JPS6172849U - - Google Patents

Info

Publication number
JPS6172849U
JPS6172849U JP1984157882U JP15788284U JPS6172849U JP S6172849 U JPS6172849 U JP S6172849U JP 1984157882 U JP1984157882 U JP 1984157882U JP 15788284 U JP15788284 U JP 15788284U JP S6172849 U JPS6172849 U JP S6172849U
Authority
JP
Japan
Prior art keywords
wire
bonding
guide
funnel
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984157882U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984157882U priority Critical patent/JPS6172849U/ja
Publication of JPS6172849U publication Critical patent/JPS6172849U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のワイヤボンデイング装置の概要
図、第２図、第３図は本考案の実施例ワイヤボン
デイング装置の概要図、側面図である。 １，１１……ボンデイング用ワイヤ、２，１２
……アーム、３，１３……圧着用くさび、４，１
４……台、５，１５……ワイヤ、６，１６……ワ
イヤに設けられた孔、７，１７……ワイヤ保持、
１８……ローラ、１９……じようご状ガイド、２
０……一対のローラ。 FIG. 1 is a schematic diagram of a conventional wire bonding device, and FIGS. 2 and 3 are a schematic diagram and a side view of a wire bonding device according to an embodiment of the present invention. 1, 11... bonding wire, 2, 12
...Arm, 3,13...Crimping wedge, 4,1
4... Stand, 5, 15... Wire, 6, 16... Hole provided in the wire, 7, 17... Wire holding,
18...Roller, 19...Funnel-shaped guide, 2
0... A pair of rollers.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ボンデイング用ワイヤの糸巻きとボンデイング
用圧着くさび間に、ワイヤガイドローラおよび、
ワイヤの横本向のずれを防ぐためのじようご状の
ガイド、および上下方向のずれを少なくするため
の一対のガイドローラを有することを特徴とする
ワイヤボンデイング装置。 There is a wire guide roller between the bonding wire spool and the bonding crimp wedge.
A wire bonding device characterized by having a funnel-shaped guide to prevent the wire from shifting in the horizontal direction, and a pair of guide rollers to reduce the shift in the vertical direction.
JP1984157882U 1984-10-19 1984-10-19 Pending JPS6172849U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984157882U JPS6172849U (en) 1984-10-19 1984-10-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984157882U JPS6172849U (en) 1984-10-19 1984-10-19

Publications (1)

Publication Number Publication Date
JPS6172849U true JPS6172849U (en) 1986-05-17

Family

ID=30715872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984157882U Pending JPS6172849U (en) 1984-10-19 1984-10-19

Country Status (1)

Country Link
JP (1) JPS6172849U (en)

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