-7A/-A1
In 0, the pure people are class 1000 or higher and cross 7
0-1 Cleanliness of Deaf Clean Room 20 is class 100
~1000G range.

また、ダウン70−型のクリーンルーム30の清浄度紘
クラス100以下に保たれるよう罠なっている。このよ
うにクリーン室11,21゜31の清浄度が異なる夫々
のクリーンルーム10.20.30では、給気、排気の
システムも当然具なり、夫々別個に建てる必要があり、
製造工程の内容に応じて所定のクリーンルーム10.2
0.30が使用されている。近年では、半導体装置の微
細化に伴って高い清浄度が要求され、ダウンフロー型の
クリーンルーム30が多く使用されている。しかし、こ
のクリーンルーム30は、前二者のものに比べて連投費
及び運転費が高く、管理も面倒である欠点がある。
In addition, the cleanliness level of the down 70-type clean room 30 is kept at a level of 100 or below. In this way, each clean room 11, 21, 31 has a different level of cleanliness, and each of the clean rooms 10, 20, and 31 naturally has an air supply and exhaust system, and each needs to be constructed separately.
A designated clean room 10.2 depending on the content of the manufacturing process.
0.30 is used. In recent years, with the miniaturization of semiconductor devices, high cleanliness is required, and down-flow type clean rooms 30 are often used. However, this clean room 30 has disadvantages in that it requires higher investment costs and operating costs than the first two, and is also troublesome to manage.

また、半導体装置の製造工程の中には、それほど高い清
浄度を必要としないものもあるので、全ての工程に対し
てダウンフロー畿のクリーンルーム30を設けることは
、経済的な無駄を多くすることになる。このため、製造
工程の内容に応じて清浄度の異なるクリーンルーム10
゜20.30の種類を併用することが行われている。し
かし、このような手段では、広い設置面積を必要とし、
また、内容の異なる空気調節機構を同時に運転して管理
しなければならない面倒がある。更に、クリーンルーム
10 # 20 r30間での製品の受は渡しが面倒で
ある。
Additionally, some semiconductor device manufacturing processes do not require very high cleanliness, so providing a downflow clean room 30 for all processes would result in a lot of economic waste. become. For this reason, clean rooms 10 with different degrees of cleanliness depending on the content of the manufacturing process.
゜20.30 types are used together. However, such means require a large footprint and
Furthermore, it is troublesome to operate and manage air conditioning mechanisms with different contents at the same time. Furthermore, it is troublesome to transfer products between clean rooms 10 #20 r30.

なお、第3図中12は、クリーン室11の上部に取付け
られた高性能フィルター、13は、高性能フィルター1
2と接続した空気調節機である。
In addition, 12 in FIG. 3 is a high-performance filter attached to the upper part of the clean room 11, and 13 is a high-performance filter 1.
This is an air conditioner connected to 2.

また、第4図中22は、クリーン室21の一端部に設け
られた排気室であシ、空気−縮機23に通じている。空
気f4節機23は、給気室2イを介してクリーン室21
内の高性能フィルター25に接続している。
Further, reference numeral 22 in FIG. 4 is an exhaust chamber provided at one end of the clean chamber 21, which communicates with an air compressor 23. The air f4 moderator 23 is connected to the clean room 21 via the air supply room 2a.
It is connected to the high-performance filter 25 inside.

また、第5図中32は、クリーン室31の上部に設けら
れた高性能フィルターであシ、33は、クリーン室3ノ
の床34の下に設けられたフィルターである。高性能フ
ィルター32は、 ゛ 給気室35を介して空気調節機
36に接続し、フィルター33は、排気室37を介して
空気調節機36に接続している。
Further, in FIG. 5, 32 is a high performance filter provided above the clean room 31, and 33 is a filter provided below the floor 34 of the clean room 3. The high-performance filter 32 is connected to the air conditioner 36 through an air supply chamber 35, and the filter 33 is connected to the air conditioner 36 through an exhaust chamber 37.

〔発明の目的〕[Purpose of the invention]

本発明は、異なる清浄度のクリーン室を複数個有すると
共に、設置に必要な面積が小さく、しかも経済的に優れ
、更に、管理及び運転が容易であるクリーンルームを提
供することをその目的とするものである。
An object of the present invention is to provide a clean room that has a plurality of clean rooms with different cleanliness levels, requires a small area for installation, is economical, and is easy to manage and operate. It is.

〔発明の概要〕[Summary of the invention]

本発明は、複数個のクリーン室を多段に積層すると共に
、クリーン室間及びクリーン室の天井と床の部分にフィ
ルターを設け、これらのフィルターを1系統の空気調節
機構で動作させるよう圧したことにより、異なる清浄度
のクリーン室を複数個有すると共に、設置に必要な面積
を小さくシ、シかも経済性に優れて管理及び運転が容易
であるクリーンルームである。
The present invention consists of stacking a plurality of clean rooms in multiple stages, providing filters between the clean rooms and on the ceiling and floor of the clean rooms, and pressuring these filters to operate with a single air conditioning system. Therefore, the clean room has a plurality of clean rooms with different cleanliness levels, requires a small area for installation, is economical, and is easy to manage and operate.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の実施例について図面を参照して説明する
。第1図は、本発明の一実施例の概略構成を示す説明図
である。図中41は、ダウンフロー型の上段クリーン室
である。上段クリーン室41の天井部には、高性能フィ
ルター4が取付けられている。高性能フィルター42は
、給気室43を介して空気調節機44に接続している。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory diagram showing a schematic configuration of an embodiment of the present invention. In the figure, 41 is a down-flow type upper clean room. A high-performance filter 4 is attached to the ceiling of the upper clean room 41. The high-performance filter 42 is connected to an air conditioner 44 via an air supply chamber 43.

上段クリーン室410床45の下には、フィルター46
が設けられている。フィ□ルター46の直下には、下段
クリーン室47が設けられている。フィルター46と下
段クリーン室42の天井部との間には、高性能フィルタ
ー48が設けられている。下段クリーン室470床49
の下には、フィルター50が設けられている。フィルタ
ー50は、排気室5ノを介して空気調節機44に接続し
ている。
A filter 46 is installed under the floor 45 of the upper clean room 410.
is provided. A lower clean chamber 47 is provided directly below the filter 46. A high-performance filter 48 is provided between the filter 46 and the ceiling of the lower clean room 42. Lower clean room 470 beds 49
A filter 50 is provided below. The filter 50 is connected to the air conditioner 44 via the exhaust chamber 5.

このように構成されたクリーンルーム60によれば、空
気調節機44から給気室43を通って供給された空気は
、高性能フィルター42で十分に清浄化されてから上段
クリーン室41内に入る。更に、上段クリーン室41内
の空気は、床45の下のフィルター46とその直下に設
けられた高性能フィルター48を経て十分に清浄化され
てから下段クリーン室42内に供給される。下段クリー
ン室47内の空気は、床50の下のフィルター50で清
浄化されてから排気室51を舒て空気調節機44に導か
れる。
According to the clean room 60 configured in this way, the air supplied from the air conditioner 44 through the air supply chamber 43 is sufficiently purified by the high performance filter 42 before entering the upper clean room 41 . Further, the air in the upper clean chamber 41 is sufficiently purified through a filter 46 under the floor 45 and a high performance filter 48 provided directly below it, and then supplied into the lower clean chamber 42 . The air in the lower clean room 47 is purified by a filter 50 under the floor 50 and then led to the air conditioner 44 through an exhaust chamber 51.

而して、上段クリーン室41と下段クリーン室41の清
浄度を夫々の室内のa箇所で調べたところ、第2図に示
す如く、上段クリーン室4Jはクラス100以下の清浄
度にあフ、下段クリーン室42は、クラス100〜10
000の清浄度に保たれていることが実験的に確認され
た。また、空気調節機44によって上段クリーン室41
を気温が22±0.5℃、湿度が40±5%に保持した
ところ、下段クリーン室47は、気温が25±2℃、湿
度が50±10%に保持されることが判った。このこと
から上段クリーン室4ノ及び下段クリーン室47は共に
半導体装置が製造工程に適した環境を設定できることが
判る。このため、高い清浄度が要求される工程は上段ク
リーン室41で行ない、それほど高い清浄度を必要とし
ない工程を下段クリーン室47で行なうことによル、1
つの連室からなるクリーンルーム仁で半導体装置の製造
を行うことができる。その結果、クリーンルーム60の
設置面積を小さくして経済性を良くすることができる。
When the cleanliness of the upper clean room 41 and the lower clean room 41 was examined at point a in each room, as shown in FIG. 2, the cleanliness of the upper clean room 4J was below class 100. The lower clean room 42 is of class 100 to 10.
It was experimentally confirmed that the cleanliness level was maintained at 0.000. In addition, the upper clean room 41 is controlled by the air conditioner 44.
When the temperature was maintained at 22±0.5° C. and the humidity was maintained at 40±5%, it was found that in the lower clean room 47, the temperature was maintained at 25±2° C. and the humidity was maintained at 50±10%. From this, it can be seen that both the upper clean room 4 and the lower clean room 47 can provide an environment suitable for the manufacturing process of semiconductor devices. Therefore, processes that require high cleanliness are performed in the upper clean room 41, and processes that do not require such high cleanliness are performed in the lower clean room 47.
Semiconductor devices can be manufactured in a clean room consisting of two consecutive rooms. As a result, the installation area of the clean room 60 can be reduced and economical efficiency can be improved.

しかも、空気調節機構を1系統にできるので、その運転
及び管理を容易にできると共に、運転コストを大幅に減
らすことができる。
Moreover, since the air conditioning mechanism can be integrated into one system, its operation and management can be facilitated, and operating costs can be significantly reduced.

なお、実施例では、上段クリーン室4ノと下段クリーン
室47の2層構造のものについて説明したが、必要に応
じて更に複数層のクリーン室を積層しても良い。同様に
上段クリーン室41と下段クリーン室42間のフィルタ
ー46及び高性能フィルター47も複数個積層したもの
としても良い。
In the embodiment, a two-layer structure including the upper clean chamber 4 and the lower clean chamber 47 has been described, but a plurality of layers of clean chambers may be stacked as necessary. Similarly, a plurality of filters 46 and high performance filters 47 between the upper clean chamber 41 and the lower clean chamber 42 may be stacked.

また、上段クリーン室41と下段クリーン室47間に/
ダスビックヌを介在して各クリーン室間で物品の移送が
容易になるようにしても良い。
Also, between the upper clean room 41 and the lower clean room 47,
It is also possible to facilitate the transfer of articles between each clean room by interposing a dusbic tube.

或は、パスがックスの代わシに搬送路を夫々のクリーン
室間に設けても良い。
Alternatively, instead of a path, a conveyance path may be provided between each clean room.

〔発明の効果〕〔Effect of the invention〕

以上説明した如く、本発明に係るクリーンルームによれ
ば、異なる清浄度のクリーン室を複数個有すると共に、
設置に必要な面積が小さく、しかも、経済的に優れ、更
に管理及び運転が容易である等顕著な効果を有するもの
である。
As explained above, the clean room according to the present invention has a plurality of clean rooms with different cleanliness levels, and
It requires a small area for installation, is economical, and has remarkable effects such as being easy to manage and operate.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本発明の一実施例の概略構成を示す説明図、
第2図は、各クリーン室の清浄度を示す特性図、@3図
乃至第5図は、従来のクリーンルームの概略構成を示す
説明図である。 41・・・上段クリーン室、42・・・高性能フィルタ
ー、43・・・給気室、44・・・空気調節機、45・
・・床、46・・・フィルター、47・・・下段クリー
ン室、48・・・高性能フィルター、49・・・床、5
0・・・フィルター、51・・・排気蓋%60・・・ク
リーンルーム。 出願人代理人  弁理士 鈴 江 武 彦第1図 印
FIG. 1 is an explanatory diagram showing a schematic configuration of an embodiment of the present invention,
FIG. 2 is a characteristic diagram showing the cleanliness of each clean room, and Figures 3 to 5 are explanatory diagrams showing the schematic configuration of a conventional clean room. 41... Upper clean room, 42... High performance filter, 43... Air supply room, 44... Air conditioner, 45...
...floor, 46...filter, 47...lower clean room, 48...high performance filter, 49...floor, 5
0... Filter, 51... Exhaust lid %60... Clean room. Applicant's agent Patent attorney Takehiko Suzue Seal in figure 1

Claims (1)

【特許請求の範囲】[Claims]  複数個のクリーン室をフィルターを介して夫夫の該ク
リーン室内が連通するように多段に積層し、かつ、最上
段の該クリーン室の天井部と最下段の該クリーン室の床
部にフィルターを設けると共に、最上段及び最下段の前
記クリーン室に設けられた該フィルターを1系統の空気
調節機構に接続してなることを特徴とするクリーンルー
ム。
A plurality of clean rooms are stacked in multiple stages so that they communicate with each other through filters, and filters are installed on the ceiling of the top clean room and the floor of the bottom clean room. A clean room characterized in that the filters provided in the top and bottom clean rooms are connected to one system of air conditioning mechanism.
JP59219206A 1984-10-18 1984-10-18 Clean room Pending JPS6196344A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59219206A JPS6196344A (en) 1984-10-18 1984-10-18 Clean room

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59219206A JPS6196344A (en) 1984-10-18 1984-10-18 Clean room

Publications (1)

Publication Number Publication Date
JPS6196344A true JPS6196344A (en) 1986-05-15

Family

ID=16731866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59219206A Pending JPS6196344A (en) 1984-10-18 1984-10-18 Clean room

Country Status (1)

Country Link
JP (1) JPS6196344A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62268941A (en) * 1986-05-16 1987-11-21 Hitachi Plant Eng & Constr Co Ltd Clean room
EP0676672A2 (en) * 1994-04-08 1995-10-11 Canon Kabushiki Kaisha Processing system
EP1331454A1 (en) * 2000-10-31 2003-07-30 Shin-Etsu Handotai Co., Ltd Pulling room
KR100475120B1 (en) * 2002-11-27 2005-03-10 삼성전자주식회사 Fabrication system having double layered clean room for producing semiconductor device
JP2006156489A (en) * 2004-11-25 2006-06-15 Sharp Corp Factory for manufacturing article
JP2007115389A (en) * 2005-09-26 2007-05-10 Hoya Corp Method of manufacturing magnetic disk glass substrate and method of manufacturing magnetic disk
WO2013127979A1 (en) * 2012-03-02 2013-09-06 Abn N.V. System for ventilation of clean rooms

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62268941A (en) * 1986-05-16 1987-11-21 Hitachi Plant Eng & Constr Co Ltd Clean room
EP0676672A2 (en) * 1994-04-08 1995-10-11 Canon Kabushiki Kaisha Processing system
EP0676672A3 (en) * 1994-04-08 1996-07-10 Canon Kk Processing system.
US5871587A (en) * 1994-04-08 1999-02-16 Canon Kabushiki Kaisha Processing system for semiconductor device manufacture of otherwise
EP1026549A2 (en) * 1994-04-08 2000-08-09 Canon Kabushiki Kaisha Processing system
EP1026549A3 (en) * 1994-04-08 2000-08-16 Canon Kabushiki Kaisha Processing system
EP1331454A1 (en) * 2000-10-31 2003-07-30 Shin-Etsu Handotai Co., Ltd Pulling room
EP1331454A4 (en) * 2000-10-31 2006-05-17 Shinetsu Handotai Kk Pulling room
KR100475120B1 (en) * 2002-11-27 2005-03-10 삼성전자주식회사 Fabrication system having double layered clean room for producing semiconductor device
JP2006156489A (en) * 2004-11-25 2006-06-15 Sharp Corp Factory for manufacturing article
JP2007115389A (en) * 2005-09-26 2007-05-10 Hoya Corp Method of manufacturing magnetic disk glass substrate and method of manufacturing magnetic disk
WO2013127979A1 (en) * 2012-03-02 2013-09-06 Abn N.V. System for ventilation of clean rooms

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