JPH01129851U - - Google Patents
Info
- Publication number
- JPH01129851U JPH01129851U JP2518388U JP2518388U JPH01129851U JP H01129851 U JPH01129851 U JP H01129851U JP 2518388 U JP2518388 U JP 2518388U JP 2518388 U JP2518388 U JP 2518388U JP H01129851 U JPH01129851 U JP H01129851U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead frame
- frame
- semiconductor chip
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000003566 sealing material Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Containers, Films, And Cooling For Superconductive Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2518388U JPH01129851U (pl) | 1988-02-29 | 1988-02-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2518388U JPH01129851U (pl) | 1988-02-29 | 1988-02-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01129851U true JPH01129851U (pl) | 1989-09-04 |
Family
ID=31245693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2518388U Pending JPH01129851U (pl) | 1988-02-29 | 1988-02-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01129851U (pl) |
-
1988
- 1988-02-29 JP JP2518388U patent/JPH01129851U/ja active Pending