JPS6161834U - - Google Patents

Info

Publication number
JPS6161834U
JPS6161834U JP1984146501U JP14650184U JPS6161834U JP S6161834 U JPS6161834 U JP S6161834U JP 1984146501 U JP1984146501 U JP 1984146501U JP 14650184 U JP14650184 U JP 14650184U JP S6161834 U JPS6161834 U JP S6161834U
Authority
JP
Japan
Prior art keywords
hole
suction
insertion tube
main body
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984146501U
Other languages
English (en)
Other versions
JPH027468Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984146501U priority Critical patent/JPH027468Y2/ja
Publication of JPS6161834U publication Critical patent/JPS6161834U/ja
Application granted granted Critical
Publication of JPH027468Y2 publication Critical patent/JPH027468Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Tension Adjustment In Filamentary Materials (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
図面は本考案の実施例を示すもので、第１図は
本考案エアーテンシヨン制御装置の一実施例を示
す縦断面図、第２図は第１図における挿通管を分
解した状態を示す縦断面図、第３図は第２図−
線に沿う平断面図、第４図は第２図−線に
沿う平断面図、第５図は本考案装置を使用したボ
ンデイング装置の一例を示す側面略図、第６図は
ボンデイング工程の一例を示す側面略図である。 １……エアーテンシヨン制御装置、２……装置
本体、３……貫通孔、４……吸引孔、５……挿通
管、６……金属線、７……挿通管、９……細孔部
、１１……上部排出口、１２……下部排出口。

Claims (1)

    【実用新案登録請求の範囲】
  1. 装置本体と、該本体を貫通して設けられた貫通
    孔と、該貫通孔に連結して設けられたエアー吸引
    用の吸引孔及び上記貫通孔内をスライド自在に設
    けられた挿通管とから成り、上記挿通管を貫通し
    て金属線挿通用の挿通孔を設け、該挿通孔の略中
    央には孔径が小さく構成された細孔部を形成し、
    挿通孔の細孔部両側には挿通管をスライドさせる
    ことにより、上記吸引孔と連結するエアー排出用
    の排出口を各々形成して成ることを特徴とするエ
    アーテンシヨン制御装置。
JP1984146501U 1984-09-27 1984-09-27 Expired JPH027468Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984146501U JPH027468Y2 (ja) 1984-09-27 1984-09-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984146501U JPH027468Y2 (ja) 1984-09-27 1984-09-27

Publications (2)

Publication Number Publication Date
JPS6161834U true JPS6161834U (ja) 1986-04-25
JPH027468Y2 JPH027468Y2 (ja) 1990-02-22

Family

ID=30704735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984146501U Expired JPH027468Y2 (ja) 1984-09-27 1984-09-27

Country Status (1)

Country Link
JP (1) JPH027468Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011077681A1 (ja) * 2009-12-25 2011-06-30 アダマンド工業株式会社 エアーテンション装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011077681A1 (ja) * 2009-12-25 2011-06-30 アダマンド工業株式会社 エアーテンション装置
EP2518760A4 (en) * 2009-12-25 2014-09-17 Adamant Kogyo Co Air tension apparatus

Also Published As

Publication number Publication date
JPH027468Y2 (ja) 1990-02-22

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