JPS6172848U - - Google Patents
Info
- Publication number
- JPS6172848U JPS6172848U JP15690484U JP15690484U JPS6172848U JP S6172848 U JPS6172848 U JP S6172848U JP 15690484 U JP15690484 U JP 15690484U JP 15690484 U JP15690484 U JP 15690484U JP S6172848 U JPS6172848 U JP S6172848U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- pattern
- semiconductor device
- adhesive film
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002313 adhesive film Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15690484U JPS6172848U (US06633600-20031014-M00021.png) | 1984-10-17 | 1984-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15690484U JPS6172848U (US06633600-20031014-M00021.png) | 1984-10-17 | 1984-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6172848U true JPS6172848U (US06633600-20031014-M00021.png) | 1986-05-17 |
Family
ID=30714910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15690484U Pending JPS6172848U (US06633600-20031014-M00021.png) | 1984-10-17 | 1984-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6172848U (US06633600-20031014-M00021.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999000842A1 (en) * | 1997-06-26 | 1999-01-07 | Hitachi Chemical Company, Ltd. | Substrate for mounting semiconductor chips |
-
1984
- 1984-10-17 JP JP15690484U patent/JPS6172848U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999000842A1 (en) * | 1997-06-26 | 1999-01-07 | Hitachi Chemical Company, Ltd. | Substrate for mounting semiconductor chips |
