JPS62109452U - - Google Patents
Info
- Publication number
- JPS62109452U JPS62109452U JP1985201286U JP20128685U JPS62109452U JP S62109452 U JPS62109452 U JP S62109452U JP 1985201286 U JP1985201286 U JP 1985201286U JP 20128685 U JP20128685 U JP 20128685U JP S62109452 U JPS62109452 U JP S62109452U
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- wire bonding
- tip
- mirror
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims 1
- 239000011148 porous material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第1図、第2図はそれぞれ本案実施例に係るワ
イヤボンデイング用キヤピラリーを表しており、
第1図は一部破断側面図、第2図は先端部分の拡
大断面図である。第3図は従来の一般的なワイヤ
ボンデイング用キヤピラリーを表す一部破断側面
図、第4図は従来のボトルネツク型ワイヤボンデ
イング用キヤピラリーの先端部分の拡大図である
。 1……ワイヤボンデイング用キヤピラリー、1
a……細孔、2……ボトルネツク型キヤピラリー
。
イヤボンデイング用キヤピラリーを表しており、
第1図は一部破断側面図、第2図は先端部分の拡
大断面図である。第3図は従来の一般的なワイヤ
ボンデイング用キヤピラリーを表す一部破断側面
図、第4図は従来のボトルネツク型ワイヤボンデ
イング用キヤピラリーの先端部分の拡大図である
。 1……ワイヤボンデイング用キヤピラリー、1
a……細孔、2……ボトルネツク型キヤピラリー
。
Claims (1)
- 貫通孔を備え、先端部分が円錐形状をしたワイ
ヤボンデイング用キヤピラリーにおいて、全体を
セラミツクにより形成し外側面の先端を13〜1
9°、内側面の先端角を7〜10°とするととも
に該内側面を鏡面としたことを特徴とするワイヤ
ボンデイング用キヤピラリー。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985201286U JPS62109452U (ja) | 1985-12-26 | 1985-12-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985201286U JPS62109452U (ja) | 1985-12-26 | 1985-12-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62109452U true JPS62109452U (ja) | 1987-07-13 |
Family
ID=31164594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985201286U Pending JPS62109452U (ja) | 1985-12-26 | 1985-12-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62109452U (ja) |
-
1985
- 1985-12-26 JP JP1985201286U patent/JPS62109452U/ja active Pending