JPS6191362A - 銅または銅合金物品の自触媒錫メツキ法 - Google Patents

銅または銅合金物品の自触媒錫メツキ法

Info

Publication number
JPS6191362A
JPS6191362A JP60219273A JP21927385A JPS6191362A JP S6191362 A JPS6191362 A JP S6191362A JP 60219273 A JP60219273 A JP 60219273A JP 21927385 A JP21927385 A JP 21927385A JP S6191362 A JPS6191362 A JP S6191362A
Authority
JP
Japan
Prior art keywords
copper
solution
copper alloy
autocatalytic
tin plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60219273A
Other languages
English (en)
Japanese (ja)
Inventor
アリアン・モレナール
ヤコブス・ヨハネス・クレテイエン・コウマンス
ブリヒツタ・クリスチナ・マリア・メーンデリンク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of JPS6191362A publication Critical patent/JPS6191362A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP60219273A 1984-10-05 1985-10-03 銅または銅合金物品の自触媒錫メツキ法 Pending JPS6191362A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8403033 1984-10-05
NL8403033A NL8403033A (nl) 1984-10-05 1984-10-05 Werkwijze voor het autokatalytisch vertinnen van voorwerpen van koper of een koperlegering.

Publications (1)

Publication Number Publication Date
JPS6191362A true JPS6191362A (ja) 1986-05-09

Family

ID=19844566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60219273A Pending JPS6191362A (ja) 1984-10-05 1985-10-03 銅または銅合金物品の自触媒錫メツキ法

Country Status (5)

Country Link
EP (1) EP0180265B1 (de)
JP (1) JPS6191362A (de)
KR (1) KR860003362A (de)
DE (1) DE3569580D1 (de)
NL (1) NL8403033A (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5334240A (en) * 1990-06-04 1994-08-02 Macdermid, Incorporated Aqueous acidic tin-lead immersion plating bath containing weak acid and weak base
US5104688A (en) * 1990-06-04 1992-04-14 Macdermid, Incorporated Pretreatment composition and process for tin-lead immersion plating
US5173109A (en) * 1990-06-04 1992-12-22 Shipley Company Inc. Process for forming reflowable immersion tin lead deposit
US5143544A (en) * 1990-06-04 1992-09-01 Shipley Company Inc. Tin lead plating solution
US5296268A (en) * 1991-09-03 1994-03-22 Shipley Company Inc. Pretreatment process of tin lead plating
US5169692A (en) * 1991-11-19 1992-12-08 Shipley Company Inc. Tin lead process
DE4238242C2 (de) * 1992-09-17 2003-04-24 Rieger Franz Metallveredelung Verfahren zur Vorbehandlung von Leichtmetallen nach Patent DE 4231052 C2
DE69716222T2 (de) * 1996-06-05 2004-09-16 Sumitomo Light Metal Industries Ltd. Herstellungsverfahren zum zinnplattieren einer kupferröhre von innen
DE19653765A1 (de) * 1996-12-23 1998-06-25 Km Europa Metal Ag Innen verzinntes Kupferrohr und Verfahren zur Beschichtung eines Kupferrohrs
KR101012815B1 (ko) * 2010-07-21 2011-02-08 주식회사 에이엔씨코리아 칩 도금용 약산성 주석 도금액

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2369620A (en) * 1941-03-07 1945-02-13 Battelle Development Corp Method of coating cupreous metal with tin
NL184695C (nl) * 1978-12-04 1989-10-02 Philips Nv Bad voor het stroomloos neerslaan van tin op substraten.

Also Published As

Publication number Publication date
EP0180265B1 (de) 1989-04-19
KR860003362A (ko) 1986-05-23
DE3569580D1 (en) 1989-05-24
NL8403033A (nl) 1986-05-01
EP0180265A1 (de) 1986-05-07

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