JPS6161207B2 - - Google Patents
Info
- Publication number
- JPS6161207B2 JPS6161207B2 JP17226679A JP17226679A JPS6161207B2 JP S6161207 B2 JPS6161207 B2 JP S6161207B2 JP 17226679 A JP17226679 A JP 17226679A JP 17226679 A JP17226679 A JP 17226679A JP S6161207 B2 JPS6161207 B2 JP S6161207B2
- Authority
- JP
- Japan
- Prior art keywords
- gutter
- metal
- solder
- wire assembly
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 35
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 description 28
- 239000010949 copper Substances 0.000 description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 27
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000001816 cooling Methods 0.000 description 8
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Superconductors And Manufacturing Methods Therefor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17226679A JPS5696410A (en) | 1979-12-28 | 1979-12-28 | Method of burying metallic wire assembly in metallic trough with solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17226679A JPS5696410A (en) | 1979-12-28 | 1979-12-28 | Method of burying metallic wire assembly in metallic trough with solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5696410A JPS5696410A (en) | 1981-08-04 |
| JPS6161207B2 true JPS6161207B2 (enrdf_load_stackoverflow) | 1986-12-24 |
Family
ID=15938703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17226679A Granted JPS5696410A (en) | 1979-12-28 | 1979-12-28 | Method of burying metallic wire assembly in metallic trough with solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5696410A (enrdf_load_stackoverflow) |
-
1979
- 1979-12-28 JP JP17226679A patent/JPS5696410A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5696410A (en) | 1981-08-04 |
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