JPS6160262A - Method and device for soldering part - Google Patents

Abstract

PURPOSE:To prevent a solder from adhering to unnecessary parts by holding the unnecessary parts for solding by a metallic radiating jig of high heat conductivity when a connecting terminal such as a plug installed on a printed wiring board is soldered. CONSTITUTION:A plate terminal 12 is inserted into hole 16 formed on a printed wiring board and the terminal end is caulked to connect electrically to a pattern 18 formed on the side of the printed wiring board 10. When the connected part between the pattern 18 and the terminal 12 is soldered, the terminal 12 are soldered by a soldering iron 22 and a soldering stick 24 after the unnecessary parts 12 for soldering is held by a radiating jig 20 of high heat conductivity such as Aluminium. In this case, by fixing radiating jigs 32, 34 (the second) to shafts 36, 38 and transfering to the opposite direction by air cylinders 40, 42 the unnecessary parts for soldering is strongly held and radiated to prevent a molten solder from adhering.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method and apparatus for soldering connection terminals such as plugs attached to parts, particularly printed wiring boards.

[Technical background of the invention and its problems]

Generally, when soldering connection terminals such as plugs to a printed wiring board, the printed wiring board 10 is soldered as shown in the side view of FIG.
It is necessary to fix only the portion where the terminal 12 contacts the four turns of the wiring (not shown) formed on one side surface with the solder 14 (the stippled portion).

On the other hand, conventionally, when the above-mentioned soldering work is performed during an automatic solder material processing process, the parts to be soldered are dipped in a soldering bath, so the same parts as in Fig. 9 are shown with the same reference numbers. As shown in the figure, there was a risk that a portion of the solder 14 would sag downward due to its own weight while solidifying. When a part of the solder 14 hangs down in this way, this hanging part 14' is used to control the height H) between the printed wiring board 10 and the soldered part to a predetermined height.
This required work to remove the filtrate, which resulted in an increase in the number of work steps. .

On the other hand, as shown in FIG. 11, in which the same parts as in FIG.
0, since almost the entire terminal 12 is heated by preheating during the soldering process, some of the solder 14 flows into and adheres to the parts other than the parts to be soldered. Therefore, it became impossible to connect the terminal 12 to the connector, or it became a cause of a connection failure.

[Purpose of the invention]

SUMMARY OF THE INVENTION In view of the above-mentioned problems, it is an object of the present invention to provide a method and apparatus for soldering parts in which solder is prevented from adhering to parts other than the parts to be soldered as much as possible.

[Summary of the Invention] In order to achieve the above-mentioned object, the present invention grips a part of a component other than the part to be soldered with a heat dissipation jig having high thermal conductivity, and then applies solder to the part of the part to be soldered. The above purpose has been achieved by performing the attaching work.

[Embodiments of the invention]

Hereinafter, an embodiment of the component soldering method and six apparatuses according to the present invention will be described in detail.

4 to 6 are a cross-sectional view, a top view, and a bottom view showing parts and printed wiring to which the present invention is applied, respectively, and the same parts as in FIG. 9 are designated by the same reference numerals.

A plate-shaped terminal 12, which is a component in FIG. 4, is fitted through a hole 16 formed in the printed wiring board 10, and one end thereof is crimped, so that the printed wiring board 10 is assembled as shown in FIG. fci4 turns (land) formed on one side of
It is electrically connected to 18.

On the other hand, the caulked part of this terminal 12, that is, the ?J? When soldering the part where the turn 18 and the terminal 12 come into contact, as shown in FIG. It is held in a heat dissipation jig 20 having good thermal conductivity, and then soldering is performed using a soldering iron 22 and a soldering rod 24.

In this way, when the part of the terminal 12 outside the part v to be soldered is held by the heat dissipation jig 20, the heat applied to the terminal 12 by the solder tip 22 will gradually escape from the heat dissipation jig 20, so that the part to be soldered, That is, only the portion where the pattern 18 shown in FIG. 5 and the terminal 12 are in contact is heated, and the solder 14 is attached only there. Therefore, the solder 14 will not adhere to any part other than that v.

Next, FIGS. 2 and 3 are a plan view and an AA sectional view of a soldering device 30 that automatically flanges (grips) the terminal 12 with a heat dissipation jig.

This device 30 includes a pair of heat dissipation jigs 32 and 34 each having a U-shaped cross section, slide shafts 36 and 38 to which each of the heat dissipation jigs 32 and 34 is fixed, and this slide shaft 36.
．． 38 in mutually opposite directions. Note that the slide shaft 36.38 and the air cylinder 40.42 constitute means for moving the heat dissipation jig 32.34. Furthermore, the heat dissipation jigs 32 and 34 are arranged so as to mesh with each other alternately, and the material of the heat dissipation jig 2 shown in FIG.
0, it goes without saying that it is made of a material with good heat dissipation, such as iron or aluminum. In addition, the reference numeral 44 in FIG. 2 is a bearing that supports the ride shaft 40, 42 mentioned above.

Next, the operation of the device 30 described above will be explained, and the configuration will also be explained in detail.

As shown in FIG. 2, the air cylinders 740.42 are operated to provide a spacing S between the heat dissipation jigs 32 and 34 that engage with each other. After that, the printed wiring board 10 to which the terminals 12 are temporarily attached is placed with the part to be soldered facing upward, and the distance S is
Insert the terminal 12 inside. And air cylinder 40
．． 42 to move the slide shafts 36.38 in the directions of arrows B and C, respectively, the portions of the terminals 12 other than the portions to be soldered will be clamped by the heat dissipation jig 32.34. In this way, when soldering is performed after the terminals 12 are clamped by the heat dissipation jigs 32 and 34, solder will adhere only to the parts to be soldered due to the heat dissipation action of the heat dissipation jigs 32 and 34. .

Next, FIGS. 7 and 8 are a plan view and a DD cross-sectional view of a soldering device 50 that performs a large amount of soldering work using the basic operation of the soldering device 300 shown in FIG. The same parts as in FIG. 2 are designated by the same reference numerals.

In this soldering device 50, a pair of plates 52.5
A guide shaft 56.58 is arranged to extend between the guide shaft 56.58 and the slide shaft 36.58.
38 are arranged. Note that each slide shaft 36.
Needless to say, air cylinders 40 and 42 are connected to the ends of the cylinders 38, respectively. On the other hand, a plurality of pairs of heat dissipation jigs 60 and 62 are disposed on the slide shafts 36, 38 and the guide shafts 56, 58, which face each other. Each of the heat radiation jigs 60 and 62 has a U-shaped tip, and the guide shafts 56 and 58 and the slide shaft 3.
6.38 respectively, and are arranged so as to be slidable with respect to the shafts 56.58 and slide shafts 36.38.6 Furthermore, these heat dissipation jigs 60, 62 are fitted and positioned on the slide shafts 36.38. It is always biased in one direction by coil springs 64 and 66. In addition, slide 9 @
At predetermined positions 36 and 38, circlips 68 and 70 for positioning the heat radiation jig 60 and 62 and the coil springs 64 and 66 are supported. Reference numeral 72 denotes a support stand disposed between the slide shafts 36 and 38, and this support stand 72 positions and supports the printed wiring board 10. Reference numeral 74 denotes bearings that slidably support the heat dissipation jigs 62 and 66 relative to the guide shafts 56 and 58 and the slide shafts 36 and 38, respectively.

Next, the operation of the soldering device 50 described above will be explained, and the configuration will also be explained in detail.

As shown in FIG. 7, the air cylinders 40 and 42 are operated to provide a spacing S between the heat dissipation jigs 60 and 62 that engage with each other. Thereafter, the printed wiring board 10 with the terminals 12 temporarily attached thereto is placed on the support stand 10 with the part to be soldered facing upward, the terminals 12 being inserted within the interval S. And air cylinder 40.42
When the slide shafts 36 and 38 are moved in the directions of arrows B and C, the portions of the terminals 12 other than the portions to be soldered are clamped by the heat radiation jigs 60 and 62. Note that when the terminal 12 is clamped by the heat radiation jigs 60 and 62, the heat radiation jigs 60 and 62 are biased in one direction by the coil springs 64 and 66, so the terminal 12 is biased by the coil springs 64 and 66. It will be clamped by the urging force of.

In this way, when soldering work is performed after the terminals 12 are clamped by the heat dissipation jigs 60 and 62, each heat dissipation jig 6
Due to the heat dissipation effect of 0.62, the solder 14 (FIG. 1) adheres only to the portion to be soldered, and a large amount of soldering work is processed by the soldering device 50 at one time.

In the above embodiment, the support stand 72 is arranged between the slide shafts 36, 38 for each heat dissipation jig 60, 62, but the terminals 12 and printed wiring board 10 are placed between the slide shafts 36, 38,
After being clamped to 62, the support base 72 is not necessarily required because it is positioned at that position.

〔Effect of the invention〕

In this invention, when performing soldering work, parts other than the part to be soldered are held by a heat dissipation jig with good thermal conductivity, so that the part to be soldered υ
The temperature of the outside parts does not rise, and therefore the solder can be applied only to the parts to be soldered. In addition, especially when using terminals that fit into connectors as parts, solder will only adhere to the parts to be soldered.
Solder does not adhere to the fitting portion of the terminal to be fitted into the connector, and therefore good electrical connection characteristics between the connector and the terminal can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the soldering method of the present invention, FIG. 2 is a plan view showing the soldering apparatus of the present invention, FIG. 3 is a sectional view taken along line AA in FIG. 2, and FIGS. 4 to 6 are respectively 7 is a plan view showing another embodiment of the soldering device according to the present invention, FIG. 8 is a DD sectional view of FIG. 7, and FIGS. FIG. 11 is a side view of each component showing the soldered state of each component. DESCRIPTION OF SYMBOLS 10... Printed wiring board, 12... Terminal, 20, 32° 34.60.62... Heat radiation jig, 36, 38... Slide shaft, 40.42... Air cylinder. Representative Patent Attorney Kensuke Norichika (and 1 other person) QA-

Claims (3)

[Claims] (1) A component characterized in that a portion of the component other than the portion to be soldered is held with a heat dissipation jig having high thermal conductivity, and then soldering work is performed on the soldered portion of the component. Soldering method. (2) Heat dissipation jigs with high thermal conductivity are placed facing each other in positions where they engage with each other, and a moving means is provided for engaging these heat dissipation jigs, and the components are soldered by this moving means. A part soldering apparatus characterized in that parts other than the parts to be soldered are held between the heat dissipation jigs. (3) The moving means is a slide shaft that supports the heat dissipation jig, and an air cylinder that is connected to one end of the slide shaft and moves the slide shaft in the thrust direction of the shaft. A soldering device for the components described in item (2) of the scope.