JPS6179763A - Vapor deposition device - Google Patents

Abstract

PURPOSE:To deposit a film contg. no impurities by evaporation on a substrate while making possible the control of a vapor deposition speed in the stage of forming said film by evaporation of a metal or compd. on the substrate by using the metal or compd. for vapor deposition in wire shape. CONSTITUTION:The material for vapor deposition is made into a wire shape 1 and is moved vertically upward by means of a driving wheel 2 and guide rollers 3 in the stage of forming the film of the metal or compd. by vapor deposition on the surface of the substrate 9 in a vacuum vessel 11. The material 1 is preliminarily heated by an induction heating coil 4 to release the gas stick ing to the surface thereof, then the top end of the material 1 is heated to evapo rate by an IR heater 5 so that the vapor thereof is deposited by evaporation on the surface of the substrate 9. The material for vapor deposition is evaporat ed without contact with the vessel, etc. and therefore the intrusion of the impuri ties into the film is averted. The desired control of the evaporation rate and the rate of vapor deposition on the substrate 9 are made possible by adjusting the rising speed of the material 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a vacuum evaporation apparatus used for extorting money or preparing a thin film of a compound.

[Conventional technology]

Conventionally, for the evaporation material for vacuum evaporation, the resistance heating method used pellet material in a resistance heating boat, and the electron beam heating method used ingot material in a copper water-cooled hearth. .

[Problem that the invention seeks to solve]

However, in conventional heating evaporation mechanisms, when the evaporation material is in a molten state and comes into contact with foreign metals such as T-heat boats and hearths, alloys may be formed or impurities may be mixed in, causing dust and bumping. It has the disadvantage that it may cause thickening and may reduce the purity of the film. Furthermore, since the input power of the heating power source is not proportional to the evaporation rate of the evaporation material, in order to control the film thickness and film formation rate, it is necessary to use a crystal oscillator and a film thickness measuring device in parallel. There was also the drawback that it did not.

Therefore, in order to solve these conventional drawbacks, this invention aims to provide a vapor deposition machine that prevents the evaporated material from coming into contact with dissimilar materials during melting, and that can control the evaporation rate and film thickness. .

[Means for solving problems]

Ninthly, this invention solves the above problems, using a linear material as the evaporation material, and further including a drive mechanism for the evaporation material.
A heating source for preheating and evaporation is installed to prevent the above-mentioned drawbacks.

[Effect]

When the evaporation mechanism of the rL9 vacuum evaporator configured as above is operated, only the upper end of the linear evaporation material is heated and evaporated, so that the evaporation material does not come into contact with dissimilar metals during melting, and impurities are removed. Contamination can be prevented. moreover,
The evaporation rate can be controlled by the feed rate of the evaporation wire. In addition, if the evaporation material is preheated before evaporation, impurities and gases can be released.

〔Example〕

Embodiments of the present invention will be described below based on the drawings. In FIG. 1, the linear evaporation material 1 is pushed upward by the rotation of the drive wheel 2. Here, the position of the axis of the linear evaporation material 1 is regulated by guide rollers 8 so that it does not move. First, the pressed n-ratio evaporation material 1 is preheated in the induction heating coil 4, and the gas absorbed on the surface is released. Furthermore, the infrared heater 5 heats it to a temperature higher than its melting point to evaporate it.

FIG. 82 is a side view showing the configuration of a vacuum evaporation apparatus according to the present invention, in which a partition plate 10 is placed in a vacuum chamber 11, a substrate 9 on which a film is to be formed, and an evaporation mechanism shown in FIG. will be installed. Reference numeral 6 is a motor for pushing up the linear evaporation material 1, 7 is an induction heating power source, and 8 is an evaporation heater power source.

FIG. 8 is a diagram showing the delivery rate of evaporation material and the film formation rate in the vapor deposition apparatus according to the present invention. There is a linear proportional relationship, and the film formation rate can be controlled arbitrarily.

[Effects of the Invention] As explained above, this invention uses a linear material as the evaporation material and uses a simple mechanism of pushing up the nitric oxide toward the heating source to prevent contamination with impurities and increase the film formation rate by the pushing up speed. It has the effect of controlling Although an infrared heater is used as the heat source in the present invention, it is clear that induction heating and laser heating can also be used.

Furthermore, improvements to multi-source evaporation can be easily made.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view of the heating section of the vapor deposition machine according to the present invention;
FIG. 2 is a cross-sectional view of the evaporator, and FIG. 8 is a diagram showing the evaporation material pushing up speed and the evaporation film thickness. 1 Linear evaporation material 2, drive wheel 8 Guide roller 4 Induction heating coil 5 Heater 6 Motor 7 High frequency power source 8 Heater power source 9 Substrate 10 Partition plate 11 X empty tank or more Applicant Seiko Electronic Industries Co., Ltd. Agent Patent attorney Mumasuke Mogami l mouth

Claims (2)

[Claims] (1) Using a linear material as an evaporation source for vacuum evaporation,
A vapor deposition apparatus characterized by having this linear evaporation material feeding mechanism. (2) The evaporation apparatus according to claim 1, further comprising a preliminary heating source in addition to the evaporation heating source.