JPS6186068A - プリント基板把持具保持機構 - Google Patents

プリント基板把持具保持機構

Info

Publication number
JPS6186068A
JPS6186068A JP20866884A JP20866884A JPS6186068A JP S6186068 A JPS6186068 A JP S6186068A JP 20866884 A JP20866884 A JP 20866884A JP 20866884 A JP20866884 A JP 20866884A JP S6186068 A JPS6186068 A JP S6186068A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
shaft
soldering
gripper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20866884A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0156866B2 (enExample
Inventor
Teruyuki Shibata
柴田　輝幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP20866884A priority Critical patent/JPS6186068A/ja
Publication of JPS6186068A publication Critical patent/JPS6186068A/ja
Publication of JPH0156866B2 publication Critical patent/JPH0156866B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP20866884A 1984-10-04 1984-10-04 プリント基板把持具保持機構 Granted JPS6186068A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20866884A JPS6186068A (ja) 1984-10-04 1984-10-04 プリント基板把持具保持機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20866884A JPS6186068A (ja) 1984-10-04 1984-10-04 プリント基板把持具保持機構

Publications (2)

Publication Number Publication Date
JPS6186068A true JPS6186068A (ja) 1986-05-01
JPH0156866B2 JPH0156866B2 (enExample) 1989-12-01

Family

ID=16560072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20866884A Granted JPS6186068A (ja) 1984-10-04 1984-10-04 プリント基板把持具保持機構

Country Status (1)

Country Link
JP (1) JPS6186068A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103200781A (zh) * 2013-04-16 2013-07-10 中国电子科技集团公司第二十研究所 一种smd器件的印焊膏装置
CN106385773A (zh) * 2016-10-27 2017-02-08 江门市众能电控科技有限公司 一种电路板的自动浸锡设备及工艺

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103200781A (zh) * 2013-04-16 2013-07-10 中国电子科技集团公司第二十研究所 一种smd器件的印焊膏装置
CN106385773A (zh) * 2016-10-27 2017-02-08 江门市众能电控科技有限公司 一种电路板的自动浸锡设备及工艺

Also Published As

Publication number Publication date
JPH0156866B2 (enExample) 1989-12-01

Similar Documents

Publication Publication Date Title
US6011629A (en) Method of positional alignment of substrate and screen mask in electrical paste screen printing
CN113015353A (zh) 一种用于控制电路板生产的电子元件锡焊设备
JPS6186068A (ja) プリント基板把持具保持機構
CN218735286U (zh) 一种pcb焊点自动喷胶机构
CN212910253U (zh) 贴片机pcb板固定夹具
CN213662084U (zh) 用于pcb板的贴片治具
JPH03236961A (ja) スクリーン印刷におけるパターン位置合せ方法及び装置
CN221110220U (zh) 一种用于柔性电路板加工的焊接装置
CN221748826U (zh) 一种线路板贴片封装的机械夹具
CN117177472B (zh) 一种pcb板生产用退锡设备
CN218051117U (zh) 一种锡焊夹具
JP2000017495A (ja) 電子部品のめっき装置
CN215617938U (zh) 一种pcb板加工夹持装置
JP2591450Y2 (ja) ケーブル保持用ジグ
CN222884897U (zh) 一种焊接定位治具
CN222806822U (zh) 一种pcb板测试治具自适应夹紧机构
CN220781060U (zh) 一种具有夹持功能的线路板点胶装置
JP2757049B2 (ja) 基板のクランプ装置
JPH0230139Y2 (enExample)
CN221966982U (zh) 一种锡焊机定位组件
JPH05262A (ja) 接着剤塗布装置
CN222095153U (zh) 一种门框焊接固定台
CN218976933U (zh) 一种便于零部件对位的线路板
CN224169101U (zh) 一种屏幕组件排线辅助焊接治具
JPH0582976B2 (enExample)