JPS6179574A - Grinding wheel for grooving - Google Patents
Grinding wheel for groovingInfo
- Publication number
- JPS6179574A JPS6179574A JP20244084A JP20244084A JPS6179574A JP S6179574 A JPS6179574 A JP S6179574A JP 20244084 A JP20244084 A JP 20244084A JP 20244084 A JP20244084 A JP 20244084A JP S6179574 A JPS6179574 A JP S6179574A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- layer
- wheel
- tip
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野)
本発明は円板状の保持体の外周に多数の扇形の研削チッ
プを等間隔に接着した溝加工用砥石に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a grindstone for grooving in which a large number of fan-shaped grinding chips are adhered at equal intervals to the outer periphery of a disc-shaped holder.
この種の溝加工用砥石の研削チップは半径外方に位置す
る高価な砥石層と半径内方に位置して砥石層よりも(貴
幅の狭い安価な下地層よりなり、この下地層を介して研
削チップを保持体に接着しており、従来のものにおいて
は研削チップは何れも同一寸法のものを使用していた。The grinding tip of this type of groove grinding wheel consists of an expensive grinding wheel layer located on the outside of the radius and an inexpensive base layer that is narrower than the grinding wheel layer and located on the inside of the radius. The grinding tip is bonded to the holder using the conventional grinding tip, and in the conventional type, all the grinding tips have the same size.
この種の溝加工用砥石は、研削チップの研削作用をなす
端面の先端の角部が丸味を帯びて研削抵抗が増加すれば
、外周面をドレッサにより削って修正を行いながら使用
するものであるが、この修正の都度砥石層の厚さは減少
し、この厚さが成る程度以下になると砥石層の端面によ
り研削されるlδiの内面の表面[11さが大となる。This type of grooving whetstone is used while making corrections by cutting the outer peripheral surface with a dresser if the corner of the tip of the end face that performs the grinding action of the grinding tip becomes rounded and the grinding resistance increases. However, each time this correction is made, the thickness of the grindstone layer decreases, and when this thickness becomes less than this, the inner surface [11] of lδi ground by the end face of the grindstone layer becomes large.
このため、従来の’/R、fjl、l工用低石は1表面
粗さが大となるのを防止するために、高(曲な砥石層が
かなり残っている状態において交換をする必要が生じ、
高価な砥石層が無駄に廃棄されて溝加工用砥石のコスト
が大となるという問題がありだ。本発明はこのような問
題点を解決しようとするものである。For this reason, in order to prevent the conventional '/R, fjl, and l grinding stones from increasing in surface roughness, it is necessary to replace them when a considerable amount of the curved grindstone layer remains. arise,
There is a problem in that the expensive grindstone layer is wasted and the cost of the groove processing grindstone increases. The present invention attempts to solve these problems.
本発明はこの種の溝加工用砥石において、第1図〜第3
図に示す如く、複数の研削チップ20として砥石層21
a;6<薄く下地層21bが厚く形成された大多数の第
1研削チップ21と研削層22aが厚く下地層22bが
薄く形成された少数の第2vr削チップ22を使用し、
この第2研削チップ22を第1研削チップ21の間には
一等間隔に配置したことを特徴とするものである。The present invention provides a grindstone for groove machining of this type, as shown in FIGS. 1 to 3.
As shown in the figure, a grinding wheel layer 21 serves as a plurality of grinding chips 20.
a; 6<Using a large number of first grinding chips 21 in which the base layer 21b is thin and thick, and a small number of second VR grinding chips 22 in which the grinding layer 22a is thick and the base layer 22b is thin,
This second grinding tip 22 is arranged between the first grinding tips 21 at equal intervals.
回転する本発明の溝加工用砥石には切込み送り及びトラ
バース送りが与えられて、第1及び第2研削チップ21
.22の研削層21a、22aの端面21c、’22c
により工作物Wの溝の内面Waを研削する。厚さの薄い
第1研削チップ21の端面21cにより研削が不充分の
ままとり残された部分は厚さの厚い第2研削チップ22
の端面22cにより研削される。The rotating grindstone for groove machining of the present invention is given cutting feed and traverse feed, and the first and second grinding chips 21
.. End surfaces 21c and '22c of the grinding layers 21a and 22a of 22
The inner surface Wa of the groove of the workpiece W is ground by. The portion left behind due to insufficient grinding due to the end face 21c of the thin first grinding tip 21 is replaced by the thick second grinding tip 22.
is ground by the end face 22c.
かかる本発明は、上述の如く薄い第1研削チップにより
とり残された部分は厚い第2研削チップにより研削され
るので、溝研削用砥石の外周面を修正して大多数を占め
る第1研削チップの高価な砥石層が相当に薄くなるまで
使用しても溝内面の表面;1■さは低下することがない
。従って、工作面の表面粗さを低下させることなしに、
工作物1個当りのlR研削用砥石のコストを低下させる
ことができる。According to the present invention, as described above, the portion left behind by the thin first grinding tip is ground by the thick second grinding tip, so the outer circumferential surface of the groove grinding wheel is modified to remove the first grinding tip that occupies the majority. Even if the expensive grinding wheel layer is used until it becomes considerably thin, the surface roughness of the inner surface of the groove will not decrease. Therefore, without reducing the surface roughness of the machined surface,
The cost of the 1R grinding wheel per workpiece can be reduced.
第1図〜第3図に示す実施例において、溝加工用砥石は
固成状の保持体10とそのディスク部11の外周13に
接着固定された12個の扇形の研削チップ20よりなっ
ている。保持体10は鋼製で、外(N、!Iのディスク
部11と内側のボス部12よりなり、ボス部12の中央
には溝加工用砥石を砥石@Sに装着するための支持孔1
4が設けられている。In the embodiment shown in FIGS. 1 to 3, the grooving whetstone consists of a solid holder 10 and 12 fan-shaped grinding tips 20 adhesively fixed to the outer periphery 13 of a disk portion 11 of the solid holder 10. . The holder 10 is made of steel and consists of an outer (N, !I) disk portion 11 and an inner boss portion 12, and the boss portion 12 has a support hole 1 in the center for attaching a grooving grindstone to the grindstone @S.
4 is provided.
研削チップ20は、9個の第1研削チップ21と3個の
第2研削チップ22よりなり、第1図に示す如く、第2
ItJF削チップ22は、保持体10の外周13にそっ
て、3111i1おきに第1研削チップ21の間に配置
されている。第1及び第2研削チップ21.22は、第
1図に示す如く、何れも扇形をなし、半径外方に位置し
てB1なるb%幅の砥石12La、22aと、半径内方
に位置してB1より小さいB2なる横幅の下地層21b
、22bよりなっている。そして、第1研削チップ21
の砥石層21aの厚さLlは第2tlF削チップ22の
砥石122aの厚さL2よりも小とし、これに対応して
下地層21bの厚さは下地Jm22bの厚さよりも大と
して、第1及び第2研削チップ2]、22の全体の厚さ
は同一とする。The grinding tips 20 consist of nine first grinding tips 21 and three second grinding tips 22, and as shown in FIG.
ItJF grinding tips 22 are arranged between the first grinding tips 21 every 3111i1 along the outer periphery 13 of the holding body 10. As shown in FIG. 1, the first and second grinding tips 21 and 22 are fan-shaped, with grinding wheels 12La and 22a having a width of b% B1 located on the outside of the radius, and grindstones 12La and 22a with a width of b% B1 located on the inside of the radius. The base layer 21b has a width of B2, which is smaller than B1.
, 22b. And the first grinding tip 21
The thickness Ll of the grinding wheel layer 21a is smaller than the thickness L2 of the grinding wheel 122a of the second tlF cutting tip 22, and correspondingly, the thickness of the base layer 21b is larger than the thickness of the base Jm22b. The entire thickness of the second grinding chips 2] and 22 is the same.
砥石層21a、22aは、第3図に示す如く、ダイヤモ
ンド砥粒、CBN砥粒等の高価で研削性能にすくれた砥
粒25aをレジンボンド、ビトリファイドボンド、メタ
ルボンド等の結合剤26により、結合したもので、その
両端面21c、22Cにより工作物Wの溝の内面Waの
加工を行うものである。下地1W21b、22bは炭化
珪素、アルミナ等の比較的安(市な粒子を砥石層21a
、22aと同様の結合剤26により結合したものである
。1(石m 21a + 22 aと下地Fi21b
、22bを互に一体に結合してなる第1及び第2研削チ
ップ21.22ば、下地層21b、22bを緩衝層とし
て保持体10のディスク部11の外周面1.3に接着に
より固定されている。なお、ディスク8(ζ11の匣ぜ
は下地層21b、22bの横幅B2と同1−とする。As shown in FIG. 3, the grindstone layers 21a and 22a are made by bonding expensive abrasive grains 25a such as diamond abrasive grains or CBN abrasive grains with poor grinding performance using a bonding agent 26 such as resin bond, vitrified bond, or metal bond. The two end surfaces 21c and 22C are used to process the inner surface Wa of the groove of the workpiece W. The base layer 1W 21b, 22b is made of relatively cheap (comparable) particles such as silicon carbide or alumina, and is coated with the grinding wheel layer 21a.
, 22a are bonded using the same bonding agent 26. 1 (stone m 21a + 22 a and base Fi 21b
, 22b are integrally bonded to each other, and the first and second grinding chips 21, 22 are fixed to the outer circumferential surface 1.3 of the disk portion 11 of the holder 10 by adhesive, using the base layers 21b, 22b as buffer layers. ing. Note that the width of the disk 8 (ζ11) is 1-, which is the same as the width B2 of the base layers 21b and 22b.
使用に際しては、砥石軸Sに装着された溝加工用砥石を
回転し、切込み送りを与えて、第2図に示す如く工作1
カWの溝内に挿入し、トラバース送りを与−1えて研肖
すチノブ20の端面21c、22cにより溝の内面Wa
が砥石層21a、22aの横幅[31となるように研削
する。ドレッサにより砥石+=212. 22 aの外
周面を(1M正して、大多数を占め6第1研削千ツブ2
1の砥石層21の厚さt1カ′薄くなっても、残る第2
研削チップ22の低石層22の厚さL2は厚いので、薄
い砥石層21aの端面21cにより研削が不充分のま\
とり残された部分は厚い砥石122aの端面22Cの作
用により研削されて、溝内面Waの表面粗さが低下する
ことはない。When in use, the groove machining grindstone attached to the grindstone shaft S is rotated to give cutting feed, and as shown in FIG.
The inner surface Wa of the groove is polished by the end surfaces 21c and 22c of the chinobu 20 which is inserted into the groove of the cutter W and is polished by applying traverse feed.
Grinding is performed so that the width of the grindstone layers 21a and 22a is [31]. Grindstone +=212 by dresser. 22 The outer peripheral surface of a (corrected by 1M, which accounts for the majority of
Even if the thickness t1 of the first grinding wheel layer 21 is reduced, the remaining second
Since the thickness L2 of the low stone layer 22 of the grinding tip 22 is thick, the end face 21c of the thin grindstone layer 21a may cause insufficient grinding.
The remaining portion is ground by the action of the end face 22C of the thick grindstone 122a, and the surface roughness of the groove inner surface Wa is not reduced.
第1図〜第3図は本発明の一実施例を示し、第1図は正
面図、第2図は第1図のn−n断面図、第3図は第2図
の部分拡大断面図である。
符号の説明1 to 3 show one embodiment of the present invention, FIG. 1 is a front view, FIG. 2 is a sectional view taken along line nn in FIG. 1, and FIG. 3 is a partially enlarged sectional view in FIG. 2. It is. Explanation of symbols
Claims (1)
削チップよりなり、各研削チップは半径外方に位置する
砥石層と半径内方に位置して砥石層よりも横幅の狭い下
地層よりなり、この下地層を介して研削チップを前記保
持体に固着し、各砥石層の端面により溝の内面を研削す
る溝加工用砥石において、前記複数の研削チップは砥石
層が薄く下地層が厚く形成された大多数の第1研削チッ
プと砥石層が厚く下地層が簿く形成された少数の第2研
削チップよりなり、この第2研削チップを第1研削チッ
プの間にほぼ等間隔に配置したことを特徴とする溝加工
用砥石。Consisting of a disc-shaped holder and a plurality of fan-shaped grinding tips fixed to its outer periphery, each grinding tip has a grinding wheel layer located radially outward and a lower layer narrower in width than the grinding wheel layer located radially inward. In a grindstone for groove machining, the grinding chips are fixed to the holder through the base layer, and the inner surface of the groove is ground by the end face of each grindstone layer. Consisting of a large number of first grinding chips with a thick layer and a small number of second grinding chips with a thick grinding wheel layer and a thin base layer, the second grinding chips are spaced approximately evenly between the first grinding chips. A grindstone for groove machining characterized by being arranged in.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20244084A JPS6179574A (en) | 1984-09-27 | 1984-09-27 | Grinding wheel for grooving |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20244084A JPS6179574A (en) | 1984-09-27 | 1984-09-27 | Grinding wheel for grooving |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6179574A true JPS6179574A (en) | 1986-04-23 |
Family
ID=16457557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20244084A Pending JPS6179574A (en) | 1984-09-27 | 1984-09-27 | Grinding wheel for grooving |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6179574A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02292166A (en) * | 1989-05-02 | 1990-12-03 | D T R:Kk | Diamond blade |
KR100575849B1 (en) * | 2006-01-12 | 2006-05-02 | (주)디디다이아 | A wheel type diamond tool and the manufacturing method thereof |
-
1984
- 1984-09-27 JP JP20244084A patent/JPS6179574A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02292166A (en) * | 1989-05-02 | 1990-12-03 | D T R:Kk | Diamond blade |
KR100575849B1 (en) * | 2006-01-12 | 2006-05-02 | (주)디디다이아 | A wheel type diamond tool and the manufacturing method thereof |
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