JPS6188289U - - Google Patents
Info
- Publication number
- JPS6188289U JPS6188289U JP17337184U JP17337184U JPS6188289U JP S6188289 U JPS6188289 U JP S6188289U JP 17337184 U JP17337184 U JP 17337184U JP 17337184 U JP17337184 U JP 17337184U JP S6188289 U JPS6188289 U JP S6188289U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic device
- heat pipe
- circuit
- circuit components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の一実施例を示すもので電子
装置全体の斜視図、第２図は第１図のＡ−Ａ線断
面図、第３図は第１図のＡ−Ａ線断面と同方向か
ら見た従来技術を示す図である。図において、１
は電子装置、２は回路モジユール、３は回路部品
、４はプリント配線板、５は放熱板、６は電子装
置取り付け台、７は容器、８はガイド、９は蓋、
１０はスクリユウ、１１はマザーボード、１２は
接栓、１６は熱流、１７は放熱用ガイド、１８は
受熱部、１９は放熱部である。なお、各図中同一
符号は同一又は相当部分を示す。
Fig. 1 shows an embodiment of this invention, and is a perspective view of the entire electronic device, Fig. 2 is a cross-sectional view taken along the line A-A in Fig. 1, and Fig. 3 is a cross-sectional view taken along the line A-A in Fig. 1. It is a figure which shows the prior art seen from the same direction. In the figure, 1
is an electronic device, 2 is a circuit module, 3 is a circuit component, 4 is a printed wiring board, 5 is a heat sink, 6 is an electronic device mounting stand, 7 is a container, 8 is a guide, 9 is a lid,
10 is a screw, 11 is a motherboard, 12 is a plug, 16 is a heat flow, 17 is a heat radiation guide, 18 is a heat receiving part, and 19 is a heat radiation part. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
装された回路モジユールを、箱体内に所要数収納
して構成した電子装置において、上記箱体に、上
記回路モジユールの挿入用ガイドを兼ねたヒート
パイプを取り付け、このヒートパイプと上記の放
熱板とを接触させて、回路部品から生じる熱を上
記のヒートパイプを介して電子装置の取り付け台
へ放熱させるようにしたことを特徴とする電子装
置の放熱構造。 In an electronic device configured by storing a required number of circuit modules in a box in which circuit components are mounted on a printed wiring board via a heat sink, the box includes a heat pipe that also serves as a guide for inserting the circuit module. heat dissipation for an electronic device, characterized in that the heat pipe is brought into contact with the heat sink, and the heat generated from the circuit components is radiated to the mounting base of the electronic device via the heat pipe. structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17337184U JPS6188289U (en) | 1984-11-15 | 1984-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17337184U JPS6188289U (en) | 1984-11-15 | 1984-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6188289U true JPS6188289U (en) | 1986-06-09 |
Family
ID=30731024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17337184U Pending JPS6188289U (en) | 1984-11-15 | 1984-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6188289U (en) |
-
1984
- 1984-11-15 JP JP17337184U patent/JPS6188289U/ja active Pending
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