JPS6166005U - - Google Patents
Info
- Publication number
- JPS6166005U JPS6166005U JP1984150232U JP15023284U JPS6166005U JP S6166005 U JPS6166005 U JP S6166005U JP 1984150232 U JP1984150232 U JP 1984150232U JP 15023284 U JP15023284 U JP 15023284U JP S6166005 U JPS6166005 U JP S6166005U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor component
- air conditioner
- volume control
- control device
- air volume
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000009423 ventilation Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
Description
第１図は従来の風量制御装置の構造を示す断面
模式図、第２図は風量制御装置の概略回路図、第
３図は風量制御装置の入出力特性図、第４図は本
考案の一実施例を示すトランジスタ構造図、第５
図は第４図に示したトランジスタの内部回路図で
ある。
１…放熱フイン、２…パワートランジスタ、５
…ステー、６…温度フユーズ、１１…トランジス
タフランジ、１３…トランジスタチツプ、１５…
温度フユーズチツプ、１６…プルダウン抵抗。
Fig. 1 is a cross-sectional schematic diagram showing the structure of a conventional air volume control device, Fig. 2 is a schematic circuit diagram of the air volume control device, Fig. 3 is an input/output characteristic diagram of the air volume control device, and Fig. 4 is a diagram showing the structure of a conventional air volume control device. Transistor structure diagram showing an example, No. 5
This figure is an internal circuit diagram of the transistor shown in FIG. 4. 1... Heat dissipation fin, 2... Power transistor, 5
... Stay, 6... Temperature fuse, 11... Transistor flange, 13... Transistor chip, 15...
Temperature fuse chip, 16...Pull-down resistor.
Claims (1)
を備えた自動車用空調機の風量制御装置において
、該半導体部品内の素子の温度が動作保障温度を
超えたことを検知して、該半導体素部品を恒久的
に遮断する装置を該半導体部品内に内蔵したこと
を特徴とする自動車用空調機の風量制御装置。 In an air volume control device for an automobile air conditioner equipped with a semiconductor component that is forcedly air-cooled by the ventilation of the air conditioner, the device detects that the temperature of an element within the semiconductor component has exceeded the guaranteed operating temperature and controls the semiconductor component. An air volume control device for an automobile air conditioner, characterized in that a device for permanently shutting off is built into the semiconductor component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984150232U JPS6166005U (en) | 1984-10-05 | 1984-10-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984150232U JPS6166005U (en) | 1984-10-05 | 1984-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6166005U true JPS6166005U (en) | 1986-05-07 |
Family
ID=30708385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984150232U Pending JPS6166005U (en) | 1984-10-05 | 1984-10-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6166005U (en) |
-
1984
- 1984-10-05 JP JP1984150232U patent/JPS6166005U/ja active Pending
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