JPS6175136U - - Google Patents
Info
- Publication number
- JPS6175136U JPS6175136U JP16023884U JP16023884U JPS6175136U JP S6175136 U JPS6175136 U JP S6175136U JP 16023884 U JP16023884 U JP 16023884U JP 16023884 U JP16023884 U JP 16023884U JP S6175136 U JPS6175136 U JP S6175136U
- Authority
- JP
- Japan
- Prior art keywords
- connection pins
- wiring
- protruded
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984160238U JPH034043Y2 (hr) | 1984-10-23 | 1984-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984160238U JPH034043Y2 (hr) | 1984-10-23 | 1984-10-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6175136U true JPS6175136U (hr) | 1986-05-21 |
| JPH034043Y2 JPH034043Y2 (hr) | 1991-02-01 |
Family
ID=30718163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984160238U Expired JPH034043Y2 (hr) | 1984-10-23 | 1984-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH034043Y2 (hr) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5324208U (hr) * | 1976-08-06 | 1978-03-01 | ||
| JPS5462782A (en) * | 1977-10-27 | 1979-05-21 | Sharp Corp | Package method of semiconductor device |
-
1984
- 1984-10-23 JP JP1984160238U patent/JPH034043Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5324208U (hr) * | 1976-08-06 | 1978-03-01 | ||
| JPS5462782A (en) * | 1977-10-27 | 1979-05-21 | Sharp Corp | Package method of semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH034043Y2 (hr) | 1991-02-01 |