JPS6183038U - - Google Patents
Info
- Publication number
- JPS6183038U JPS6183038U JP16727384U JP16727384U JPS6183038U JP S6183038 U JPS6183038 U JP S6183038U JP 16727384 U JP16727384 U JP 16727384U JP 16727384 U JP16727384 U JP 16727384U JP S6183038 U JPS6183038 U JP S6183038U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- moving
- pellet
- mounting area
- pellets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000012544 monitoring process Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984167273U JPH0217481Y2 (cg-RX-API-DMAC7.html) | 1984-11-02 | 1984-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984167273U JPH0217481Y2 (cg-RX-API-DMAC7.html) | 1984-11-02 | 1984-11-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6183038U true JPS6183038U (cg-RX-API-DMAC7.html) | 1986-06-02 |
| JPH0217481Y2 JPH0217481Y2 (cg-RX-API-DMAC7.html) | 1990-05-16 |
Family
ID=30725074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984167273U Expired JPH0217481Y2 (cg-RX-API-DMAC7.html) | 1984-11-02 | 1984-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217481Y2 (cg-RX-API-DMAC7.html) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56164545A (en) * | 1980-05-21 | 1981-12-17 | Hitachi Ltd | Pellet bonding inspection and device therefor |
| JPS5715429A (en) * | 1980-07-02 | 1982-01-26 | Hitachi Ltd | Apparatus for mounting pellet |
| JPS57173339U (cg-RX-API-DMAC7.html) * | 1981-04-28 | 1982-11-01 |
-
1984
- 1984-11-02 JP JP1984167273U patent/JPH0217481Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56164545A (en) * | 1980-05-21 | 1981-12-17 | Hitachi Ltd | Pellet bonding inspection and device therefor |
| JPS5715429A (en) * | 1980-07-02 | 1982-01-26 | Hitachi Ltd | Apparatus for mounting pellet |
| JPS57173339U (cg-RX-API-DMAC7.html) * | 1981-04-28 | 1982-11-01 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0217481Y2 (cg-RX-API-DMAC7.html) | 1990-05-16 |