JPS6185888A - Wire circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention [Technical Field] The present invention relates to a wiring method in which an electrode pattern of a display section and a wiring pattern of a printed circuit board are formed by etching a transparent conductive film on a single transparent insulating substrate. It relates to circuit boards.

<Prior Art> Conventionally, in calculators and the like, a printed circuit board and a display section have been formed separately, and further connected by a connecting means such as a flexible board. In such a configuration, since the wiring pattern of the printed circuit board and the display electrode of the display section are formed separately, two
This method has disadvantages in that it is time consuming and requires additional connection means.

In order to overcome this drawback, a method has been proposed in which the wiring pattern of the printed circuit board and the display electrode pattern of the display section are formed on a single transparent insulating substrate.

In this method, as shown in FIG. 2 (a) to (=), a transparent conductive film 2 is formed on a transparent insulating base such as plastic or glass by a vapor deposition sputtering method.
After a wiring pattern is formed on the etching resist 3 (b), etching is performed to form the wiring pattern, so that pattern formation can be performed only once, and there is no need to provide connection means.

However, even in the printed circuit board formed by this method, the transparent electrodes patterned by etching the transparent conductive film 2 are exposed on the surface, so they are easily scratched (particularly in the case of a plastic board), resulting in a decrease in reliability. This is a contributing factor.

Further, since the resistance value is high when using only the transparent electrode, it is necessary to separately apply a metal coating to the wiring pattern other than the display portion that requires transparency to lower the resistance value. This has the drawback of complicating the process and increasing costs.

<Objective of the Invention> The present invention has been made in view of the drawbacks of the conventional art.At least the circuit wiring pattern is formed with a conductive etching resist, and after etching, only the etching resist on the tFM pattern of the display area is etched. The purpose is to provide a printed circuit board that has excellent durability and corrosion resistance and can be obtained at low cost by removing the metal.

<Example> The present invention will be described in detail below based on the figures.

FIGS. 1A to 1B are diagrams illustrating a method for forming a printed circuit board according to the present invention.

A transparent conductive film 2 is formed on a transparent insulating substrate 1 made of plastic or glass by vapor deposition sputtering.b) The wiring circuit portion of the transparent insulating substrate 1 that does not require transparency is coated with an adhesive such as carphone paste. The conductive etching resist 4 is coated with a protective film and resistance value by sequential printing or other methods for the electrodes of the display section that require transparency. of the display area that requires transparency, leaving it as a conductive material to lower the! According to the wired circuit board which has been evaluated by removing only the electrode etching resist 3, since the wired circuit portion is covered with a conductive etching resist, the transparent electrode of the wired circuit portion is protected and durability is improved. Improves corrosion resistance.

Furthermore, it has low resistance without having to cover it with new metal, and parts can be attached directly and crimped easily. Therefore, process simplification and cost reduction can be achieved.

Incidentally, a conductive etching resist can also be used to form electrodes in a display section that requires transparency.

<Effects of the Invention> As described above, in the present invention, when forming the electrode pattern of the display section and the wiring pattern of the printed circuit board on one transparent substrate, at least the wiring pattern of the printed circuit board is conductive. After the etching process, only the etching resist on the electrode pattern of the display area was removed, so the wiring pattern on the printed circuit board was protected, improving durability and corrosion resistance. It has low resistance without the need for new metal coating, can be directly attached to several parts, and can be easily crimped, making it possible to greatly contribute to process simplification and cost reduction.

[Brief explanation of drawings]

1 is a diagram showing a method of forming a conventional printed circuit board; FIG. 1: An insulating substrate such as a niblast stick or glass, 2: A transparent conductive film, 3: A normal etching resist, and 4: A conductive etching resist.

Claims (1)

[Scope of Claims] 1. A wired circuit board in which an electrode pattern of a display portion and a wiring pattern of a wired circuit board are formed by etching a transparent conductive film on one transparent insulating substrate, at least a portion of the wired circuit board. 1. A printed circuit board, characterized in that the wiring pattern is formed of a conductive etching resist, and after etching treatment, only the etching resist on the electrode pattern of the display section is removed.