JPS6182285A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPS6182285A JPS6182285A JP59204814A JP20481484A JPS6182285A JP S6182285 A JPS6182285 A JP S6182285A JP 59204814 A JP59204814 A JP 59204814A JP 20481484 A JP20481484 A JP 20481484A JP S6182285 A JPS6182285 A JP S6182285A
- Authority
- JP
- Japan
- Prior art keywords
- card
- wiring board
- chip
- input
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明はカード状基体にＩＣチップを内蔵したＩＣカー
ドに関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an IC card having an IC chip built into a card-like base.
ＩＣカードはカード状基体にｃｐｕ、メモリ等のＩＣチ
ップを組込んで従来からの磁気カードを発展させた機能
を持たせたものである。このようなＩＣカードの好まし
い構造は、ＩＣチップを搭載し入出力端子を有する両面
配線基板と非熱可塑性材料からなるダミー基板とを熱可
塑性樹脂からなるコアシートを挟んで配置し、さらにそ
の外側に第１および第２のオーバーシートを配置して、
全体をカード状に一体化したものである。この構造のＩ
Ｃカードは配線基板が脱落することがなく、また全体が
コアシー１−を挟んでほぼ対称的になっているため反り
が生じにくいという利点がある。An IC card is a card-like base with built-in IC chips such as a CPU and a memory, and has functions developed from conventional magnetic cards. A preferred structure for such an IC card is to arrange a double-sided wiring board on which an IC chip is mounted and have input/output terminals, a dummy board made of a non-thermoplastic material, sandwiching a core sheet made of a thermoplastic resin, and then placing the first and second oversheets on the
The whole thing is integrated into a card shape. I of this structure
The C card has the advantage that the wiring board does not fall off, and since the entire card is almost symmetrical with the core seat 1- in between, warping is less likely to occur.
この場合、ＩＣチップがカード中央部にあるとＩＣカー
ドの長手方向に曲げ変形が与えられた際に、ストレスが
中央部のＩＣチップに集中してＩＣチップに割れやマイ
クロクラックが生じたり、ボンディング用のワイヤが外
れたりするという問題がある。そこで、例えば特開昭５
８−２２１４．７８号後方に記載されているように、両
面配線基板の端部の入出力端子のほぼ真裏位置にＩＣチ
ップを搭載してワイヤボンディングにより実装し、熱硬
化性樹脂でポツティングした後、カード端部に埋め込む
技術が知られている。このような構造をとるとＩＣチッ
プは結果的にカード端部に実装されることになるため、
ＩＣカードに前述のような曲げ変形が与えられた際に強
いス１ヘレスを受けることはなくなり、曲、げに対する
信、頼性は向上する。In this case, if the IC chip is located in the center of the card, when the IC chip is bent in the longitudinal direction, stress will be concentrated on the IC chip in the center, causing cracks or microcracks in the IC chip, or bonding. There is a problem with the wires coming off. Therefore, for example,
As described in the back of No. 8-2214.78, an IC chip is mounted almost directly behind the input/output terminals on the edge of a double-sided wiring board, mounted by wire bonding, and then potted with thermosetting resin. , a technique of embedding it in the edge of the card is known. With this structure, the IC chip will be mounted on the edge of the card, so
When the IC card is subjected to the above-mentioned bending deformation, it is no longer subjected to strong scratches, and its reliability against bending and scratches is improved.
しかしながら、この構造では耐湿性が劣化することが確
認された。すなわちＩＣカードへの湿気の侵入経路を考
えると、表面部材であるオーバーシートを通してよりも
、オーバーシート表面上に露出している入出力端子とオ
ーバーシートとの界面から両面配線基板に設けられたス
ルーホールを通り、さらに基板とモールド用の熱可塑性
樹脂との界面から侵入する経路が支配的である。従って
、上記のようにＩＣチップと人出ノｊ端子とか基板を挟
んで対向した構造の場合は、両者間の距離が補結て珈く
なるため、湿気が侵入しやくなるのである。However, it was confirmed that this structure deteriorates moisture resistance. In other words, considering the route for moisture to enter the IC card, it is better to enter the through hole provided on the double-sided wiring board from the interface between the input/output terminals exposed on the surface of the oversheet and the oversheet than through the oversheet, which is the surface member. The predominant route is through the holes and further through the interface between the substrate and the thermoplastic resin for molding. Therefore, in the case of a structure in which the IC chip and the output terminal are opposed to each other with a substrate in between, as described above, the distance between the two is compensated for, making it easy for moisture to enter.
本発明の目的は、カードに曲げ変形が与えられたどきに
ＩＣデツプにストレスが加わることが少なく、しかも耐
湿性にも優れた構造のＩＣカードを提供することにある
。An object of the present invention is to provide an IC card having a structure in which less stress is applied to the IC depth when the card is subjected to bending deformation, and which also has excellent moisture resistance.
本発明は上記目的を達成するため、ＩＣチップを搭載し
、かつ外部との接続のための入出力端子を有する配線基
板と、非熱可塑性材料からなるダミー基板とを熱可塑性
樹脂からなるコアシートを挟んで配置し、さらに配線基
板およびダミー基板の、コアシートへの対向面と反対側
の面に熱可塑性樹脂からなる第１および第２のオーバー
シー１〜を配置して、これら配線基板、ダミー基板、コ
アシート、第１および第２のオーバーシーｊ・をカード
状に一体化してなるＩＣｊＪ−ドにおいて、配線基板の
長手方向一端側にＩＣチップを搭載し、他端側に入出力
端子を形成したことを特徴としている。In order to achieve the above object, the present invention combines a wiring board on which an IC chip is mounted and has input/output terminals for connection with the outside, a dummy board made of a non-thermoplastic material, and a core sheet made of a thermoplastic resin. are placed in between, and first and second oversea 1 to made of thermoplastic resin are placed on the surface of the wiring board and the dummy board opposite to the surface facing the core sheet, and these wiring boards, In an IC card formed by integrating a dummy board, a core sheet, and a first and second oversea board into a card, an IC chip is mounted on one longitudinal end of the wiring board, and input/output terminals are mounted on the other end. It is characterized by the formation of
ここで、配線基板は例えばガラス繊維にエポキシ、ＢＴ
レジン等を含浸させてなる縦横比が３以上の細長い形状
のプリント基板が用いられ、ＩＣチップおよび入出力端
子はこの基板の長手方向両端にそれぞれ配置される。こ
の場合、ＩＣチップと入出力端子とは配線基板の互いに
反対側の面に設けられることが望ましい。また、ＩＣチ
ップの最内、端と入出力端子の最内端との距離は本発明
の目的からは長い程よく、後述するように３５．以上、
特に４０ｓ以上が好適である。Here, the wiring board is, for example, made of glass fiber with epoxy, BT
An elongated printed circuit board impregnated with resin or the like and having an aspect ratio of 3 or more is used, and an IC chip and input/output terminals are arranged at both longitudinal ends of this board. In this case, it is desirable that the IC chip and the input/output terminals be provided on opposite sides of the wiring board. Further, from the purpose of the present invention, the longer the distance between the innermost end of the IC chip and the innermost end of the input/output terminal, the better. that's all,
In particular, 40 seconds or more is suitable.
一方、ダミー基板としては例えばＣｕ、ＡＩ２゜ステン
レス＋’ ３ｎ、ＭＯ，、Ｗ等からなる金Ｒ箔、または
ポリイミド、ＰＥＴ、ポリカーボネート。On the other hand, the dummy substrate is, for example, gold R foil made of Cu, AI2° stainless steel +'3n, MO, W, or polyimide, PET, polycarbonate.
ポリサル７オン等の樹脂のシート、あるいはこれらの樹
脂とガラスｍ維、炭素繊維等を複合させたコンポジンｌ
−シートが使用される。このダミー基板はコアシートを
中心としたカード断面両側の熱５一
応力のバランスをとり、カード内に配線基板を入れたこ
とにより反りが生じないようにするためのものである。Sheets of resins such as polysal 7on, or composites made by combining these resins with glass fibers, carbon fibers, etc.
- A sheet is used. This dummy board is used to balance the heat stress on both sides of the card cross section around the core sheet, and to prevent warping from occurring when the wiring board is placed inside the card.
また、コアシー１〜およびオーバーシートとしては塩化
ビニルが好適である。Furthermore, vinyl chloride is suitable for the core sheets 1 to 1 and the oversheet.
配線基板およびダミー基板の縦横寸法は、コアシートお
よびオーバーシートと同じでもよいが、これらより小さ
い方が好適である。その場合、ＩＣカードの平坦性を良
くするために、配線基板と第１のオーバーシートとの間
に配線基板に対向した位置に開口部を有するバッファシ
ートを挿入することが望ましい。The vertical and horizontal dimensions of the wiring board and the dummy board may be the same as those of the core sheet and the oversheet, but preferably smaller than these. In that case, in order to improve the flatness of the IC card, it is desirable to insert a buffer sheet having an opening at a position facing the wiring board between the wiring board and the first oversheet.
第１図は本発明の一実施例に係るＩＣカードの構造を示
す展開斜視図、第２図は断面図である。FIG. 1 is an exploded perspective view showing the structure of an IC card according to an embodiment of the present invention, and FIG. 2 is a sectional view.
図において、両面配線基板１は例えばガラスＢＴレジン
に銅箔を張り、エツチングにより入出力端子２および図
示しない回路網を形成したもので、入出力端子２および
回路網が形成された面と反対側の面上にＩＣチップ３が
搭載され、ワイヤ４によりボンディングされて実装され
ている。両−６＝
面配置！基板１は例えば厚みが０．１５ｍでフレキシど
“リティを有し、また縦横寸法は１８＃Ｘ ７１’ｍｍ
と、ＩＣカードの外形寸法より小さくなっている。さら
に、入出力端子２の形成位置およびＩＣチップ３の搭載
位置はそれぞれ配線基板１の長手方向両側であり、入出
力端子２の最内端（図で右端）とＩＣチップ３の最内端
（図で左端）との距ＭＣは４０ｍｒｎとしである。In the figure, a double-sided wiring board 1 is, for example, a glass BT resin covered with copper foil and etched to form input/output terminals 2 and a circuit network (not shown), and the side opposite to the surface on which the input/output terminals 2 and the circuit network are formed. An IC chip 3 is mounted on the surface thereof, and is bonded and mounted with wires 4. Both -6 = surface arrangement! For example, the substrate 1 has a thickness of 0.15 m, has flexibility, and has vertical and horizontal dimensions of 18 mm x 71' mm.
This is smaller than the external dimensions of an IC card. Further, the formation position of the input/output terminal 2 and the mounting position of the IC chip 3 are respectively on both sides in the longitudinal direction of the wiring board 1, and the innermost end of the input/output terminal 2 (the right end in the figure) and the innermost end of the IC chip 3 ( The distance MC from the left end in the figure is 40 mrn.
この両面配線基板１のＩＣチップ３の搭載面に対向して
、コアシート５が設けられている。このコアシート５は
例えば厚さ０．３８Ｍの塩化ビニルシートであり、ＩＣ
チップ３に対向した位置に開口部６を有する。A core sheet 5 is provided opposite the surface of the double-sided wiring board 1 on which the IC chip 3 is mounted. This core sheet 5 is, for example, a vinyl chloride sheet with a thickness of 0.38M, and is
It has an opening 6 at a position facing the chip 3.
また、コアシート５を挟んで両面配線基板１の反対側に
、配線基板１と同寸法のダミー基板７が配置されている
。このダミー基板７としてはＩＣカードの全厚を極力抑
えるために例えば厚さ３０μｍ程度のＣｕ箔が用いられ
る。このダミー基板７にもコアシート５と同様に、両面
配線基板１上のＩＣチップ３に対向した位置に開口部８
が形成されている。Further, on the opposite side of the double-sided wiring board 1 with the core sheet 5 in between, a dummy board 7 having the same dimensions as the wiring board 1 is arranged. As this dummy board 7, a Cu foil having a thickness of about 30 μm is used, for example, in order to suppress the total thickness of the IC card as much as possible. Similar to the core sheet 5, this dummy board 7 also has an opening 8 at a position facing the IC chip 3 on the double-sided wiring board 1.
is formed.
両面配線基板１上に、バッファシート９が配置されてい
る。このバッファシート９はＩＣカードの平坦性を良く
する目的で必要に応じて設けられるもので、例えば厚さ
０．１５ｍｍの塩化ビニルシー１へからなり、両面配線
基板１に対向した位置に開口部１０を有する。A buffer sheet 9 is arranged on the double-sided wiring board 1. This buffer sheet 9 is provided as necessary for the purpose of improving the flatness of the IC card, and is made of, for example, a vinyl chloride sheet 1 with a thickness of 0.15 mm. has.
そして、バッファシート９の外側およびダミー基板７の
外側に、例えば厚さ０．１履の塩化ビニルからなる第１
および第２のオーバーシート１１゜１２がそれぞれ配置
されている。なお、第１のオーバーシート１１には、両
面配線基板１上の入出力端子２に対向した位置に、これ
ら入出力端子２を露出させるための開口部１３が形成さ
れている。Then, on the outside of the buffer sheet 9 and the outside of the dummy substrate 7, a first layer made of vinyl chloride with a thickness of 0.1 foot, for example, is placed.
and second oversheets 11 and 12 are arranged, respectively. Note that openings 13 for exposing the input/output terminals 2 on the double-sided wiring board 1 are formed in the first oversheet 11 at positions facing the input/output terminals 2 on the double-sided wiring board 1 .
以上の各部材が熱プレスにより全体としてカード状に一
体化され、さらに外形打抜きを行なうことにより、厚さ
０．８ｍｍのＩＣカードが構成される。The above-mentioned members are integrated into a card shape by hot pressing, and the outer shape is further punched to form an IC card having a thickness of 0.8 mm.
なお、各部材間の接着にはボッ１〜メル１〜接着剤（図
示せず）を用いた。Incidentally, Bot 1 to Mel 1 to adhesive (not shown) was used for adhesion between each member.
こうして構成された本発明に基＜ＩＣカードは、ＩＣチ
ップ３が入出力端子２の設けられている端部とは反対側
の端部に配置されていることから、耐曲げ性が良好であ
るばかりでなく、耐湿性も従来の構造のものに比べて格
段に向上することが確認された。以下、このＩＣカード
について本発明者が行なった耐曲げ試験および耐湿性試
験の結果を説明する。The IC card based on the present invention thus configured has good bending resistance because the IC chip 3 is disposed at the end opposite to the end where the input/output terminal 2 is provided. In addition, it was confirmed that the moisture resistance was significantly improved compared to the conventional structure. Below, the results of the bending resistance test and moisture resistance test conducted by the inventor on this IC card will be explained.
耐曲げ試゛験はＩ’ Ｓ Ｏの最新提案に従い′、第３
図のように定義される曲げ量ｄ＝’２０．の曲げを１分
間に３０回のサイクルで１０００回与え、２５０回毎に
動作の確認を行なった。距離りの最適値はＱ＝１０ｍｍ
。The bending resistance test was carried out in accordance with the latest proposal of I'SO'.
Bending amount d='20 defined as shown in the figure. Bending was applied 1000 times at a cycle of 30 times per minute, and the operation was confirmed every 250 times. The optimum distance is Q=10mm
.
（２−３０ｍｍ、 （２＝３５ｍｍ、 ／ｌ＝４０ｔｒ
ｍのサンプルを試作し、上記の耐曲げ試験を施した後、
良品率を比較することにより求めた。入出力端子２の最
内端はＩＣカード端部より １９．８．７＃であるので
、クー１０ｍではＩＣチップ３はＩＣカードのほぼ中央
部に位置することになり、またＱ＝３５ｍｍ、 Ａ＝４
０ｒｔｗｎの場合はＩＣチップ３はＩＣカードの端部（
図で右端）からそれぞれ３０Ｍ以内、２５馴以内の領域
に配置される。この耐曲げ試験の結果を第１表に示す。(2-30mm, (2=35mm, /l=40tr
After making a sample of m and subjecting it to the above bending test,
It was determined by comparing the non-defective product rate. Since the innermost end of the input/output terminal 2 is 19.8.7# from the end of the IC card, the IC chip 3 will be located almost at the center of the IC card at a distance of 10 m, and Q = 35 mm, A =4
In the case of 0rtwn, the IC chip 3 is located at the end of the IC card (
They are located within 30M and 25M from the right end in the figure, respectively. The results of this bending resistance test are shown in Table 1.
第１表
一方、耐湿性試験は６０’Ｃ，９０％Ｒｌ−１の条イ４
で中間でラップをとりながら１ｏｏｏＨまで行なった。Table 1: On the other hand, the moisture resistance test was carried out at 60'C, 90% Rl-1.
I continued until 1oooH, taking laps in the middle.
Ｃの最適値はＱ−１０ｍｒｎからρ−５ｍｍずつＩＣデ
ツプ′３の搭載位置をＩＣカード端部側（図で右側）に
寄せたサンプルを用いることにより求めた。この耐湿性
試験の結果を第２表に示す。The optimum value of C was determined by using a sample in which the mounting position of the IC depth '3 was moved toward the end of the IC card (to the right in the figure) by ρ-5 mm from Q-10 mrn. The results of this moisture resistance test are shown in Table 2.
第２表
第１表、第２表に示されるように、りが大きくなるに伴
い耐曲げ性、耐湿性共に向上し、特に３５ｍ以上が最適
であることがわかる。（２＝４５ｍｍでは耐湿性におい
て逆に低下が見られるが、これはＩＣカードの長手方向
の外形寸法が８５ｍｍである関係で、両面配線基板１の
図で右端がＩＣカードの右端ぎりぎりの位置までくるた
めに、その部分の接着には接着剤を用いなければならず
、その結果、両面配線基板１とコアシート５およびオー
バーシートの接着界面からも湿気が浸透するようになり
、湿気の侵入口とＩＣチップ３の位置を離したことによ
る効果がなくなるからである。従って、ＩＣカードの外
形寸法まで考慮すれば、℃の好ましい範囲は３５ ｍｍ
以上、４０ｍｍ以下ということになる。As shown in Tables 1 and 2 of Table 2, it can be seen that as the radius increases, both the bending resistance and moisture resistance improve, and in particular, 35 m or more is optimal. (If 2 = 45 mm, there is a decrease in moisture resistance, but this is because the external dimension in the longitudinal direction of the IC card is 85 mm, so the right edge of the double-sided wiring board 1 in the figure is almost the right edge of the IC card.) Therefore, an adhesive must be used to bond that part, and as a result, moisture can penetrate from the adhesive interface between the double-sided wiring board 1, the core sheet 5, and the oversheet, creating an entry point for moisture. This is because the effect of separating the position of the IC chip 3 is lost. Therefore, if the external dimensions of the IC card are taken into consideration, the preferred range of °C is 35 mm.
In other words, the distance is 40 mm or less.
以上説明したように、本発明によるＩＣカードは耐曲げ
性および耐湿性が共に良好であるという利点を有する。As explained above, the IC card according to the present invention has the advantage of having good bending resistance and moisture resistance.
なお、本発明は上記した実施例に限定されるものではな
く、各部の材質、形状等、本発明の要旨を逸脱しない範
囲で種々変更することができる。Note that the present invention is not limited to the above-described embodiments, and the materials, shapes, etc. of each part can be changed in various ways without departing from the gist of the present invention.
第１図は本発明の一実施例に係るＩＣカードの展開斜視
図、第２図は同ＩＣカードの断面図、第３図はＩＣカー
ドの耐曲げ試験における曲げ量の定義を説明するための
図である。
１・・・両面配線基板、２・・・入出力端子、３・・・
ＩＣチップ、４・・・ボンディング用ワイヤ、５・・・
コアシート、６・・・開口部、７・・・ダミー基板、８
・・・開口部、９・・・バッファシー１〜．１０・・・
開口部、１１・・・第１のオーバーシート、１２・・・
第２のオーバーシー１−１１３・・・開口部。
第１図
第２図
第３図Fig. 1 is an exploded perspective view of an IC card according to an embodiment of the present invention, Fig. 2 is a sectional view of the IC card, and Fig. 3 is a diagram for explaining the definition of the amount of bending in the bending test of the IC card. It is a diagram. 1... Double-sided wiring board, 2... Input/output terminal, 3...
IC chip, 4... bonding wire, 5...
Core sheet, 6... Opening, 7... Dummy board, 8
... opening, 9... buffer sea 1~. 10...
Opening, 11...first oversheet, 12...
2nd Oversea 1-113...opening. Figure 1 Figure 2 Figure 3
Claims (2)
入出力端子を有する配線基板と、非熱可塑性材料からな
るダミー基板とを熱可塑性樹脂からなるコアシートを挟
んで配置し、さらに前記配線基板およびダミー基板の前
記コアシートへの対向面と反対側の面に熱可塑性樹脂か
らなる第１および第２のオーバーシートを配置して、こ
れら配線基板、ダミー基板、コアシート、第１および第
２のオーバーシートをカード状に一体化してなるＩＣカ
ードにおいて、前記配線基板の長手方向一端側に前記Ｉ
Ｃチップを搭載し、他端側に前記入出力端子を形成した
ことを特徴とするＩＣカード。(1) A wiring board on which an IC chip is mounted and has input/output terminals for connection with the outside, and a dummy board made of a non-thermoplastic material are placed with a core sheet made of thermoplastic resin in between, and First and second oversheets made of thermoplastic resin are arranged on the surfaces of the wiring board and the dummy board opposite to the faces facing the core sheet, and the wiring board, the dummy board, the core sheet, the first and an IC card formed by integrating a second oversheet into a card shape, wherein the I
An IC card equipped with a C chip and having the input/output terminal formed on the other end thereof.
離が３５ｍｍ以上であることを特徴とする特許請求の範
囲第１項記載のＩＣカード。(2) The IC card according to claim 1, wherein the distance between the innermost end of the IC chip and the innermost end of the input/output terminal is 35 mm or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59204814A JPS6182285A (en) | 1984-09-29 | 1984-09-29 | Ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59204814A JPS6182285A (en) | 1984-09-29 | 1984-09-29 | Ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6182285A true JPS6182285A (en) | 1986-04-25 |
Family
ID=16496815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59204814A Pending JPS6182285A (en) | 1984-09-29 | 1984-09-29 | Ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6182285A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61157990A (en) * | 1984-12-29 | 1986-07-17 | Kyodo Printing Co Ltd | Ic card |
| JPS62290590A (en) * | 1986-06-11 | 1987-12-17 | 大日本印刷株式会社 | Ic card and ic module for ic card |
| EP0417887A2 (en) * | 1989-09-09 | 1991-03-20 | Mitsubishi Denki Kabushiki Kaisha | IC card |
| US6554194B1 (en) * | 1998-09-18 | 2003-04-29 | Hitachi, Ltd. | IC card and its manufacturing method |
| JP2011129021A (en) * | 2009-12-21 | 2011-06-30 | Toppan Printing Co Ltd | Card |
| CN103331789A (en) * | 2013-07-22 | 2013-10-02 | 李中伟 | Wooden card manufacturing technology and wooden card |
-
1984
- 1984-09-29 JP JP59204814A patent/JPS6182285A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61157990A (en) * | 1984-12-29 | 1986-07-17 | Kyodo Printing Co Ltd | Ic card |
| JPS62290590A (en) * | 1986-06-11 | 1987-12-17 | 大日本印刷株式会社 | Ic card and ic module for ic card |
| EP0417887A2 (en) * | 1989-09-09 | 1991-03-20 | Mitsubishi Denki Kabushiki Kaisha | IC card |
| US5327010A (en) * | 1989-09-09 | 1994-07-05 | Ryoden Kasei Co., Ltd. | IC card having adhesion-preventing sheets |
| US6554194B1 (en) * | 1998-09-18 | 2003-04-29 | Hitachi, Ltd. | IC card and its manufacturing method |
| JP2011129021A (en) * | 2009-12-21 | 2011-06-30 | Toppan Printing Co Ltd | Card |
| CN103331789A (en) * | 2013-07-22 | 2013-10-02 | 李中伟 | Wooden card manufacturing technology and wooden card |
| CN103331789B (en) * | 2013-07-22 | 2015-08-05 | 李中伟 | A kind of wooden card manufacture craft and wooden card |
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