JPH0454423U - - Google Patents
Info
- Publication number
- JPH0454423U JPH0454423U JP9592890U JP9592890U JPH0454423U JP H0454423 U JPH0454423 U JP H0454423U JP 9592890 U JP9592890 U JP 9592890U JP 9592890 U JP9592890 U JP 9592890U JP H0454423 U JPH0454423 U JP H0454423U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- flat
- insertion groove
- flat conductor
- biasing means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 14
- 230000037431 insertion Effects 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 4
- 230000013011 mating Effects 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Installation Of Bus-Bars (AREA)
Description
第１図は実施例に係る平型導体の接続構造の平
面図、第２図は実施例に係る平型導体の接続構造
の側面図、第３図は第１図の−矢視断面図、
第４図は従来の平型導体の接続構造の平面図であ
る。
主な参照番号、１……平型導体、２……平型導
体、３……絶縁ホルダー、４……導体挿入溝、４
ａ……壁部、８……板バネ。
1 is a plan view of a flat conductor connection structure according to an embodiment, FIG. 2 is a side view of a flat conductor connection structure according to an embodiment, and FIG. 3 is a sectional view taken along the - arrow in FIG.
FIG. 4 is a plan view of a conventional flat conductor connection structure. Main reference numbers, 1...Flat conductor, 2...Flat conductor, 3...Insulation holder, 4...Conductor insertion groove, 4
a... Wall portion, 8... Leaf spring.
Claims (1)
の重ね合わせ部を挿入する導体挿入溝を形成し、
この導体挿入溝内において前記平型導体の重ね合
わせ部を前記導体挿入溝の一方の壁部方向に付勢
する付勢手段を設け、前記壁部と前記付勢手段で
前記平型導体の重ね合わせ部を挟持することを特
徴とする平型導体の接続構造。 forming a conductor insertion groove in the flat conductor support into which the overlapping portions of the flat conductors to be connected to each other are inserted;
A biasing means for biasing the overlapping portion of the flat conductor in the direction of one wall of the conductor insertion groove is provided in the conductor insertion groove, and the overlapping portion of the flat conductor is activated by the wall portion and the biasing means. A flat conductor connection structure characterized by sandwiching a mating part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9592890U JPH0454423U (en) | 1990-09-11 | 1990-09-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9592890U JPH0454423U (en) | 1990-09-11 | 1990-09-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0454423U true JPH0454423U (en) | 1992-05-11 |
Family
ID=31835053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9592890U Pending JPH0454423U (en) | 1990-09-11 | 1990-09-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0454423U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007196000A (en) * | 2007-03-14 | 2007-08-09 | Toshiba Home Technology Corp | Photocatalyst reactor |
-
1990
- 1990-09-11 JP JP9592890U patent/JPH0454423U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007196000A (en) * | 2007-03-14 | 2007-08-09 | Toshiba Home Technology Corp | Photocatalyst reactor |
| JP4613919B2 (en) * | 2007-03-14 | 2011-01-19 | 東芝ホームテクノ株式会社 | Photocatalytic reactor |