JPS6183040U - - Google Patents

Info

Publication number
JPS6183040U
JPS6183040U JP16832884U JP16832884U JPS6183040U JP S6183040 U JPS6183040 U JP S6183040U JP 16832884 U JP16832884 U JP 16832884U JP 16832884 U JP16832884 U JP 16832884U JP S6183040 U JPS6183040 U JP S6183040U
Authority
JP
Japan
Prior art keywords
die bonding
tip
clamping jig
bonding arm
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16832884U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16832884U priority Critical patent/JPS6183040U/ja
Publication of JPS6183040U publication Critical patent/JPS6183040U/ja
Pending legal-status Critical Current

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Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例を示す斜視図、第
2図は第1図の防振装置を示す分解斜視図である
。 1…ダイボンデイングアーム、2…コレツト、
3…X−Yテーブル、5…ブラケツト、7…挾持
台具、10…偏心ローラ。
FIG. 1 is a perspective view showing an embodiment of this invention, and FIG. 2 is an exploded perspective view showing the vibration isolator of FIG. 1. 1...Die bonding arm, 2...Collect,
3... X-Y table, 5... bracket, 7... clamping tool, 10... eccentric roller.

Claims (1)

【実用新案登録請求の範囲】 先端に半導体チツプを吸着するコレツトを備え
たダイボンデイングアームがホルダーを介してX
−Yテーブルに固定され、横方向に移動したのち
停止しダイボンデイング動作を行なうダイボンデ
イング装置において、 上記ホルダーのブラケツト先端に設けられダイ
ボンデイングアームを両側から挾持する如く下向
きに突設された挾持治具と、挾持治具の下端の前
後方向に設けられた透孔に回転自在に嵌装され偏
心する軸を有する偏心ローラとからなるダイボン
デイングアーム防振装置を備えたことを特徴とす
るダイボンデイング装置。
[Claims for Utility Model Registration] A die bonding arm with a collet at its tip that sucks a semiconductor chip is
- In a die bonding device that is fixed to a Y table and moves laterally and then stops to perform a die bonding operation, a clamping jig is provided at the tip of the bracket of the holder and protrudes downward so as to clamp the die bonding arm from both sides. A die bonding device comprising a die bonding arm vibration isolator comprising a tool and an eccentric roller that is rotatably fitted into a through hole provided in the front-rear direction at the lower end of the clamping jig and has an eccentric shaft. Device.
JP16832884U 1984-11-06 1984-11-06 Pending JPS6183040U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16832884U JPS6183040U (en) 1984-11-06 1984-11-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16832884U JPS6183040U (en) 1984-11-06 1984-11-06

Publications (1)

Publication Number Publication Date
JPS6183040U true JPS6183040U (en) 1986-06-02

Family

ID=30726104

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16832884U Pending JPS6183040U (en) 1984-11-06 1984-11-06

Country Status (1)

Country Link
JP (1) JPS6183040U (en)

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