JPS6176277A - Circular saw for hard work cutting - Google Patents

Abstract

PURPOSE:To strengthen the bonding force of diamond fine grains to a cutter forming part as well as to improve abrasion resistance in a circular saw cutting part, by making the thickness of the cutter forming part, having proper width toward the outer circumferential direction from an inner circumferential end of a disc, thinner than that of the disc. CONSTITUTION:A lot of holes are installed, at regular intervals, in a cutter forming part 2 having proper width toward the outer circumferential direction from an inner circumferential end of a circular disc 1. Diamond fine grains 4 are connectedly bonded on a surface of this cutter forming part 2 and an inner circumferential wall of each hole whereby a cutting part is formed. Thickness in this cutter forming part 2 is made to be thinner than that of the circular disc 1 and a step part 6 is formed at the boundary part whereby a bonding area of the diamond fine grains is made wider, through which bonding force in the cutting part 5 against the cutter forming part 2 is made larger and, what is more, abrasive resistsnce of the cutting part 5 of a circular saw for cutting is increased.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a circular saw for cutting hard materials such as various semiconductor materials such as silicon, ceramics, tungsten, carbide, and gemstones. It comes out.

(Prior art) Conventional circular saws for cutting hard materials have been used in Japanese Patent Publication No. 60-jri 67j (Takko Sho Geter No. 101120) and Takko Sho JO-j! jZg publication (JP-A-Sho/Tar/'Q66//
This conventional technology, which includes the technique disclosed in 8), has a large number of holes arranged at equal intervals in a blade forming portion having an excessive width from the inner circumferential end of the annular disk toward the outer circumferential direction of the annular disk. The blade is formed by attaching a series of diamond fine particles to the surface of the blade forming part and the inner circumferential wall of the hole.

(Problems to be Solved by the Invention) Generally, semiconductor materials, jewelry, and other hard materials are expensive, so the cutting allowance required for processing such as 917 cutting must be minimized as much as possible.

Particularly in recent years, with the rapid spread of semiconductors, it is necessary to precisely cut or cut semiconductor materials into ultra-thin pieces, and in order to effectively utilize these expensive semiconductor materials, the size of 0% cutting allowance is determined. There is a problem in that the blade thickness of this cutting saw must be thinner than that of conventional ones.

However, in the conventional circular saw for cutting, the blade part is formed on the surface of the cedar i part of the blade part, which has the same wall thickness as the annular circular plate. There were problems in that the total thickness could not be made any thinner, and the binding force of the blade made of one diamond particle to the blade forming part could not be made any stronger.

(Means for resolving the problem) In order to solve such a problem, according to the present invention, an excessive amount of heat is applied from the inner circumferential end of the annular plate toward the outer circumference of the annular plate. For cutting m-quality materials, pre-formed holes are arranged at equal intervals in a blade-forming part having a auxiliary shaft, and a blade part is formed by applying a series of diamond fine particles to the surface of the blade-forming part and the inner circumferential wall of the holes. There is provided a circular saw for cutting hard materials, characterized in that the wall thickness of the blade forming part is thinner than the wall thickness of the annular circular plate.

In the above configuration, the diamond particles can be bonded to only one layer on the surface of the blade forming portion and the inner circumferential wall of the hole.

In this case, the blade thickness of the circular cutting saw can be made thinner, and the blade part can be formed to be more precise.

Further, in the above configuration, the diamond fine particles can be formed in two or more layers on the surface of the blade forming portion and the inner circumferential wall of the hole.

In this case, the wear resistance of the blade portion of the cutting saw can be improved.

(effect) The above technical means works as follows.

In other words, without reducing the strength of the annular circular plate, the cutting width can be reduced by forming the blade with a thinner wall.Firstly, the diamond particles that adhere to the blade forming part are By making the wall thickness of the blade forming part thinner than that of the annular circular plate, the calculus area increases compared to the stepped section which is shaped by the shape, so the calculus force can be strengthened. It works like that.

v. iK1 length At least the stress applied to the diamond particles in the vicinity of the stepped portion is borne by the stepped portion, thereby improving durability.

(Example) To explain the practical example ft drawing of this invention, (1
) is an annular circular plate made of steel, etc., and the circular plate (1) is
There is an excessive width from the inner circumferential end toward the outer circumference of the disk, and by cutting both the front and back sides of the annular disk (1), it becomes thinner than the wall thickness of the annular disk (1). - has a formed blade formation (2);

(3) are the holes arranged at equal intervals in the blade forming part (2).

(4) is a granule of diamond bound in a single layer by electroplating on the surface of the blade forming part (2) and the inner circumferential wall of the hole (3), and the diamond fine grains (4) are bound. By doing so, the blade portion (5) is formed.The holes (3) are arranged in the circumferential direction, and each row of holes (
3) The lines connecting the outer circumferences of the pond holes (3) ... are arranged so as to cut into the lines connecting the outer circumferences of the adjacent pond holes (3).... The blade part (5) from the surrounding wall ￥ C stoned diamond fine grains (4) K
is formed so that it performs the cutting function continuously over the entire surface.

(6) is a step formed by +lJ cutting on both the front and back surfaces of the annular plate (1), and the step (6) is formed by diamond fine grains (4 ) are tied together.

Note that the annular plate (1) determines the thickness of the blade forming part (2).
) is the amount of cutting on both the front and back sides of the diamond particles (
The thickness may be determined to be the same as or slightly less than the thickness of 4), that is, the thickness of the blade portion (5) may be the same or slightly thicker than the thickness of the annular plate (1).

When carrying out the present invention, the wall thickness of the annular plate (1) is ti
The hole (3) may have a thickness of, for example, 0.1 to 1.5 mm, and the shape of the hole (3) may be round, polygonal, or circular.

(Effects of the Invention) As explained above, the present invention has the advantage that diamond fine particles are bound to the inner circumferential wall of the hole provided in multiple waves in the blade 4 forming portion, that is, a pillar of grains is formed in the diamond #. As a result, the fine diamond particles that adhere to M can be firmly bound to the surface of the blade forming part, and the formed blade part becomes #! Not only does it have the effect of cutting like a bowl, but also has the effect of improving the cooling effect by improving the circulation of water or cutting oil through the holes. By making it thinner than the thickness, the wall thickness of the blade portion can be made thinner without reducing the wall thickness of the entire annular plate.

Next, by making the wall thickness of the blade forming part thinner than that of the annular circular plate, it is possible to increase the area saved by the stepped part. It can increase the stone power.

Furthermore, since the stepped portion at least allows the diamond particles near the stepped portion to withstand stress, the durability of the blade portion, that is, the blade portion, can be improved.

As a result, the cutting allowance for expensive hard materials can be reduced, the life of the circular saw can be extended, and the cost efficiency of the core can be improved.

[Brief explanation of the drawing]

The drawings show an embodiment of the round stopper for cutting hard materials according to the present invention. FIG. 1 is a front view of the main part with a part of the inner peripheral end cut away, and FIG. 'Aljt folding map, the first view is a partially enlarged front view, and the second view is a sectional view taken along the line BB of YJj. In the drawings, (1) is a disk, (2) is a blade forming part, (
3) is a hole, (4) is a diamond particle, (5) is a blade part,
(6) shows the stepped portion, and (7) shows the outer peripheral edge of the blade portion.

Claims (1)

[Scope of Claims] 1. A number of holes are arranged at equal intervals in a blade forming portion having an excessive width from the inner circumferential end of the annular circular plate toward the outer circumferential direction of the annular circular plate, and the blade forming In a circular saw for cutting hard materials in which the blade is formed by bonding diamond particles in series to the surface of the part and the inner circumferential wall of the hole, the wall thickness of the blade forming part is greater than the wall thickness of the annular circular plate. A circular saw for cutting hard materials, which is characterized by its thinness. 2. The circular saw for cutting hard materials according to claim 1, characterized in that diamond fine particles are bonded to only one layer on the surface of the blade forming portion and the inner circumferential wall of the hole. 3. A circular saw for cutting hard materials according to claim 1, characterized in that two or more layers of diamond fine particles are bonded to the surface of the blade forming part and the inner circumferential wall of the hole.