JPS6163837U - - Google Patents
Info
- Publication number
- JPS6163837U JPS6163837U JP14930284U JP14930284U JPS6163837U JP S6163837 U JPS6163837 U JP S6163837U JP 14930284 U JP14930284 U JP 14930284U JP 14930284 U JP14930284 U JP 14930284U JP S6163837 U JPS6163837 U JP S6163837U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- leads
- semiconductor element
- tie bar
- upper mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14930284U JPS6163837U (pl) | 1984-10-01 | 1984-10-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14930284U JPS6163837U (pl) | 1984-10-01 | 1984-10-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6163837U true JPS6163837U (pl) | 1986-04-30 |
Family
ID=30707487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14930284U Pending JPS6163837U (pl) | 1984-10-01 | 1984-10-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6163837U (pl) |
-
1984
- 1984-10-01 JP JP14930284U patent/JPS6163837U/ja active Pending