JPS6194356U - - Google Patents
Info
- Publication number
- JPS6194356U JPS6194356U JP1984178563U JP17856384U JPS6194356U JP S6194356 U JPS6194356 U JP S6194356U JP 1984178563 U JP1984178563 U JP 1984178563U JP 17856384 U JP17856384 U JP 17856384U JP S6194356 U JPS6194356 U JP S6194356U
- Authority
- JP
- Japan
- Prior art keywords
- board
- heat sink
- mounting
- electrical components
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/26175—Flow barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984178563U JPH0322919Y2 (US07714131-20100511-C00038.png) | 1984-11-24 | 1984-11-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984178563U JPH0322919Y2 (US07714131-20100511-C00038.png) | 1984-11-24 | 1984-11-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6194356U true JPS6194356U (US07714131-20100511-C00038.png) | 1986-06-18 |
| JPH0322919Y2 JPH0322919Y2 (US07714131-20100511-C00038.png) | 1991-05-20 |
Family
ID=30736128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984178563U Expired JPH0322919Y2 (US07714131-20100511-C00038.png) | 1984-11-24 | 1984-11-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0322919Y2 (US07714131-20100511-C00038.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009208106A (ja) * | 2008-03-03 | 2009-09-17 | Furukawa Electric Co Ltd:The | コネクタ用めっき角線材料 |
| JP2021145081A (ja) * | 2020-03-13 | 2021-09-24 | 日立Astemo株式会社 | 半導体装置の製造方法および半導体装置 |
-
1984
- 1984-11-24 JP JP1984178563U patent/JPH0322919Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009208106A (ja) * | 2008-03-03 | 2009-09-17 | Furukawa Electric Co Ltd:The | コネクタ用めっき角線材料 |
| JP2021145081A (ja) * | 2020-03-13 | 2021-09-24 | 日立Astemo株式会社 | 半導体装置の製造方法および半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0322919Y2 (US07714131-20100511-C00038.png) | 1991-05-20 |
