JPS61208706A - Manufacture of tape-like wire - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a novel tape-shaped electric wire in the form of a flexible T-NL, L or thin tape or sheet.

[Conventional technology]

Conventionally, this type of tape-shaped electric wire is made by pasting copper foil onto a base film using adhesive, printing a circuit pattern on the copper foil, and removing unnecessary parts by etching to form a line or conductor circuit. It is obtained by attaching flat metal conductors to a sheet or the like in an aligned manner.

However, tape-shaped electric wires made using these methods inevitably have thick conductors, usually 18 μm or more, and it is not possible to form a circuit by attaching a thinner conductor to a plastic film or sheet. There was nothing I could do.

Recently, in the field of electronics, there has been a strong demand for lighter, thinner, and shorter conductors, and tape-shaped conductors have also been required to be extremely thin and have fine patterns.

[Problem that the invention seeks to solve]

The present invention was developed as a result of extensive research in view of the current situation, and as a result, the thickness of the conductor used to form the circuit is made extremely thin, and the thickness of the conductor is made extremely thin. We have developed a method for manufacturing arg electric wires that can be easily turned.

[Means for solving problems]

The method of the present invention consists of a first step of applying a heat-drying type renost ink to unnecessary parts other than the circuit to be formed on the surface of a gelastec film as a base material, and the entire surface of the film coated with resist ink. Conductive metal 'i' is deposited by physical vapor deposition with particle energy of 1 eV or more
#f attached to a thickness of 300X to 50,000X
, two steps, and a third step of peeling off the conductive metal and resist ink provided on the parts other than the circuit from the base film.

The plastic film used as a substrate in the method of the present invention is polyester, polyimide, polyamide, polyamideimide, or polycargonate.

7. It uses base resin, polyether sulfone, polyether ether ketone, other polyolefins, and thermosetting resins, and its thickness is 2 to 100 μm, usually 4 to 100 μm.
A thickness of about 50 μm is used.

In the method of the present invention, as a first step, Renosto ink is applied in advance to unnecessary parts other than the circuit forming part on the base film, and the main resin used for this Renosto ink is rosin-modified malein. Add extender pigment 2 color pigment, solvent, and auxiliary agent to solvent-volatile resin such as acid resin, alcohol-soluble phenol resin, vinyl chlorinated polyethylene, rubber type, styrene type, copolymer, acrylic copolymer, etc. In particular, for extender pigments and color pigments, pigments to which metals are difficult to be deposited, such as Kagen,
It is preferable to add silica, titanium, etc.

The method for applying this Renost ink is Screen Mark 11,! J Perth roll coater, gravure,
After the resist ink is uniformly applied to unnecessary parts of the circuit by printing means such as offset printing, the resist ink is cured by evaporation of a solvent. The coating thickness of this Renost ink is preferably about 0.5 to 50 μm, and the resist film thickness is determined by the thickness of the conductor to be deposited.

Next, in the second step, a conductive metal is deposited on the entire surface of the base film by physical vapor deposition, using various metal vapors that do not involve chemical changes such as ordinary vacuum evaporation, sintering, ion plating, etc. It is made of copper and aluminum. It is usually obtained by ionizing a metal in an atomic state or an aggregated state, or by blowing away the atoms, under a vacuum pressure of 10 Torr or less.

That is, in the method of the present invention, since the conductive metal is brought into close contact with the base film by strong adhesive force, it is desirable that the particles have large energy, and cleaning of the base film is extremely important. In order to adhere the metal to the base film with good adhesion prior to physical vapor deposition, the base film is first heated under a vacuum pressure of 10-' Torr or less to remove water, gas, monomer, etc. In this case, the heating temperature of the base film is preferably 60° C. or higher, and it is desirable to raise the temperature to a temperature that does not affect the base film as much as possible. Further, the heating time is set to about 10 to 300 seconds, and optimum conditions are set depending on the characteristics of the base film. Furthermore, the surface of the base film is subjected to micro-etching treatment by bombardment, and the base film is exposed to helium under a vacuum pressure of 10 Torr or less in the same manner as described above.

RF7' lasma such as argon, neon, chi, so, oxygen, etc.
Treatment is performed using one or more methods such as DC glow discharge. When a base film is placed in plasma, the surface of the film is bombarded with electrons and ions and micro-etched.

By pre-treating the base film in this way, excellent adhesion is exhibited when metal is brought into close contact with the surface of the film.

It is particularly suitable as a means for increasing adhesion to fluororesins such as 47-fluorinated ethylene-67-fluorinated propylene copolymer (hereinafter referred to as FEP). Note that the bombardment time is determined by the characteristics of the base film.

Next, in the method of the present invention, as a third step, the conductor metal provided in the area other than the circuit and the method of peeling the renost ink from the gold base film include immersion in an alkaline solution or solvent such as caustic soda, triclane, etc. that allows the resist ink to swell and dissolve. There is a method in which the resist ink is penetrated and dissolved using ultrasonic waves and the conductive metal is also peeled off at the same time, or a method in which a pressurized solvent, alkaline aqueous solution, etc. is sprayed from a nozzle and peeled off in the same manner as above. Puff polishing is also performed if necessary.

〔Example〕

Example (1) A circuit with a pitch width of 2.511 mm was formed on the surface of a polyimide film (thickness: 50 μm). In manufacturing a tape wire having 111 conductor paths in the conductor, first, the polyimide film was diluted 10% with Etching Lenost X-77K ethanol (heat-dried Tie 7
') Gravure was printed on a pitch width of t-1°54 and dried. The Lennost thickness at this time was 8 μm. Next, it was heated in a vacuum chamber at 100° C. for 2 minutes, and then treated with DCC glow discharge for 1 minute, and then copper was vapor-deposited on the surface to a thickness of 10.000 mm by sintering. Next, this vapor-deposited polyimide film with copper was taken out from the vacuum chamber, and a 3% NaOH solution was sprayed with a nozzle at a pressure of 1.6◆62 to cause the Renost ink to swell and dissolve, and at the same time peel off the copper foil provided on the ink. A tape electric wire of the present invention was obtained.

Example (2) After applying resist ink to a pre-imide film in the same manner as in Example (1), vacuum heat treatment and DC glow discharge were performed, and copper was heated at 15,000X for sputtering.
It was deposited to a thickness of . Next, this vapor-deposited rusted I-imide film was taken out of the vacuum chamber and subjected to ultrasonic treatment while immersed in a 3% NaOH solution to swell the resist ink, and then taken out and subjected to a rotating brush in water. The copper foil on the resist ink surface was easily peeled off, and 1 p y f , 2.54 Ill was deposited on the polyamide film.

A tape electric wire of the present invention having a conductor path of lH in the conductor was obtained.

Example (3) A fluorine-based film (FEP), the surface of which was 50 μm thick, was subjected to multiple corona discharge treatments, and diluted 10% with ethanol (heat-dried type) in etching lens X-88 manufactured by Taiyo Ink Manufacturing. It was coated to a thickness of 8 μm in the same manner as in Example (1). Next, it was heated in a vacuum chamber at 120°C for 2 minutes, and then treated with DCC glow discharge for 2 minutes.
Copper was coated to a thickness of 1&:IO,o00X by talling.

This was then taken out from the vacuum chamber and 3% NaOH solution f:
The resist ink was sprayed from a nozzle at a pressure of 2ψ to cause it to swell and dissolve, and at the same time, the copper foil provided on the ink was peeled off to obtain the tape electric wire of the present invention.

〔effect〕

As detailed above, according to the method of the present invention, since the conductors constituting the entire circuit on the base film can be deposited by vapor deposition, the thickness can be made extremely thin, and the tape electric wire can be manufactured with excellent dimensional accuracy. Can wander continuously. Therefore, the tape electric wire produced by the method of the present invention is lightweight and inexpensive, making it extremely useful industrially.

Claims (1)

[Claims] The first step is to apply a heat-drying type resist ink to unnecessary parts other than the circuit to be formed on the surface of the plastic film that is the base material, and the vapor-deposited particles are applied to the entire surface of the film coated with the resist ink. energy is 1e
The conductive metal is deposited by physical vapor deposition with a thickness of 300 Å to 5
Production of a tape-shaped electric wire characterized by comprising a second step of adhering it to a thickness of 0,000 Å, and a third step of peeling off the conductive metal and resist ink provided in the parts other than the circuit from the base film. Law.