JPS6164011A - Method of producing tape wire - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing a tape electric wire, and in particular to manufacturing a flexible tape-like or sheet-like electric wire in which metal is firmly deposited on a base plastic film. It is about the method.

BACKGROUND OF THE INVENTION Conventionally, this type of tape electric wire, that is, a tape-shaped electric wire or a sheet-shaped electric circuit, has been obtained by (1) pasting a thin copper foil on a tape and forming an electric circuit by etching it; (2) It was obtained by aligning and pasting flat metal conductors onto a sheet or the like.

(Problem to be solved by the invention) However, the thickness of the conductor used in this case is 18
There is a limit to the handling of a conductor that is thinner than μ and attached to a film or sheet for etching.

Recently, in the field of electronics, there has been a demand for extremely thin tape- or sheet-shaped electrical circuits, and the inventors have conducted intensive research to meet this demand.
The manufacturing method of the present invention has been established.

That is, the method of the present invention (1) does not require the use of an adhesive to attach metal to a plastic film. (2)
Ultra-thin tape wires can be easily obtained. (3) Excellent adhesion between the base material and metal due to special pretreatment. (II)
The dimensional accuracy of the circuit is high because it does not require circuit formation by etching. (5) Continuous production is possible.

The present invention aims to provide a method for manufacturing tape electric wires that eliminates the problems that have limited the handling of picks and the etching process, while at the same time providing a circuit with excellent dimensional accuracy.

(Means for Solving the Problems) The method for manufacturing a tape electric wire according to the present invention is to apply resist to the surface of a plastic film by physical vapor deposition means having geoevaporation particle energy of 1 eV or more and coating a resist on a portion unnecessary for the circuit. Metal on the surface of the film 300X~50.
It is characterized in that conductor parts necessary for the circuit are formed by attaching the resist to the thickness of OOOX and peeling off the resist.

The plastic serving as the base in the present invention is, for example,
Thermoplastic or thermosetting resins such as polyester, polyimide, polyamide, polyamideimide, polycarbonate, fluororesin, polyolefin/others can be used, and fluororesin is particularly preferred.

The thickness of the base film is 2 to 100μ, usually 5 to 50μ.
A material of the order of μ is used.

In the present invention, photoresist, resist ink, etc. are used as resists on the plastic film.
Photoresist is a positive type or negative type and is phenol-based, rubber-based, polyvinyl alcohol, etc., and etching resist is used as a resist ink to coat unnecessary parts of the circuit. The resist film thickness is determined by the thickness of the conductor that evaporates when the thickness of the resist is 0.5 to 50 μm.

Physical vapor deposition means in the present invention include ordinary vacuum vapor deposition,
Refers to a coating method using various metal vapors that does not involve chemical changes such as sputtering or ion blasting, and usually involves ionizing metals in an atomic or collective state by some means under a vacuum pressure of 1σ Torr or less. The base film is coated on the substrate film while the atom is being mixed or by being blown off as atoms.

Evaporation particle energy varies depending on the method, but is 1 eV
In the above case, the sputtering method, the ion blating method, etc. are equivalent methods.

This is why, in these vapor deposition methods, in the present invention, it is desirable for the particles to have large energy in order to adhere the metal onto the plastic film with strong adhesive force. However, in addition, cleaning of the substrate is extremely important. In order to adhere metal to a substrate with good adhesion prior to physical vapor deposition, first heat the substrate film under a vacuum pressure of 1σ' Torr or less to degas moisture, gas, monomer, etc. in the substrate film. Process. The temperature of the base film at this time is desirably 60° C. or higher, and it is desirable to raise the temperature to such an extent that it does not affect the base film as much as possible. Further, the heating time is about 15 seconds to 300 seconds, and the optimum conditions are set based on the characteristics of the base film.

Next, a micro-etching process is performed on the film surface by bombardment.
The base film is subjected to RF plasma of helium, argon, neon, nitrogen, oxygen, etc. under vacuum pressure below rr, DC
Treatment is performed using one or more methods such as glow discharge. When the base film is placed in plasma, the surface of the base film is bombarded with electrons and ions and micro-etched.

Due to these, high adhesion force can be exhibited when metal is vapor-deposited on the surface of this substrate.

The bombardment time is about 5 to 300 seconds, and even if the treatment is carried out for a short time, the adhesion becomes extremely high.

In particular, four rows of fluororesin is optimal as a means for increasing adhesion when FEP or the like is used.

Next, metal is deposited at 300A to 50.0A by physical vapor deposition with an evaporation particle energy of 1 eV or higher. By depositing OOOA and peeling off the resist in areas unnecessary for the circuit, a conductor portion is created and a tape-shaped or 7-tape-shaped electric wire is obtained. The resist can be easily removed by soaking it in an alkaline aqueous solution, an organic solvent, or the like.

The thickness of the metal layer formed by the physical vapor deposition method of the present invention is 300A to 50A. OOOA, but the need for it to be 50OA or more is necessary due to the drowsy property of the conductor. F-5:,
04 If steamed over OA, the strain will increase and the bendability will deteriorate.Next, an example will be explained.

(Examples) Example 1 A polyimide film (thickness: 5 μm) was coated with 1 μm of alkaline removable type Metsuki Resist with one pitch in the conductor as a circuit, with each pitch being 1511 mm. (Menki resist coat L54+n+n width, 1 closed width without coating),
Next, heat at 100°C for 2 minutes in a vacuum chamber, and then
After treatment with O glow discharge for 1 minute, copper was deposited by sputtering for 10 minutes. I applied 4 coats to the thickness of OQQA. When this was removed from the vacuum chamber and treated with ultrasonic waves while immersed in an alkaline aqueous solution, the resist film was peeled off and a conductor circuit with a pitch of 2.5 nm and 1 in 1 conductor was formed on the polyimide film. Ta.

Example 2 Fluorine-based film [tetrafluoroethylene-hexafluoropropylene copolymer (hereinafter abbreviated as FEP)] film 5''
Using JprnF-1 actual example and Mr. Metsu's commercial resist, one pitch was 254 mm as a circuit, and a resist was coated with a thickness of 10 μm as a conductor.

(Metsuki resist coat L5'4+m width, no coat 1
throat rag), then heated at 90°C for 1 minute in a vacuum chamber,
Furthermore, after processing with DC glow discharge for 1 minute, copper was deposited by sputtering for 10 minutes. Coated to a thickness of OOOA.

When this was taken out of the vacuum chamber and subjected to ultrasonic treatment while immersed in an alkaline aqueous solution, the resist film was peeled off and one pitch of 2.54 trrm was deposited on the FEP film.
, a conductor circuit between the conductors was formed.

Comparative Example 1 Using the FEP film of Example 2, a circuit was formed with anti-metal cyst, without pretreatment in a vacuum chamber,
Copper was coated by sputtering to a thickness of 10.00 OA. When this was taken out of the vacuum chamber and subjected to ultrasonic treatment while immersed in an alkaline aqueous solution, the resist film and copper were peeled off and no circuit was formed on the FEP film.

Example 5 Polyester film (thickness 50 μm) 9th layer coated with K Flukali releasable type etching resist at a pitch of 4 intervals and L 27 rmn (etching resist coat 127 mm width, no coating L 27 tma) to a thickness of 5 μm inside the conductor. After heating at 90°C for 2 minutes in a vacuum chamber, and then applying DC glow discharge for 1 minute, copper was sputtered to remove copper. Coated to a thickness of OOOA. When this was taken out from the vacuum chamber and subjected to ultrasonic treatment while immersed in an alkaline aqueous solution, the resist film was peeled off and a conductor circuit with one pitch of 2.54 mm and a conductor width L27+mn was formed on the polyimide film.

(Effects of the Invention) According to the method of the present invention, ultra-thin tape electric wires having conductor circuits with excellent dimensional accuracy can be continuously manufactured, and the industrial value thereof is extremely large.

Claims (1)

[Claims] After coating the plastic film surface with resist on the parts unnecessary for the circuit, the evaporation particle energy is 1 eV.
Production of a tape electric wire characterized in that a metal is deposited on the film surface to a thickness of 300 Å to 50,000 Å by the above physical vapor deposition method, and then the resist is peeled off to form a conductor portion necessary for a circuit. Method